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公开(公告)号：US10335476B2
公开(公告)日：2019-07-02
申请号：US14919494
申请日：2015-10-21
申请人： Sunil Thomas , David H. Walker
发明人： Sunil Thomas , David H. Walker
摘要： Certain embodiments are direct to a vaccine composition comprising an immunizing amount of an Ehrlichia sonicate, wherein the Ehrlichia sonicate elicits a protective physiologic response. In certain aspects the Ehrlichia is one or more of E. canis, E. chaffeensis, E. muris, E. ruminantium, E. ewingii, and E. ovis.
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公开(公告)号：US08685406B2
公开(公告)日：2014-04-01
申请号：US12927220
申请日：2010-11-10
申请人： David H. Walker , Sunil Thomas
发明人： David H. Walker , Sunil Thomas
CPC分类号： G01N33/56911 , A61K38/00 , A61K39/0233 , A61K2039/6081 , C07K14/29 , C07K16/1246 , C07K2317/34 , Y02A50/403
摘要： The present invention provides an isolated and purified heat shock protein 60 (Hsp60) peptide having the amino acid sequence of SEQ ID NO:2. The instant invention is also directed to a vaccine against Ehrlichia comprising a peptide homologous to the amino acid sequence of SEQ ID NO:2. The instant invention is also directed to an antibody directed against a peptide homologous to the amino acid sequence of SEQ ID NO:2. The instant invention is also directed to a method of determining whether a subject is infected with Ehrlichia, comprising the steps of: contacting a sample from a subject with the antibody described herein; and detecting a resulting antibody reaction, wherein a positive reaction indicates the subject is infected with Ehrlichia.
摘要翻译： 本发明提供了具有SEQ ID NO：2的氨基酸序列的分离和纯化的热休克蛋白60（Hsp60）肽。 本发明还涉及包含与SEQ ID NO：2的氨基酸序列同源的肽的抗埃利亚氏疫苗。 本发明还涉及针对与SEQ ID NO：2的氨基酸序列同源的肽的抗体。 本发明还涉及一种确定受试者是否感染埃里希氏菌的方法，包括以下步骤：使来自受试者的样品与本文所述的抗体接触; 并检测所得的抗体反应，其中阳性反应表明受试者被埃里希氏杆菌感染。
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公开(公告)号：US20120219972A1
公开(公告)日：2012-08-30
申请号：US13362765
申请日：2012-01-31
申请人： Sunil Thomas , David H. Walker
发明人： Sunil Thomas , David H. Walker
CPC分类号： C07K16/1246 , C07K14/29 , G01N33/56911 , G01N2333/29
摘要： The present invention provides an isolated Ehrlichia peptide and therapeutic and diagnostic uses therefor.
摘要翻译： 本发明提供了一种分离的埃里希肽及其治疗和诊断用途。
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公开(公告)号：US09151755B2
公开(公告)日：2015-10-06
申请号：US14174815
申请日：2014-02-06
申请人： David H. Walker , Sunil Thomas
发明人： David H. Walker , Sunil Thomas
CPC分类号： G01N33/56911 , A61K38/00 , A61K39/0233 , A61K2039/6081 , C07K14/29 , C07K16/1246 , C07K2317/34 , Y02A50/403
摘要： The present invention provides an isolated and purified heat shock protein 60 (Hsp60) peptide having the amino acid sequence of SEQ ID NO:2. The instant invention is also directed to a vaccine against Ehrlichia comprising a peptide homologous to the amino acid sequence of SEQ ID NO:2. The instant invention is also directed to an antibody directed against a peptide homologous to the amino acid sequence of SEQ ID NO:2. The instant invention is also directed to a method of determining whether a subject is infected with Ehrlichia, comprising the steps of: contacting a sample from a subject with the antibody described herein; and detecting a resulting antibody reaction, wherein a positive reaction indicates the subject is infected with Ehrlichia.
