Abstract:
A method of surface treating a fluid dispenser device, the method including a step of modifying, by ion implantation using multi-charged and multi-energy ion beams, at least one surface to be treated of at least a portion of the device in contact with the fluid. The modified surface has properties limiting the formation of a biofilm and thus the appearance and/or proliferation of bacteria on the modified surface, the multi-charged ions being selected from helium, boron, carbon, nitrogen, oxygen, neon, argon, krypton, and xenon, ionic implantation being carried out to a depth of 0 μm to 3 μm.
Abstract:
A method of surface treating a fluid dispenser device, the method including a step of modifying at least one surface to be treated of at least a portion of the device by ionic implantation using multi-charged and multi-energy ion beams. The modified surface to be treated has anti-friction properties, the multi-charged ions are selected from helium (He), nitrogen (N), oxygen (O), neon (Ne), argon (Ar), krypton (Kr), and xenon (Xe), and ionic implantation is carried out to a depth of 0 μm to 3 μm.
Abstract:
A method of grafting monomers (M) in a deep layer (1) in an organic material by using an ion beam (X), wherein the ion dose per unit area is selected so as to be in the range of 1012 ions/cm2 to 1018 ions/cm2 so as to create a reservoir of free radicals (1) within a large thickness in the range 0 nm to 3000 nm. Hydrophilic and/or hydrophobic and/or antibacterial monomers (M) are grafted in the reservoir of free radicals (1). Organic materials with hydrophobic, hydrophilic, and/or antibacterial properties that are effective for long-term use are thus advantageously obtained.
Abstract translation:通过使用离子束(X)在有机材料的深层(1)中接枝单体(M)的方法,其中每单位面积的离子剂量选择为1012离子/ cm 2至 1018离子/ cm 2,以便在0nm至3000nm范围内的大厚度内形成自由基(1)的储存器。 亲水和/或疏水和/或抗菌单体(M)被接枝在自由基储存器(1)中。 因此有利地获得了对于长期使用有效的具有疏水性,亲水性和/或抗菌性质的有机材料。
Abstract:
A treatment method for treating at least one surface of a solid polymer part wherein multi-energy ions X+ and X2+ are implanted simultaneously, where X is the atomic symbol selected from the list constituted by helium (He), nitrogen (N), oxygen (O), neon (Ne), argon (Ar), krypton (Kr), and xenon (Xe), and wherein the ratio RX, where RX=X+/X2+, with X+ and X2+ expressed as atomic percentages, is less than or equal to 100, for example less than 20. This results in very significant reductions in the surface resistivity of the parts treated in this way, the appearance of antistatic properties or of electrostatic charge dissipation properties. By way of example, the ions X+ and X2+ are supplied by an ECR source.
Abstract:
The invention relates to a method for treating a metal deposit to reduce or eliminate the porosity thereof by bombarding the same with an ion source. The source is, for example, an electron cyclotron resonance (RCE) source. The metal can be gold. The ion bombardment has the effect of sealing the porosity of the metal deposit according to the type, energy, amount and angle of incidence of the ions.
Abstract:
A method of surface treating a fluid dispenser device, said method comprising a step of modifying at least one surface to be treated of at least a portion of said device in contact with said fluid by ionic implantation using multi-charged and multi-energy ion beams, said modified surface to be treated having non-stick properties for said fluid, said multi-charged ions being selected from helium (He), nitrogen (N), oxygen (O), neon (Ne), argon (Ar), krypton (Kr), and xenon (Xe), ionic implantation being carried out to a depth of 0 μm to 3 μm.
Abstract:
The present invention relates to a method for treating a metal element subjected to an ion beam, where: the ions of the beam are selected from among boron, carbon, nitrogen, and oxygen; the ion acceleration voltage, greater than or equal to 10 kV, and the power of the beam, between 1 W and 10 kW, as well as the ion load per surface unit are selected so as to enable the implantation of ions onto an implantation area with a thickness eI of 0.05 μm to 5 μm, and also enable the diffusion of ions into an implantation/diffusion area with a thickness eI+eP, of 0.1 μm to 1,000 μm; the temperature TZF of the area of the metal element located under the implantation/diffusion area is less than or equal to a threshold temperature TSD. In this manner, metal surfaces having remarkable mechanical characteristics are advantageously produced.
Abstract:
A method of treating an elastomer surface of a fluid dispenser device, said method comprising a step of modifying at least one elastomer surface to be treated of said device by ionic implantation using multi-charged and multi-energy ion beams, said modified elastomer surface limiting adhesion of the elastomer surfaces during the manufacturing and/or assembly stages, said multi-charged ions being selected from helium (He), nitrogen (N), oxygen (O), neon (Ne), argon (Ar), krypton (Kr), and xenon (Xe), ionic implantation being carried out to a depth of 0 μm to 3 μm.
Abstract:
The invention relates to a method for treating at least one surface of a solid elastomer part using helium ions. According to the invention, multi-energy ions He+ and He2+ are implanted simultaneously, and the ratio RHe, where RHe=HeVHe2+ with He+ et He2+ expressed in atomic percentage, is less than or equal to 100, for example less than 20, resulting in very significant reductions in the frictional properties of parts treated in this way. The He+ and He2+ ions are supplied, for example, by an ECR source.
Abstract translation:本发明涉及使用氦离子处理固体弹性体部件的至少一个表面的方法。 根据本发明,同时注入多能离子He +和He2 +,其中RHe = HeVHe2 +与He + et He2 +以原子百分比表示的比率RHe小于或等于100,例如小于20,导致 以这种方式处理的部件的摩擦性能非常显着的降低。 He +和He2 +离子例如由ECR源提供。
Abstract:
The invention relates to a device for implanting ions in an aluminium alloy part (5), said device comprising an ion source (6) supplying ions accelerated by an extraction voltage, and first means for regulating (7-11) an initial beam (f1′) of ions emitted by said source (6) to form an implantation beam (f1). The source (6) is an electronic cyclotronic resonance source generating the initial beam (f1′) of multi-energy ions that are implanted in the part (5) at a temperature below 120° C. The implantation of said multi-energy ions of the implantation beam (f1) regulated by the regulating means (7-11) is simultaneously carried out at a depth controlled by the extraction voltage of the source.