公开(公告)号：US09369047B2

公开(公告)日：2016-06-14

申请号：US14078842

申请日：2013-11-13

Applicant: DELTA ELECTRONICS, INC. ,  POWER FOREST TECHNOLOGY CORPORATION

Inventor： Ren-Huei Tzeng ,  Kuan-Sheng Wang ,  Wei-Chan Hsu ,  Chien-Chung Chang ,  Geu-Cheng Hu ,  Cheng-Yi Lin

IPC: H02M3/335

CPC classification number: H02M3/335 ,  H02M3/33507 ,  H02M3/33515 ,  H02M3/33523 ,  H02M3/33538 ,  H02M3/33546 ,  H02M3/33553

Abstract: Methods for flyback converters are provided. The method, adopted by a flyback converter circuit including a transformer, including: determining an output voltage output from a secondary circuit of the transformer; feeding a feedback voltage based on the output voltage from the secondary circuit back to a primary circuit of the transformer; increasing a current limit and a switching frequency of a primary current with the feedback voltage; and supplying the primary current to a primary winding of the transformer.

Abstract translation: 提供了反激式转换器的方法。 由包括变压器的反激式转换器电路采用的方法，包括：确定从变压器的次级电路输出的输出电压; 基于来自次级回路的输出电压向变压器的初级电路馈送反馈电压; 用反馈电压增加初级电流的电流限制和开关频率; 并将一次电流提供给变压器的初级绕组。

公开(公告)号：US11506849B2

公开(公告)日：2022-11-22

申请号：US17349398

申请日：2021-06-16

Applicant: Delta Electronics, Inc.

Inventor： Kuang-Yao Chen ,  Kao-Chi Chen ,  Wei-Chan Hsu ,  Gow-Zin Yiu

IPC: H04B10/00 ,  G02B6/42 ,  H05K3/24 ,  H04B10/40

Abstract: The disclosure relates to an optical transceiver and a manufacturing method thereof. The optical transceiver includes a substrate, a thermal-conductive substrate, a first metal wiring structure, a light-transceiving element and an optical fiber array. The substrate has an opening, and the thermal-conductive substrate is embedded within the opening. The first metal wiring structure is integrally formed on the substrate and the thermal-conductive substrate through an electroplating or a wire-printing process. The light-transceiving element is disposed on the thermal-conductive substrate and is electrically connected to the first metal wiring structure. The optical fiber array is arranged on the thermal-conductive substrate for communication with the light-transceiving element.

公开(公告)号：US11966085B2

公开(公告)日：2024-04-23

申请号：US17325030

申请日：2021-05-19

Applicant: Delta Electronics, Inc.

Inventor： Chen-Mao Lu ,  Wei-Chan Hsu ,  Chun-Yen Chen

IPC: G02B6/36

CPC classification number: G02B6/3644 ,  G02B6/368

Abstract: An optical transceiver includes an input assembly, an output port, a fiber patch panel, multiple first optical fibers and multiple second optical fibers. The input assembly is arranged on a circuit board and has a first input port and a second input port. The fiber patch panel is arranged between the input assembly and the output port, and has multiple first fiber patch slots and multiple second fiber patch slots. The first optical fibers are connected to the first input port and the output port. The first optical fiber passes through the first fiber patch slot and the second fiber patch slot. The second optical fibers are connected to the second input port and the output port. The second optical fiber passes through the first fiber patch slot and the second fiber patch slot. The second fiber patch slot accommodates the first optical fiber and the second optical fiber.

公开(公告)号：US20220252801A1

公开(公告)日：2022-08-11

申请号：US17349398

申请日：2021-06-16

Applicant: Delta Electronics, Inc.

Inventor： Kuang-Yao Chen ,  Kao-Chi Chen ,  Wei-Chan Hsu ,  Gow-Zin Yiu

IPC: G02B6/42 ,  H04B10/40 ,  H05K3/24

Abstract: The disclosure relates to an optical transceiver and a manufacturing method thereof. The optical transceiver includes a substrate, a thermal-conductive substrate, a first metal wiring structure, a light-transceiving element and an optical fiber array. The substrate has an opening, and the thermal-conductive substrate is embedded within the opening. The first metal wiring structure is integrally formed on the substrate and the thermal-conductive substrate through an electroplating or a wire-printing process. The light-transceiving element is disposed on the thermal-conductive substrate and is electrically connected to the first metal wiring structure. The optical fiber array is arranged on the thermal-conductive substrate for communication with the light-transceiving element.