公开(公告)号：US20230025833A1

公开(公告)日：2023-01-26

申请号：US17506045

申请日：2021-10-20

Applicant: Dell Products L.P.

Inventor： Malikarjun Vasa ,  Sanjay Kumar ,  Bhyrav Mutnury

IPC: H05K1/18 ,  H05K1/02

Abstract: An add-in card printed circuit board (PCB) includes a body portion and a card edge portion. The body portion includes a circuit trace associated with a high-speed data communication interface. The card edge portion includes contact fingers, and is configured to be inserted into a card edge connector of an information handling system. The contact fingers include a signal contact finger coupled to the circuit trace, and a ground contact finger that is located adjacent to the signal contact finger. The ground contact finger includes a ground via that couples the ground contact finger to a ground plane layer of the add-in card PCB. The ground via is located half way within the body portion and half way within the card edge portion.

公开(公告)号：US20230325569A1

公开(公告)日：2023-10-12

申请号：US17716527

申请日：2022-04-08

Applicant: Dell Products L.P.

Inventor： Vijender Kumar ,  Mallikarjun Vasa ,  Ashish Shrivastava ,  Bhyrav Mutnury ,  Seema P K ,  Sukumar Muthusamy ,  Sanjay Kumar ,  Sunil Pathania

IPC: G06F30/392

CPC classification number: G06F30/392 ,  G06F2119/08

Abstract: An information handling system includes a memory device and a processor. The memory device includes first data representing a thermal profile of a motherboard, and second data representing a circuit trace of the motherboard. The circuit trace provides a high-speed data interconnection between two or more circuit devices. The processor determines an average temperature of the circuit trace on the motherboard based upon the first data and the second data, and models a trace layout for the circuit trace on the motherboard based upon the average temperature.

公开(公告)号：US20250048549A1

公开(公告)日：2025-02-06

申请号：US18363106

申请日：2023-08-01

Applicant: DELL PRODUCTS L.P.

Inventor： Sanjay Kumar ,  Sathvika Bandi ,  Sukumar Muthusamy ,  Naga Hara Sathya Sree Tammisetti ,  Arun Vignesh Palanichamy ,  Bhyrav Mutnury

IPC: H05K1/03 ,  H05K1/02

Abstract: A printed circuit board substrate including multiple sets of glass rows. The multiple sets of glass rows include a first set of glass rows, a second set of glass rows, and a third set of glass rows. The first set of glass rows extend in a first direction. The second set of glass rows extend in a second direction that is perpendicular to the first direction. The third set of glass rows extend in a third direction that is parallel to the first direction. The resin holds the multiple sets of glass rows together and to fill pockets between the multiple of sets of glass rows.

公开(公告)号：US11683887B2

公开(公告)日：2023-06-20

申请号：US17506045

申请日：2021-10-20

Applicant: Dell Products L.P.

Inventor： Malikarjun Vasa ,  Sanjay Kumar ,  Bhyrav Mutnury

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K1/182 ,  H05K1/0218 ,  H05K1/0237 ,  H05K2201/0183 ,  H05K2201/10621

Abstract: An add-in card printed circuit board (PCB) includes a body portion and a card edge portion. The body portion includes a circuit trace associated with a high-speed data communication interface. The card edge portion includes contact fingers, and is configured to be inserted into a card edge connector of an information handling system. The contact fingers include a signal contact finger coupled to the circuit trace, and a ground contact finger that is located adjacent to the signal contact finger. The ground contact finger includes a ground via that couples the ground contact finger to a ground plane layer of the add-in card PCB. The ground via is located half way within the body portion and half way within the card edge portion.