Abstract:
The invention relates to a method of repairing crystal defects buried within a specimen (10) deriving from a semiconductor device. This specimen (10) is prepared by the use of a focused ion beam that has caused said defects. The method consists in subjecting the specimen (10) to a laser annealing operation, the laser (12) having a power low enough not to melt the semiconductor material of the specimen (10) but high enough to eliminate the defects.Application to the preparation of specimens that have to be analysed by electron microscopy.