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公开(公告)号:US06960022B2
公开(公告)日:2005-11-01
申请号:US10616708
申请日:2003-07-10
申请人: David T. Beatson , E. Walter Frasch , Paul J. Schlosser , Jai R. Singh , David W. McKenna , Craig Emmons
发明人: David T. Beatson , E. Walter Frasch , Paul J. Schlosser , Jai R. Singh , David W. McKenna , Craig Emmons
CPC分类号: F16C29/005 , B23Q1/40 , B23Q1/42 , B23Q1/58 , F16C29/04 , F16C2322/39
摘要: A “hybrid” or macrocomposite guideway, wherein the “traditional” or existing guideway material (e.g., hardened steel) is maintained as the wear resistant, low friction surface intended to be in physical contact with one or more bearings, and further wherein this surface is backed up or supported by a substrate comprising a stiff, lightweight material. This macrocomposite guideway combines the desirable friction and wear characteristics of the traditional bearing materials with the stiffness and low mass of advanced materials. Candidate substrate materials include composites having a ceramic and/or a metallic matrix, monolithic ceramics or monolithic light metals. A cladding comprising the hardened steel wear surface layer may be attached to the rigid, lightweight substrate by adhesive bonding, mechanical fasteners or other mechanical fit such as a friction or interference fit. Preferably, though, the attachment is by means of a metallurgical bond. In a particularly preferred embodiment, a silicon carbide particulate reinforced aluminum composite is metallurgically bonded to a tool steel wear surface using an “active” soldering composition. A gib that utilizes such guideways is useful in machines requiring fast and precise movement of one pat relative to another, such as in machines for semiconductor chip fabrication and assembly.
摘要翻译: “混合”或大型复合导轨,其中“传统”或现有的导轨材料(例如,硬化钢)被保持为旨在与一个或多个轴承物理接触的耐磨低摩擦表面,并且其中该表面 由包括刚性轻质材料的基材支撑或支撑。 这种宏观复合导轨将传统轴承材料的理想摩擦和磨损特性与先进材料的刚度和质量相结合。 候选基板材料包括具有陶瓷和/或金属基体,单片陶瓷或单片轻金属的复合材料。 包含硬化的钢磨损表面层的包层可以通过粘合剂粘合,机械紧固件或其它机械配合(例如摩擦或过盈配合)附接到刚性轻质基底。 但是,优选地,附件是借助于冶金结合。 在特别优选的实施例中,碳化硅颗粒增强铝复合材料使用“主动”焊接组合物冶金地结合到工具钢耐磨表面。 使用这种导轨的双臂在需要相对于另一个拍拍的快速和精确移动的机器中是有用的,例如在用于半导体芯片制造和组装的机器中。
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公开(公告)号:US07320424B2
公开(公告)日:2008-01-22
申请号:US11092399
申请日:2005-03-29
申请人: David T. Beatson , E. Walter Frasch
发明人: David T. Beatson , E. Walter Frasch
CPC分类号: H01L24/78 , B23K20/004 , B23K2101/40 , H01L2224/45015 , H01L2224/78301 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01082 , H01L2924/12042 , H01L2924/14 , H01L2224/48 , H01L2924/2075 , H01L2924/20757 , H01L2924/20756 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2224/45099 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2224/05599 , H01L2924/00
摘要: A wire bonding machine for bonding a wire to a semiconductor device. The wire bonding machine includes a wire bonding head having a bonding tool mounted to it. The bonding tool is adapted to attach a wire end to a semiconductor device. A bonding head conveyance system translates the bonding tool in a vertical direction and translates the bonding tool along a first horizontal axis. A work table supports at least one semiconductor device to be wire bonded. A work table conveyance system translates the semiconductor device along a second horizontal axis.