摘要翻译： 本发明提供了具有SEQ ID NO：2的氨基酸序列的分离和纯化的热休克蛋白60（Hsp60）肽。 本发明还涉及包含与SEQ ID NO：2的氨基酸序列同源的肽的抗埃利亚氏疫苗。 本发明还涉及针对与SEQ ID NO：2的氨基酸序列同源的肽的抗体。 本发明还涉及一种确定受试者是否感染埃里希氏菌的方法，包括以下步骤：使来自受试者的样品与本文所述的抗体接触; 并检测所得的抗体反应，其中阳性反应表明受试者被埃里希氏杆菌感染。
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公开(公告)号：US09568473B2
公开(公告)日：2017-02-14
申请号：US14851747
申请日：2015-09-11
申请人： David H. Walker , Sunil Thomas
发明人： David H. Walker , Sunil Thomas
CPC分类号： G01N33/56911 , A61K38/00 , A61K39/0233 , A61K2039/6081 , C07K14/29 , C07K16/1246 , C07K2317/34 , Y02A50/403
摘要： The present invention provides an isolated and purified heat shock protein 60 (Hsp60) peptide having the amino acid sequence of SEQ ID NO:2. The instant invention is also directed to a vaccine against Ehrlichia comprising a peptide homologous to the amino acid sequence of SEQ ID NO:2. The instant invention is also directed to an antibody directed against a peptide homologous to the amino acid sequence of SEQ ID NO:2. The instant invention is also directed to a method of determining whether a subject is infected with Ehrlichia, comprising the steps of: contacting a sample from a subject with the antibody described herein; and detecting a resulting antibody reaction, wherein a positive reaction indicates the subject is infected with Ehrlichia.
摘要翻译： 本发明提供了具有SEQ ID NO：2的氨基酸序列的分离和纯化的热休克蛋白60（Hsp60）肽。 本发明还涉及包含与SEQ ID NO：2的氨基酸序列同源的肽的抗埃利亚氏疫苗。 本发明还涉及针对与SEQ ID NO：2的氨基酸序列同源的肽的抗体。 本发明还涉及一种确定受试者是否感染埃里希氏菌的方法，包括以下步骤：使来自受试者的样品与本文所述的抗体接触; 并检测所得的抗体反应，其中阳性反应表明受试者被埃里希氏杆菌感染。
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公开(公告)号：US20140273026A1
公开(公告)日：2014-09-18
申请号：US14174815
申请日：2014-02-06
申请人： David H. Walker , Sunil Thomas
发明人： David H. Walker , Sunil Thomas
IPC分类号： G01N33/569 , C07K14/29 , C07K16/12
CPC分类号： G01N33/56911 , A61K38/00 , A61K39/0233 , A61K2039/6081 , C07K14/29 , C07K16/1246 , C07K2317/34 , Y02A50/403
摘要： The present invention provides an isolated and purified heat shock protein 60 (Hsp60) peptide having the amino acid sequence of SEQ ID NO:2. The instant invention is also directed to a vaccine against Ehrlichia comprising a peptide homologous to the amino acid sequence of SEQ ID NO:2. The instant invention is also directed to an antibody directed against a peptide homologous to the amino acid sequence of SEQ ID NO:2. The instant invention is also directed to a method of determining whether a subject is infected with Ehrlichia, comprising the steps of: contacting a sample from a subject with the antibody described herein; and detecting a resulting antibody reaction, wherein a positive reaction indicates the subject is infected with Ehrlichia.
摘要翻译： 本发明提供了具有SEQ ID NO：2的氨基酸序列的分离和纯化的热休克蛋白60（Hsp60）肽。 本发明还涉及包含与SEQ ID NO：2的氨基酸序列同源的肽的抗埃利亚氏疫苗。 本发明还涉及针对与SEQ ID NO：2的氨基酸序列同源的肽的抗体。 本发明还涉及一种确定受试者是否感染埃里希氏菌的方法，包括以下步骤：使来自受试者的样品与本文所述的抗体接触; 并检测所得的抗体反应，其中阳性反应表明受试者被埃里希氏杆菌感染。
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公开(公告)号：US08492103B2
公开(公告)日：2013-07-23
申请号：US13362765
申请日：2012-01-31
申请人： Sunil Thomas , David H. Walker
发明人： Sunil Thomas , David H. Walker
CPC分类号： C07K16/1246 , C07K14/29 , G01N33/56911 , G01N2333/29
摘要： The present invention provides an isolated Ehrlichia peptide and therapeutic and diagnostic uses therefor.
摘要翻译： 本发明提供了一种分离的埃里希肽及其治疗和诊断用途。
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公开(公告)号：US20110117130A1
公开(公告)日：2011-05-19
申请号：US12927220
申请日：2010-11-10
申请人： David H. Walker , Sunil Thomas
发明人： David H. Walker , Sunil Thomas
CPC分类号： G01N33/56911 , A61K38/00 , A61K39/0233 , A61K2039/6081 , C07K14/29 , C07K16/1246 , C07K2317/34 , Y02A50/403
摘要： The present invention provides an isolated and purified heat shock protein 60 (Hsp60) peptide having the amino acid sequence of SEQ ID NO:2. The instant invention is also directed to a vaccine against Ehrlichia comprising a peptide homologous to the amino acid sequence of SEQ ID NO:2. The instant invention is also directed to an antibody directed against a peptide homologous to the amino acid sequence of SEQ ID NO:2. The instant invention is also directed to a method of determining whether a subject is infected with Ehrlichia, comprising the steps of: contacting a sample from a subject with the antibody described herein; and detecting a resulting antibody reaction, wherein a positive reaction indicates the subject is infected with Ehrlichia.
