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公开(公告)号：US20190229415A1
公开(公告)日：2019-07-25
申请号：US16370987
申请日：2019-03-30
摘要： An apparatus includes a first integrated circuit (IC) that includes a first radio-frequency (RF) circuit to process RF signals, a first antenna port to couple to one or more antennas, and a first switch integrated in the first IC and coupled to the first antenna port. The apparatus further includes a second IC that includes a second RF circuit to process RF signals, a second antenna port to couple to the one or more antennas, and a second switch integrated in the second IC and coupled to the second antenna port.
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公开(公告)号：US20170346520A1
公开(公告)日：2017-11-30
申请号：US15168318
申请日：2016-05-31
申请人： Vitor Pereira , Mustafa Koroglu , Ruifeng Sun , Ramin Khoini-Poorfard , Abdulkerim Coban , Yu Su , Krishna Pentakota
发明人： Vitor Pereira , Mustafa Koroglu , Ruifeng Sun , Ramin Khoini-Poorfard , Abdulkerim Coban , Yu Su , Krishna Pentakota
CPC分类号： H04B1/30 , H04B1/0028 , H04B1/005 , H04B1/1027 , H04N21/4263
摘要： In one example, a semiconductor die includes multi-standard, multi-channel expandable television/satellite receiver that can be flexibly implemented in a number of different configurations to enable incorporation into a plurality of different systems. The semiconductor die may include multiple tuners to receive and tune a terrestrial radio frequency (RF) signal and a satellite RF signal. These tuners may include different frequency synthesizers including voltage controlled oscillators (VCOs) to generate VCO signals at different frequencies, mixers to downconvert the RF signals to baseband signals using the VCO signals. In an implementation, the semiconductor die may further include shared circuitry coupled to the tuners to digitize, process and demodulate the baseband signals.
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