-
公开(公告)号:US12094802B2
公开(公告)日:2024-09-17
申请号:US17232461
申请日:2021-04-16
发明人: Pengkai Ji , Shouyu Hong , Xin Zou , Lanyan Xu
IPC分类号: H01L23/40 , H01L23/427 , H01L25/18 , H05K7/20 , H01L23/64
CPC分类号: H01L23/4012 , H01L23/427 , H01L25/18 , H05K7/20445 , H01L2023/4087 , H01L23/642
摘要: The present disclosure provides a data processing device. The data processing device includes a carrier board, a data processor, a power module, a first heat sink, and a heat transfer plate. The data processor is provided above the carrier board. The power module is provided below the carrier board and supplies power to the data processor through the carrier board. The first heat sink is provided above the carrier board. The heat transfer plate includes a main body portion and a first extension. The main body portion is provided below the power module. The first extension portion extends upward from the main body portion and is connected to the first heat sink.