摘要翻译: 一种用于将导线接合到半导体器件的引线接合机。 引线接合机包括具有安装到其上的接合工具的引线接合头。 接合工具适于将线端附接到半导体器件。 接合头传送系统使焊接工具沿垂直方向平移并且沿着第一水平轴平移焊接工具。 工作台支撑至少一个待接线的半导体器件。 工作台传送系统沿着第二水平轴转换半导体器件。
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公开(公告)号:US07377415B2
公开(公告)日:2008-05-27
申请号:US11152861
申请日:2005-06-15
CPC分类号: H01L21/67138 , B23K20/002 , H01L24/45 , H01L24/78 , H01L2224/451 , H01L2224/78 , H01L2224/78301 , H01L2924/00014 , H01L2924/01013 , H01L2924/01021 , H01L2924/01087 , H01L2924/014 , H01L2224/48 , H01L2224/45099 , H01L2924/00015 , H01L2924/00
摘要: A bond head assembly for use with a bonding machine includes a wire bonding tool and a link mechanism coupled between the wire bonding tool and the wire bonding machine. The link mechanism includes a frame, a plurality of arm links pivotably connected to the frame, and a tool support member supporting the wire bonding tool and pivotably connected to each of the arm links.
摘要翻译: 用于粘合机的接合头组件包括一个引线接合工具和一个联接在引线接合工具和引线接合机之间的连接机构。 连杆机构包括框架,可枢转地连接到框架的多个臂连杆,以及支撑引线接合工具并且可枢转地连接到每个臂链节的工具支撑构件。
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公开(公告)号:US07681774B2
公开(公告)日:2010-03-23
申请号:US12099190
申请日:2008-04-08
CPC分类号: H01L21/67138 , B23K20/002 , H01L24/45 , H01L24/78 , H01L2224/451 , H01L2224/78 , H01L2224/78301 , H01L2924/00014 , H01L2924/01013 , H01L2924/01021 , H01L2924/01087 , H01L2924/014 , H01L2224/48 , H01L2224/45099 , H01L2924/00015 , H01L2924/00
摘要: A bond head assembly for use with a bonding machine includes a wire bonding tool and a link mechanism coupled between the wire bonding tool and the wire bonding machine. The link mechanism includes a frame, a plurality of arm links pivotably connected to the frame, and a tool support member supporting the wire bonding tool and pivotably connected to each of the arm links.
摘要翻译: 用于粘合机的接合头组件包括一个引线接合工具和一个联接在引线接合工具和引线接合机之间的连接机构。 连杆机构包括框架,可枢转地连接到框架的多个臂连杆,以及支撑引线接合工具并且可枢转地连接到每个臂链节的工具支撑构件。
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公开(公告)号:US20070284421A1
公开(公告)日:2007-12-13
申请号:US11742696
申请日:2007-05-01
CPC分类号: B23K20/004 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/48463 , H01L2224/49171 , H01L2224/78268 , H01L2224/78301 , H01L2224/78703 , H01L2224/85045 , H01L2224/85075 , H01L2924/01007 , H01L2924/01013 , H01L2924/01018 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要: A device clamp configured for use with a wire bonding machine is provided. The device clamp includes a body portion defining at least one device aperture. Each of the at least one device apertures is configured to be positioned adjacent a bond site area of the wire bonding machine. The body portion includes a inlet port for receiving a fluid from a gas supply source. The body portion defines a fluid path from the inlet port to the at least one device aperture.
摘要翻译: 提供了一种被配置为与引线接合机一起使用的器件夹持器。 装置夹具包括限定至少一个装置孔的主体部分。 所述至少一个装置孔中的每一个构造成邻近所述引线接合机的接合位置区域定位。 主体部分包括用于从气体供应源接收流体的入口端口。 主体部分限定从入口端口到至少一个设备孔口的流体路径。
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公开(公告)号:US08302840B2
公开(公告)日:2012-11-06
申请号:US12297521
申请日:2007-10-05
申请人: Wei Qin , Ziauddin Ahmad , John David Molnar , Deepak Sood , E. Walter Frasch , Chunlong Hu
发明人: Wei Qin , Ziauddin Ahmad , John David Molnar , Deepak Sood , E. Walter Frasch , Chunlong Hu
CPC分类号: H01L24/85 , B23K20/004 , B23K2101/40 , H01L21/67138 , H01L24/48 , H01L24/49 , H01L24/78 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/4846 , H01L2224/48465 , H01L2224/49113 , H01L2224/78301 , H01L2224/78703 , H01L2224/85181 , H01L2224/85203 , H01L2224/85205 , H01L2224/85207 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01082 , H01L2924/3011 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要: A method of applying bonding energy to form a bond between a portion of a wire and a contact of a bonding location using a wire bonding machine is provided. The method includes: (1) moving a bonding tool towards the contact; (2) detecting when a portion of the contact (100a) is pressed against a device supporting surface (112) of the wire bonding machine; and (3) applying bonding energy to the portion of the contact such that a bond is formed between the contact and the portion of wire.
