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公开(公告)号:US06960022B2
公开(公告)日:2005-11-01
申请号:US10616708
申请日:2003-07-10
申请人: David T. Beatson , E. Walter Frasch , Paul J. Schlosser , Jai R. Singh , David W. McKenna , Craig Emmons
发明人: David T. Beatson , E. Walter Frasch , Paul J. Schlosser , Jai R. Singh , David W. McKenna , Craig Emmons
CPC分类号: F16C29/005 , B23Q1/40 , B23Q1/42 , B23Q1/58 , F16C29/04 , F16C2322/39
摘要: A “hybrid” or macrocomposite guideway, wherein the “traditional” or existing guideway material (e.g., hardened steel) is maintained as the wear resistant, low friction surface intended to be in physical contact with one or more bearings, and further wherein this surface is backed up or supported by a substrate comprising a stiff, lightweight material. This macrocomposite guideway combines the desirable friction and wear characteristics of the traditional bearing materials with the stiffness and low mass of advanced materials. Candidate substrate materials include composites having a ceramic and/or a metallic matrix, monolithic ceramics or monolithic light metals. A cladding comprising the hardened steel wear surface layer may be attached to the rigid, lightweight substrate by adhesive bonding, mechanical fasteners or other mechanical fit such as a friction or interference fit. Preferably, though, the attachment is by means of a metallurgical bond. In a particularly preferred embodiment, a silicon carbide particulate reinforced aluminum composite is metallurgically bonded to a tool steel wear surface using an “active” soldering composition. A gib that utilizes such guideways is useful in machines requiring fast and precise movement of one pat relative to another, such as in machines for semiconductor chip fabrication and assembly.
摘要翻译: “混合”或大型复合导轨,其中“传统”或现有的导轨材料(例如,硬化钢)被保持为旨在与一个或多个轴承物理接触的耐磨低摩擦表面,并且其中该表面 由包括刚性轻质材料的基材支撑或支撑。 这种宏观复合导轨将传统轴承材料的理想摩擦和磨损特性与先进材料的刚度和质量相结合。 候选基板材料包括具有陶瓷和/或金属基体,单片陶瓷或单片轻金属的复合材料。 包含硬化的钢磨损表面层的包层可以通过粘合剂粘合,机械紧固件或其它机械配合(例如摩擦或过盈配合)附接到刚性轻质基底。 但是,优选地,附件是借助于冶金结合。 在特别优选的实施例中,碳化硅颗粒增强铝复合材料使用“主动”焊接组合物冶金地结合到工具钢耐磨表面。 使用这种导轨的双臂在需要相对于另一个拍拍的快速和精确移动的机器中是有用的,例如在用于半导体芯片制造和组装的机器中。