公开(公告)号：US20140073130A1

公开(公告)日：2014-03-13

申请号：US13613579

申请日：2012-09-13

申请人： David F. Hilscher ,  Christian Lavoie ,  Ahmet S. Ozcan

发明人： David F. Hilscher ,  Christian Lavoie ,  Ahmet S. Ozcan

IPC分类号： H01L21/3205

CPC分类号： H01L21/28518 ,  H01L21/28052 ,  H01L29/665 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of performing a silicide contact process comprises a forming a nickel-platinum alloy (NiPt) layer over a semiconductor device structure; performing a first rapid thermal anneal (RTA) so as to react portions of the NiPt layer in contact with semiconductor regions of the semiconductor device structure, thereby forming metal rich silicide regions; performing a first wet etch to remove at least a nickel constituent of unreacted portions of the NiPt layer; performing a second wet etch using a dilute Aqua Regia treatment comprising nitric acid (HNO3), hydrochloric acid (HCl) and water (H2O) to remove any residual platinum material from the unreacted portions of the NiPt layer; and following the dilute Aqua Regia treatment, performing a second RTA to form final silicide contact regions from the metal rich silicide regions.

摘要翻译： 执行硅化物接触工艺的方法包括在半导体器件结构上形成镍 - 铂合金（NiPt）层; 执行第一快速热退火（RTA），以使NiPt层的与半导体器件结构的半导体区域接触的部分反应，由此形成富金属硅化物区域; 执行第一湿蚀刻以去除至少NiPt层的未反应部分的镍组分; 使用包含硝酸（HNO 3），盐酸（HCl）和水（H 2 O）的稀释Aqua Regia处理进行第二次湿蚀刻以从NiPt层的未反应部分去除任何残余的铂材料; 并且在稀释的Aqua Regia处理之后，执行第二个RTA从富金属硅化物区形成最终的硅化物接触区。

公开(公告)号：US08835309B2

公开(公告)日：2014-09-16

申请号：US13613579

申请日：2012-09-13

申请人： David F. Hilscher ,  Christian Lavoie ,  Ahmet S. Ozcan

发明人： David F. Hilscher ,  Christian Lavoie ,  Ahmet S. Ozcan

IPC分类号： H01L21/4763 ,  H01L21/44 ,  H01L31/00 ,  H01L23/48

CPC分类号： H01L21/28518 ,  H01L21/28052 ,  H01L29/665 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of performing a silicide contact process comprises a forming a nickel-platinum alloy (NiPt) layer over a semiconductor device structure; performing a first rapid thermal anneal (RTA) so as to react portions of the NiPt layer in contact with semiconductor regions of the semiconductor device structure, thereby forming metal rich silicide regions; performing a first wet etch to remove at least a nickel constituent of unreacted portions of the NiPt layer; performing a second wet etch using a dilute Aqua Regia treatment comprising nitric acid (HNO3), hydrochloric acid (HCl) and water (H2O) to remove any residual platinum material from the unreacted portions of the NiPt layer; and following the dilute Aqua Regia treatment, performing a second RTA to form final silicide contact regions from the metal rich silicide regions.

摘要翻译： 执行硅化物接触工艺的方法包括在半导体器件结构上形成镍 - 铂合金（NiPt）层; 执行第一快速热退火（RTA），以使NiPt层的与半导体器件结构的半导体区域接触的部分反应，由此形成富金属硅化物区域; 执行第一湿蚀刻以去除至少NiPt层的未反应部分的镍组分; 使用包含硝酸（HNO 3），盐酸（HCl）和水（H 2 O）的稀释Aqua Regia处理进行第二次湿蚀刻以从NiPt层的未反应部分去除任何残余的铂材料; 并且在稀释的Aqua Regia处理之后，执行第二个RTA从富金属硅化物区形成最终的硅化物接触区。

公开(公告)号：US08652963B2

公开(公告)日：2014-02-18

申请号：US13237732

申请日：2011-09-20

申请人： Bin Yang ,  Christian Lavoie ,  Emre Alptekin ,  Ahmet S. Ozcan ,  Cung D. Tran ,  Mark Raymond

发明人： Bin Yang ,  Christian Lavoie ,  Emre Alptekin ,  Ahmet S. Ozcan ,  Cung D. Tran ,  Mark Raymond

IPC分类号： H01L21/44

CPC分类号： H01L29/665 ,  H01L21/28518 ,  H01L29/6659 ,  H01L29/7833

摘要： An MOSFET device having a Silicide layer of uniform thickness, and methods for its fabrication, are provided. One such method involves depositing a metal layer over wide and narrow contact trenches on the surface of a silicon semiconductor substrate. Upon formation of a uniformly thin amorphous intermixed alloy layer at the metal/silicon interface, the excess (unreacted) metal is removed. The device is annealed to facilitate the formation of a thin silicide layer on the substrate surface which exhibits uniform thickness at the bottoms of both wide and narrow contact trenches.