摘要翻译： 本发明提供了具有SEQ ID NO：2的氨基酸序列的分离和纯化的热休克蛋白60（Hsp60）肽。 本发明还涉及包含与SEQ ID NO：2的氨基酸序列同源的肽的抗埃利亚氏疫苗。 本发明还涉及针对与SEQ ID NO：2的氨基酸序列同源的肽的抗体。 本发明还涉及一种确定受试者是否感染埃里希氏菌的方法，包括以下步骤：使来自受试者的样品与本文所述的抗体接触; 并检测所得的抗体反应，其中阳性反应表明受试者被埃里希氏杆菌感染。
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公开(公告)号：US20080093689A1
公开(公告)日：2008-04-24
申请号：US11963585
申请日：2007-12-21
申请人： Sunil Thomas
发明人： Sunil Thomas
IPC分类号： H01L29/84
CPC分类号： B81B7/0077 , A43B3/0026 , B81B2201/042 , B81B2207/012 , B81B2207/098 , B81C1/00301 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2924/00014 , H01L2924/01322 , H01L2924/14 , H01L2924/15787 , H01L2924/00 , H01L2224/05599
摘要： A low-cost ceramic package, in land-grid array or ball-grid array configuration, for micromechanical components is fabricated by coating the whole integrated circuits wafer with a protective material, selectively etching the coating for solder ball attachment, singulating the chips, flip-chip assembling a chip onto the opening of a ceramic substrate, underfilling the gaps between the solder joints with a polymeric encapsulant, removing the protective material form the components, and attaching a lid to the substrate for sealing the package. It is an aspect of the present invention to be applicable to a variety of different semiconductor micromechanical devices, for instance actuators, motors, sensors, spatial light modulators, and deformable mirror devices. In all applications, the invention achieves technical advantages as well as significant cost reduction and yield increase.
摘要翻译： 通过用保护材料涂覆整个集成电路晶片来制造用于微机电部件的陆地电网阵列或球栅阵列配置的低成本陶瓷封装，选择性地蚀刻用于焊球附着的涂层，切割芯片，翻转 将芯片组装到陶瓷基板的开口上，用聚合物密封剂填充焊料接头之间的间隙，从组件中除去保护材料，并将盖子附着到基板上以密封封装。 本发明的一个方面可应用于各种不同的半导体微机械装置，例如致动器，马达，传感器，空间光调制器和可变形反射镜装置。 在所有应用中，本发明实现了技术优点以及显着的成本降低和产量增加。
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公开(公告)号：US07763975B2
公开(公告)日：2010-07-27
申请号：US11963585
申请日：2007-12-21
申请人： Sunil Thomas
发明人： Sunil Thomas
IPC分类号： H01L23/48
CPC分类号： B81B7/0077 , A43B3/0026 , B81B2201/042 , B81B2207/012 , B81B2207/098 , B81C1/00301 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2924/00014 , H01L2924/01322 , H01L2924/14 , H01L2924/15787 , H01L2924/00 , H01L2224/05599
摘要： A low-cost ceramic package, in land-grid array or ball-grid array configuration, for micromechanical components is fabricated by coating the whole integrated circuits wafer with a protective material, selectively etching the coating for solder ball attachment, singulating the chips, flip-chip assembling a chip onto the opening of a ceramic substrate, under filling the gaps between the solder joints with a polymeric encapsulant, removing the protective material form the components, and attaching a lid to the substrate for sealing the package. It is an aspect of the present invention to be applicable to a variety of different semiconductor micromechanical devices, for instance actuators, motors, sensors, spatial light modulators, and deformable mirror devices. In all applications, the invention achieves technical advantages as well as significant cost reduction and yield increase.
摘要翻译： 通过用保护材料涂覆整个集成电路晶片来制造用于微机电部件的陆地电网阵列或球栅阵列配置的低成本陶瓷封装，选择性地蚀刻用于焊球附着的涂层，切割芯片，翻转 将芯片组装在陶瓷基板的开口上，用聚合物密封剂填充焊点之间的间隙，从组件中移除保护材料，并将盖子附接到基板上以密封封装。 本发明的一个方面可应用于各种不同的半导体微机械装置，例如致动器，马达，传感器，空间光调制器和可变形反射镜装置。 在所有应用中，本发明实现了技术优点以及显着的成本降低和产量增加。
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