公开(公告)号：US12238855B2

公开(公告)日：2025-02-25

申请号：US17510542

申请日：2021-10-26

Applicant: Dell Products L.P.

Inventor： Vijender Kumar ,  Malikarjun Vasa ,  Bhyrav Mutnury

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18

Abstract: A printed circuit board (PCB) includes first and second signal pads and a guard trace formed on a surface of the PCB. The first and second signal pads are for connecting to signal contacts of a high-speed data communication interface. The guard trace is located between the first signal pad and the second signal pad. The PCB further includes first, second, and third ground vias that couple the guard trace to a ground plane of the PCB. The first ground via is located at a first end of the guard trace. The second ground via is located at a second end of the guard trace. The third ground via is located between the first via and the second via.

公开(公告)号：US20230030534A1

公开(公告)日：2023-02-02

申请号：US17510542

申请日：2021-10-26

Applicant: Dell Products L.P.

Inventor： Vijender Kumar ,  Malikarjun Vasa ,  Bhyrav Mutnury

IPC: H05K1/02

Abstract: A printed circuit board (PCB) includes first and second signal voids and a guard trace formed on a surface of the PCB. The first and second signal voids are for connecting to signal contacts of a high-speed data communication interface. The guard trace is located between the first signal void and the second signal void. The PCB further includes first, second, and third ground vias that couple the guard trace to a ground plane of the PCB. The first ground via is located at a first end of the guard trace. The second ground via is located at a second end of the guard trace. The third ground via is located between the first via and the second via.

公开(公告)号：US20230025833A1

公开(公告)日：2023-01-26

申请号：US17506045

申请日：2021-10-20

Applicant: Dell Products L.P.

Inventor： Malikarjun Vasa ,  Sanjay Kumar ,  Bhyrav Mutnury

IPC: H05K1/18 ,  H05K1/02

Abstract: An add-in card printed circuit board (PCB) includes a body portion and a card edge portion. The body portion includes a circuit trace associated with a high-speed data communication interface. The card edge portion includes contact fingers, and is configured to be inserted into a card edge connector of an information handling system. The contact fingers include a signal contact finger coupled to the circuit trace, and a ground contact finger that is located adjacent to the signal contact finger. The ground contact finger includes a ground via that couples the ground contact finger to a ground plane layer of the add-in card PCB. The ground via is located half way within the body portion and half way within the card edge portion.

公开(公告)号：US11683887B2

公开(公告)日：2023-06-20

申请号：US17506045

申请日：2021-10-20

Applicant: Dell Products L.P.

Inventor： Malikarjun Vasa ,  Sanjay Kumar ,  Bhyrav Mutnury

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K1/182 ,  H05K1/0218 ,  H05K1/0237 ,  H05K2201/0183 ,  H05K2201/10621

Abstract: An add-in card printed circuit board (PCB) includes a body portion and a card edge portion. The body portion includes a circuit trace associated with a high-speed data communication interface. The card edge portion includes contact fingers, and is configured to be inserted into a card edge connector of an information handling system. The contact fingers include a signal contact finger coupled to the circuit trace, and a ground contact finger that is located adjacent to the signal contact finger. The ground contact finger includes a ground via that couples the ground contact finger to a ground plane layer of the add-in card PCB. The ground via is located half way within the body portion and half way within the card edge portion.