摘要翻译： 提供具有均匀厚度的硅化物层的MOSFET器件及其制造方法。 一种这样的方法包括在硅半导体衬底的表面上的宽且窄的接触沟槽上沉积金属层。 在金属/硅界面处形成均匀薄的无定形混合合金层时，除去过量的（未反应的）金属。 该器件被退火以促进在衬底表面上形成薄的硅化物层，其在宽和窄接触沟槽的底部显示均匀的厚度。

公开(公告)号：US08456011B2

公开(公告)日：2013-06-04

申请号：US13006664

申请日：2011-01-14

申请人： Christian Lavoie ,  Ahmet S. Ozcan ,  Zhen Zhang ,  Bin Yang

发明人： Christian Lavoie ,  Ahmet S. Ozcan ,  Zhen Zhang ,  Bin Yang

IPC分类号： H01L23/532

CPC分类号： H01L21/768 ,  H01L21/28518 ,  H01L23/485 ,  H01L29/456 ,  H01L29/66545 ,  H01L29/66575 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of forming a metal semiconductor alloy that includes forming an intermixed metal semiconductor region to a first depth of a semiconductor substrate without thermal diffusion. The intermixed metal semiconductor region is annealed to form a textured metal semiconductor alloy. A second metal layer is formed on the textured metal semiconductor alloy. The second metal layer on the textured metal semiconductor alloy is then annealed to form a metal semiconductor alloy contact, in which metal elements from the second metal layer are diffused through the textured metal semiconductor alloy to provide a templated metal semiconductor alloy. The templated metal semiconductor alloy includes a grain size that is greater than 2× for the metal semiconductor alloy, which has a thickness ranging from 15 nm to 50 nm.

公开(公告)号：US08278200B2

公开(公告)日：2012-10-02

申请号：US13012043

申请日：2011-01-24

申请人： Christian Lavoie ,  Tak H. Ning ,  Ahmet S. Ozcan ,  Bin Yang ,  Zhen Zhang

发明人： Christian Lavoie ,  Tak H. Ning ,  Ahmet S. Ozcan ,  Bin Yang ,  Zhen Zhang

IPC分类号： H01L21/20

CPC分类号： H01L21/28518

摘要： In one exemplary embodiment, a program storage device readable by a machine, tangibly embodying a program of instructions executable by the machine for performing operations, said operations including: depositing a first layer having a first metal on a surface of a semiconductor structure, where depositing the first layer creates a first intermix region at an interface of the first layer and the semiconductor structure; removing a portion of the deposited first layer to expose the first intermix region; depositing a second layer having a second metal on the first intermix region, where depositing the second layer creates a second intermix region at an interface of the second layer and the first intermix region; removing a portion of the deposited second layer to expose the second intermix region; and performing at least one anneal on the semiconductor structure.

摘要翻译： 在一个示例性实施例中，一种可由机器读取的程序存储设备，其有形地体现了可由机器执行的用于执行操作的指令程序，所述操作包括：在半导体结构的表面上沉积具有第一金属的第一层， 第一层在第一层和半导体结构的界面处形成第一混合区; 去除沉积的第一层的一部分以暴露第一混合区; 在所述第一混合区域上沉积具有第二金属的第二层，其中沉积所述第二层在所述第二层和所述第一混合区的界面处产生第二混合区; 去除沉积的第二层的一部分以暴露第二混合区; 以及在所述半导体结构上执行至少一个退火。

