专利检索 ap:("David Unruh" OR "Srinivas V. Pietambaram") AND inv:"David Unruh" 第 1 页

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发明申请
SURFACE FINISHES FOR HIGH DENSITY INTERCONNECT ARCHITECTURES 审中-公开

公开(公告)号：US20170287860A1

公开(公告)日：2017-10-05

申请号：US15088711

申请日：2016-04-01

申请人： David Unruh , Srinivas V. Pietambaram

发明人： David Unruh , Srinivas V. Pietambaram

IPC分类号： H01L23/00

CPC分类号： H01L24/13 , H01L24/11 , H01L24/14 , H01L2224/11464 , H01L2224/13083 , H01L2224/13111 , H01L2224/13155 , H01L2224/13164 , H01L2224/1403

摘要： An electroless nickel, electroless palladium, electroless tin stack and associated methods are shown. An example method to form a solder bump may include forming a layer of a second material over a first material at a base of a trench in a solder resist layer. The first material includes nickel and the second material includes palladium. The method further includes depositing a third material that includes tin on the second material using an electroless deposition process, and forming a solder bump out of the third material using a reflow and deflux process.