摘要翻译: 提供了一种施加结合能以在线的一部分和使用引线接合机的接合位置的接触之间形成接合的方法。 该方法包括:(1)将接合工具朝向触点移动; (2)检测所述接触部(100a)的一部分是否被压在所述引线接合机的装置支撑面(112)上的情况; 和(3)将接合能量施加到接触部分上,使得在接触部分与导线部分之间形成接合。
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公开(公告)号:US20100230476A1
公开(公告)日:2010-09-16
申请号:US12788827
申请日:2010-05-27
申请人: Gary S. Gillotti , Steven Mak , E. Walter Frasch
发明人: Gary S. Gillotti , Steven Mak , E. Walter Frasch
CPC分类号: B23K20/007 , B23K35/38 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48465 , H01L2224/781 , H01L2224/78268 , H01L2224/78301 , H01L2224/78703 , H01L2224/85045 , H01L2224/85075 , H01L2224/85205 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要: A wire bonding machine is provided. The wire bonding machine includes (1) a bond site area for holding a semiconductor device during a wire bonding operation, and (2) a gas supply line configured to provide a gas at the bond site area from above the bond site area.
摘要翻译: 提供引线接合机。 引线接合机包括:(1)在引线接合操作期间用于保持半导体器件的接合位置区域;以及(2)气体供给管线,被配置为从接合位置区域的上方在接合部位区域提供气体。
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公开(公告)号:US20100108744A1
公开(公告)日:2010-05-06
申请号:US12297521
申请日:2007-10-05
申请人: Wei Qin , Ziauddin Ahmad , John David Molnar , Deepak Sood , E. Walter Frasch , Chunlong Hu
发明人: Wei Qin , Ziauddin Ahmad , John David Molnar , Deepak Sood , E. Walter Frasch , Chunlong Hu
IPC分类号: B23K31/12
CPC分类号: H01L24/85 , B23K20/004 , B23K2101/40 , H01L21/67138 , H01L24/48 , H01L24/49 , H01L24/78 , H01L2224/451 , H01L2224/48091 , H01L2224/48247 , H01L2224/4846 , H01L2224/48465 , H01L2224/49113 , H01L2224/78301 , H01L2224/78703 , H01L2224/85181 , H01L2224/85203 , H01L2224/85205 , H01L2224/85207 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01082 , H01L2924/3011 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要: A method of applying bonding energy to form a bond between a portion of a wire and a contact of a bonding location using a wire bonding machine is provided. The method includes: (1) moving a bonding tool towards the contact; (2) detecting when a portion of the contact (100a) is pressed against a device supporting surface (112) of the wire bonding machine; and (3) applying bonding energy to the portion of the contact such that a bond is formed between the contact and the portion of wire.
摘要翻译: 提供了一种施加结合能以在线的一部分和使用引线接合机的接合位置的接触之间形成接合的方法。 该方法包括:(1)将接合工具朝向触点移动; (2)检测所述接触部(100a)的一部分是否被压在所述引线接合机的装置支撑面(112)上的情况; 和(3)将接合能量施加到接触部分上,使得在接触部分与导线部分之间形成接合。
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公开(公告)号:US07614538B2
公开(公告)日:2009-11-10
申请号:US11742696
申请日:2007-05-01
CPC分类号: B23K20/004 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45164 , H01L2224/48463 , H01L2224/49171 , H01L2224/78268 , H01L2224/78301 , H01L2224/78703 , H01L2224/85045 , H01L2224/85075 , H01L2924/01007 , H01L2924/01013 , H01L2924/01018 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要: A device clamp configured for use with a wire bonding machine is provided. The device clamp includes a body portion defining at least one device aperture. Each of the at least one device apertures is configured to be positioned adjacent a bond site area of the wire bonding machine. The body portion includes a inlet port for receiving a fluid from a gas supply source. The body portion defines a fluid path from the inlet port to the at least one device aperture.
摘要翻译: 提供了一种被配置为与引线接合机一起使用的器件夹持器。 装置夹具包括限定至少一个装置孔的主体部分。 所述至少一个装置孔中的每一个构造成邻近所述引线接合机的接合位置区域定位。 主体部分包括用于从气体供应源接收流体的入口端口。 主体部分限定从入口端口到至少一个设备孔口的流体路径。
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