公开(公告)号：US20110062525A1

公开(公告)日：2011-03-17

申请号：US12560585

申请日：2009-09-16

申请人： Christian Lavoie ,  Viorel C. Ontalus ,  Ahmet S. Ozcan

发明人： Christian Lavoie ,  Viorel C. Ontalus ,  Ahmet S. Ozcan

IPC分类号： H01L27/092 ,  H01L21/8238

CPC分类号： H01L21/28 ,  H01L21/823807 ,  H01L21/823814 ,  H01L21/823864 ,  H01L29/7848

摘要： A method forms an integrated circuit structure. The method patterns a protective layer over a first-type field effect transistor and removes a stress liner from above a second-type field effect transistors. Then, the method removes a first-type silicide layer from source and drain regions of the second-type field effect transistor, but leaves at least a portion of the first-type silicide layer on the gate conductor of the second-type field effect transistor. The method forms a second-type silicide layer on the gate conductor and the source and drain regions of the second-type field effect transistor. The second-type silicide layer that is formed is different than the first-type silicide layer. For example, the first-type silicide layer and the second-type silicide layer can comprise different materials, different thicknesses, different crystal orientations, and/or different chemical phases, etc.

摘要翻译： 一种方法形成集成电路结构。 该方法在第一类场效应晶体管上形成保护层，并从第二种场效应晶体管上方去除应力衬垫。 然后，该方法从第二类型场效应晶体管的源极区和漏极区去除第一类型的硅化物层，但是将第一类型硅化物层的至少一部分留在第二类型场效应晶体管的栅极导体上 。 该方法在栅极导体和第二类场效应晶体管的源极和漏极区域上形成第二类型的硅化物层。 所形成的第二类硅化物层与第一型硅化物层不同。 例如，第一型硅化物层和第二类型硅化物层可以包括不同的材料，不同的厚度，不同的晶体取向和/或不同的化学相等。

公开(公告)号：US20120190192A1

公开(公告)日：2012-07-26

申请号：US13012043

申请日：2011-01-24

申请人： Christian Lavoie ,  Tak H. Ning ,  Ahmet S. Ozcan ,  Bin Yang ,  Zhen Zhang

发明人： Christian Lavoie ,  Tak H. Ning ,  Ahmet S. Ozcan ,  Bin Yang ,  Zhen Zhang

IPC分类号： H01L21/44

CPC分类号： H01L21/28518

摘要： In one exemplary embodiment, a program storage device readable by a machine, tangibly embodying a program of instructions executable by the machine for performing operations, said operations including: depositing a first layer having a first metal on a surface of a semiconductor structure, where depositing the first layer creates a first intermix region at an interface of the first layer and the semiconductor structure; removing a portion of the deposited first layer to expose the first intermix region; depositing a second layer having a second metal on the first intermix region, where depositing the second layer creates a second intermix region at an interface of the second layer and the first intermix region; removing a portion of the deposited second layer to expose the second intermix region; and performing at least one anneal on the semiconductor structure.

公开(公告)号：US20120181697A1

公开(公告)日：2012-07-19

申请号：US13006664

申请日：2011-01-14

申请人： Christian Lavoie ,  Ahmet S. Ozcan ,  Zhen Zhang ,  Bin Yang

发明人： Christian Lavoie ,  Ahmet S. Ozcan ,  Zhen Zhang ,  Bin Yang

IPC分类号： H01L23/532 ,  H01L21/768

CPC分类号： H01L21/768 ,  H01L21/28518 ,  H01L23/485 ,  H01L29/456 ,  H01L29/66545 ,  H01L29/66575 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of forming a metal semiconductor alloy that includes forming an intermixed metal semiconductor region to a first depth of a semiconductor substrate without thermal diffusion. The intermixed metal semiconductor region is annealed to form a textured metal semiconductor alloy. A second metal layer is formed on the textured metal semiconductor alloy. The second metal layer on the textured metal semiconductor alloy is then annealed to form a metal semiconductor alloy contact, in which metal elements from the second metal layer are diffused through the textured metal semiconductor alloy to provide a templated metal semiconductor alloy. The templated metal semiconductor alloy includes a grain size that is greater than 2× for the metal semiconductor alloy, which has a thickness ranging from 15 nm to 50 nm.

