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1.发明申请SYSTEM AND METHOD FOR DETECTING AND MEASURING IMPACTS IN HANDHELD DEVICES USING AN ACOUSTIC TRANSDUCER 有权使用声学传感器检测和测量手持装置中的影响的系统和方法公开(公告)号：US20120136618A1
公开(公告)日：2012-05-31
申请号：US12955037
申请日：2010-11-29
CPC分类号： G01P15/00 , G01L1/00 , G01P1/127 , G01P15/0891
摘要： A system and method is provided for detecting and measuring impacts in a wireless device. The wireless device has a processor coupled to a memory and an acoustic transducer. The method comprises acquiring data from the acoustic transducer, the data acquisition including the processor taking samples of an electrical input signal supplied to an input of the processor by the acoustic transducer; saving the acquired data in the memory; detecting whether an impact has occurred; and halting data acquisition after the impact is detected.
摘要翻译： 提供了一种用于检测和测量无线设备中的影响的系统和方法。 无线设备具有耦合到存储器和声换能器的处理器。 所述方法包括从所述声换能器获取数据，所述数据采集包括所述处理器采用由所述声换能器提供给所述处理器的输入的电输入信号的采样; 将获取的数据保存在存储器中; 检测是否发生了影响; 并在检测到影响后停止数据采集。
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公开(公告)号：US08589089B2
公开(公告)日：2013-11-19
申请号：US12955037
申请日：2010-11-29
IPC分类号： G01L1/00
CPC分类号： G01P15/00 , G01L1/00 , G01P1/127 , G01P15/0891
摘要： A system and method is provided for detecting and measuring impacts in a wireless device. The wireless device has a processor coupled to a memory and an acoustic transducer. The method comprises acquiring data from the acoustic transducer, the data acquisition including the processor taking samples of an electrical input signal supplied to an input of the processor by the acoustic transducer; saving the acquired data in the memory; detecting whether an impact has occurred; and halting data acquisition after the impact is detected.
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3.发明授权公开(公告)号：US07874470B2
公开(公告)日：2011-01-25
申请号：US12869076
申请日：2010-08-26
IPC分类号： B23K31/12
CPC分类号： B23K31/12 , B23K2101/40 , G01N13/02 , H05K3/34 , H05K2203/162
摘要： The described embodiments relate generally to methods and apparatus for use in determining solderability of an electrical component. One particular aspect relates to apparatus comprising a vacuum chamber, a load sensor, a platform and a control module. The load sensor has a contact portion disposed within the vacuum chamber and the platform is disposed in relation to the contact portion and has a component mounting surface and a mounting member for mounting an electrical component to the component mounting surface. The control module causes relative movement between the platform and the load sensor so that a contact surface of the electrical component is brought into close proximity with the contact portion. When the contact portion has solder thereon and the solder is brought into contact with the contact surface, the load sensor measures force arising from wetting of the solder to the contact surface. The force generated under contact changes over time, depending on the degree of solderability of the electrical component. Thus, measurement of the wetting forces over time provides an indication of the solderability of the electrical component.
摘要翻译： 所描述的实施例一般涉及用于确定电气部件的可焊性的方法和装置。 一个具体方面涉及包括真空室，负载传感器，平台和控制模块的设备。 负载传感器具有设置在真空室内的接触部分，并且平台相对于接触部分设置，并且具有部件安装表面和用于将电气部件安装到部件安装表面的安装部件。 控制模块引起平台和负载传感器之间的相对运动，使得电气部件的接触表面与接触部分紧密接近。 当接触部分在其上具有焊料并且焊料与接触表面接触时，负载传感器测量由焊料湿润到接触表面的力。 接触时产生的力随时间而变化，这取决于电气部件的可焊性程度。 因此，随着时间的推移，润湿力的测量提供了电气部件的可焊性的指示。
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公开(公告)号：US20100320256A1
公开(公告)日：2010-12-23
申请号：US12869076
申请日：2010-08-26
IPC分类号： B23K31/12
CPC分类号： B23K31/12 , B23K2101/40 , G01N13/02 , H05K3/34 , H05K2203/162
摘要： The described embodiments relate generally to methods and apparatus for use in determining solderability of an electrical component. One particular aspect relates to apparatus comprising a vacuum chamber, a load sensor, a platform and a control module. The load sensor has a contact portion disposed within the vacuum chamber and the platform is disposed in relation to the contact portion and has a component mounting surface and a mounting member for mounting an electrical component to the component mounting surface. The control module causes relative movement between the platform and the load sensor so that a contact surface of the electrical component is brought into close proximity with the contact portion. When the contact portion has solder thereon and the solder is brought into contact with the contact surface, the load sensor measures force arising from wetting of the solder to the contact surface. The force generated under contact changes over time, depending on the degree of solderability of the electrical component. Thus, measurement of the wetting forces over time provides an indication of the solderability of the electrical component.
