公开(公告)号：US20150247771A1

公开(公告)日：2015-09-03

申请号：US14707251

申请日：2015-05-08

Applicant: Delaware Capital Formation, Inc.

Inventor： Derek W. Puccio ,  Errol P. EerNisse

IPC: G01L9/00 ,  H01L41/18 ,  H01L41/113 ,  G01L1/16

CPC classification number: G01L9/0022 ,  G01L1/162 ,  G01L9/0016 ,  H01L41/1132 ,  H01L41/18 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/4902 ,  Y10T29/4908

Abstract: Arrays of resonator sensors include an active wafer array comprising a plurality of active wafers, a first end cap array coupled to a first side of the active wafer array, and a second end cap array coupled to a second side of the active wafer array. Thickness shear mode resonator sensors may include an active wafer coupled to a first end cap and a second end cap. Methods of forming a plurality of resonator sensors include forming a plurality of active wafer locations and separating the active wafer locations to form a plurality of discrete resonator sensors. Thickness shear mode resonator sensors may be produced by such methods.

Abstract translation: 谐振器传感器的阵列包括主动晶片阵列，其包括多个有源晶片，耦合到有源晶片阵列的第一侧的第一端盖阵列和耦合到有源晶片阵列的第二侧的第二端盖阵列。 厚度剪切模式谐振器传感器可以包括联接到第一端盖和第二端盖的活动晶片。 形成多个谐振器传感器的方法包括形成多个有源晶片位置并分离有源晶片位置以形成多个分立的谐振器传感器。 可以通过这种方法制造厚度剪切模式谐振器传感器。

公开(公告)号：US20150059483A1

公开(公告)日：2015-03-05

申请号：US14472218

申请日：2014-08-28

Applicant: Delaware Capital Formation, Inc.

Inventor： Derek W. Puccio ,  Shane D. Rose

IPC: G01L9/00 ,  G01L19/00

CPC classification number: G01L9/0022 ,  G01L19/0038 ,  G01L19/0092

Abstract: Thickness shear mode resonator pressure sensors include a housing having an outer dimension that is less than 0.575 inch (14.605 millimeters). Pressure transducers may include a quartz pressure sensor and a quartz reference sensor, wherein an electronics assembly of the pressure transducer is configured to drive at least one of the quartz pressure sensor and the quartz reference sensor at a frequency greater than 10 MHz. Transducer assemblies include an electronics assembly configured to drive at least one quartz sensor of the transducer assembly at a frequency greater than 10 MHz.

Abstract translation: 厚度剪切模式谐振器压力传感器包括外部尺寸小于0.575英寸（14.605毫米）的壳体。 压力传感器可以包括石英压力传感器和石英参考传感器，其中压力传感器的电子组件被配置为以大于10MHz的频率驱动石英压力传感器和石英参考传感器中的至少一个。 传感器组件包括被配置为以大于10MHz的频率驱动换能器组件的至少一个石英传感器的电子组件。