摘要翻译： 一种形成金属半导体合金的方法，其包括在半导体衬底的第一深度上形成混合金属半导体区域而没有热扩散。 将混合后的金属半导体区域退火以形成织构化的金属半导体合金。 在纹理金属半导体合金上形成第二金属层。 纹理金属半导体合金上的第二金属层然后退火以形成金属半导体合金接触，其中来自第二金属层的金属元素通过织构化金属半导体合金扩散以提供模板化的金属半导体合金。 模板化金属半导体合金的厚度范围为15nm〜50nm的金属半导体合金的晶粒尺寸大于2×。

公开(公告)号：US08021971B2

公开(公告)日：2011-09-20

申请号：US12611946

申请日：2009-11-04

申请人： Anthony G. Domenicucci ,  Christian Lavoie ,  Ahmet S. Ozcan

发明人： Anthony G. Domenicucci ,  Christian Lavoie ,  Ahmet S. Ozcan

IPC分类号： H01L21/3205 ,  H01L29/861

CPC分类号： H01L29/7833 ,  H01L21/28052 ,  H01L21/28114 ,  H01L29/42376 ,  H01L29/66507 ,  H01L29/6653 ,  H01L29/6659

摘要： An integrated circuit is provided including a narrow gate stack having a width less than or equal to 65 nm, including a silicide region comprising Pt segregated in a region of the silicide away from the top surface of the silicide and towards an lower portion defined by a pulldown height of spacers on the sidewalls of the gate conductor. In a preferred embodiment, the spacers are pulled down prior to formation of the silicide. The silicide is first formed by a formation anneal, at a temperature in the range 250° C. to 450° C. Subsequently, a segregation anneal at a temperature in the range 450° C. to 550° C. The distribution of the Pt along the vertical length of the silicide layer has a peak Pt concentration within the segregated region, and the segregated Pt region has a width at half the peak Pt concentration that is less than 50% of the distance between the top surface of the silicide layer and the pulldown spacer height.

摘要翻译： 提供了一种集成电路，其包括具有小于或等于65nm的宽度的窄栅极堆叠，其包括硅化物区域，该硅化物区域包含偏离硅化物的区域的硅离子，所述硅化物区域远离硅化物的顶表面并朝向由硅化物的顶表面限定的下部分 在栅极导体的侧壁上的间隔物的下拉高度。 在优选实施例中，在形成硅化物之前，将间隔物拉下。 硅化物首先通过在250℃至450℃的温度下的地层退火形成。随后，在450℃至550℃的温度下进行偏析退火.Pt 沿着硅化物层的垂直长度在分离区域内具有峰值Pt浓度，并且偏析的Pt区域的峰值Pt浓度的一半的宽度小于硅化物层的顶表面与硅化物层的顶表面之间的距离的50％ 下拉垫片高度。

公开(公告)号：US20110101472A1

公开(公告)日：2011-05-05

申请号：US12611946

申请日：2009-11-04

申请人： Anthony G. Domenicucci ,  Christian Lavoie ,  Ahmet S. Ozcan

发明人： Anthony G. Domenicucci ,  Christian Lavoie ,  Ahmet S. Ozcan

IPC分类号： H01L29/49 ,  H01L21/28

CPC分类号： H01L29/7833 ,  H01L21/28052 ,  H01L21/28114 ,  H01L29/42376 ,  H01L29/66507 ,  H01L29/6653 ,  H01L29/6659

摘要： An integrated circuit is provided including a narrow gate stack having a width less than or equal to 65 nm, including a silicide region comprising Pt segregated in a region of the silicide away from the top surface of the silicide and towards an lower portion defined by a pulldown height of spacers on the sidewalls of the gate conductor. In a preferred embodiment, the spacers are pulled down prior to formation of the silicide. The silicide is first formed by a formation anneal, at a temperature in the range 250° C. to 450° C. Subsequently, a segregation anneal at a temperature in the range 450° C. to 550° C. The distribution of the Pt along the vertical length of the silicide layer has a peak Pt concentration within the segregated region, and the segregated Pt region has a width at half the peak Pt concentration that is less than 50% of the distance between the top surface of the silicide layer and the pulldown spacer height.

摘要翻译： 提供了一种集成电路，其包括具有小于或等于65nm的宽度的窄栅极堆叠，其包括硅化物区域，该硅化物区域包含偏离硅化物的区域的硅离子，所述硅化物区域远离硅化物的顶表面并朝向由硅化物的顶表面限定的下部分 在栅极导体的侧壁上的间隔物的下拉高度。 在优选实施例中，在形成硅化物之前，将间隔物拉下。 硅化物首先通过在250℃至450℃的温度下的地层退火形成。随后，在450℃至550℃的温度下进行偏析退火.Pt 沿着硅化物层的垂直长度在分离区域内具有峰值Pt浓度，并且偏析的Pt区域的峰值Pt浓度的一半的宽度小于硅化物层的顶表面与硅化物层的顶表面之间的距离的50％ 下拉垫片高度。