摘要翻译： 所描述的实施例一般涉及用于确定电气部件的可焊性的方法和装置。 一个具体方面涉及包括真空室，负载传感器，平台和控制模块的设备。 负载传感器具有设置在真空室内的接触部分，并且平台相对于接触部分设置，并且具有部件安装表面和用于将电气部件安装到部件安装表面的安装部件。 控制模块引起平台和负载传感器之间的相对运动，使得电气部件的接触表面与接触部分紧密接近。 当接触部分在其上具有焊料并且焊料与接触表面接触时，负载传感器测量由焊料湿润到接触表面的力。 接触时产生的力随时间而变化，这取决于电气部件的可焊性程度。 因此，随着时间的推移，润湿力的测量提供了电气部件的可焊性的指示。
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5.发明授权Portable electronic device and method of measuring drop impact at the portable electronic device 有权在便携式电子设备上测量跌落冲击的便携式电子设备和方法公开(公告)号：US08549892B2
公开(公告)日：2013-10-08
申请号：US13251019
申请日：2011-09-30
CPC分类号： G06F3/0414 , G01P15/0891 , G01P15/18 , G11B19/042 , H04M1/185 , H04M2250/12
摘要： A method of measuring drop impact at an electronic device includes detecting a fall based on signals from drop detection sensor of the electronic device, receiving an output from a piezoelectric sensor in response to detecting the fall, and storing drop data based on the output from the piezoelectric sensor in a memory at the electronic device.
摘要翻译： 一种测量电子设备的跌落冲击的方法包括：基于来自电子设备的跌落检测传感器的信号检测跌落，响应于检测到跌落接收来自压电传感器的输出，并且基于来自 压电传感器在电子设备的存储器中。
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6.发明授权公开(公告)号：US08528804B2
公开(公告)日：2013-09-10
申请号：US11400233
申请日：2006-04-10
IPC分类号： B23K31/12
CPC分类号： B23K31/12 , B23K2101/40 , G01N13/02 , H05K3/34 , H05K2203/162
摘要： The described embodiments relate generally to methods and apparatus for use in determining solderability of an electrical component. One particular aspect relates to apparatus comprising a vacuum chamber, a load sensor, a platform and a control module. The load sensor has a contact portion disposed within the vacuum chamber and the platform is disposed in relation to the contact portion and has a component mounting surface and a mounting member for mounting an electrical component to the component mounting surface. The control module causes relative movement between the platform and the load sensor so that a contact surface of the electrical component is brought into close proximity with the contact portion. When the contact portion has solder thereon and the solder is brought into contact with the contact surface, the load sensor measures force arising from wetting of the solder to the contact surface. The force generated under contact changes over time, depending on the degree of solderability of the electrical component. Thus, measurement of the wetting forces over time provides an indication of the solderability of the electrical component.
摘要翻译： 所描述的实施例一般涉及用于确定电气部件的可焊性的方法和装置。 一个具体方面涉及包括真空室，负载传感器，平台和控制模块的设备。 负载传感器具有设置在真空室内的接触部分，并且平台相对于接触部分设置，并且具有部件安装表面和用于将电气部件安装到部件安装表面的安装部件。 控制模块引起平台和负载传感器之间的相对运动，使得电气部件的接触表面与接触部分紧密接近。 当接触部分在其上具有焊料并且焊料与接触表面接触时，负载传感器测量由焊料湿润到接触表面的力。 接触时产生的力随时间而变化，这取决于电气部件的可焊性程度。 因此，随着时间的推移，润湿力的测量提供了电气部件的可焊性的指示。
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7.发明授权Portable electronic device and method of measuring drop impact at the portable electronic device 有权在便携式电子设备上测量跌落冲击的便携式电子设备和方法公开(公告)号：US08061182B2
公开(公告)日：2011-11-22
申请号：US12488829
申请日：2009-06-22
申请人： Arnett Weber , Todd Robert Paleczny , Denis Lahaie
发明人： Arnett Weber , Todd Robert Paleczny , Denis Lahaie
IPC分类号： G01N3/30
CPC分类号： G06F3/0414 , G01P15/0891 , G01P15/18 , G11B19/042 , H04M1/185 , H04M2250/12
摘要： A method of measuring drop impact at an electronic device includes detecting a fall based on signals from drop detection sensor of the electronic device, receiving an output from a piezoelectric sensor in response to detecting the fall, and storing drop data based on the output from the piezoelectric sensor in a memory at the electronic device.
摘要翻译： 一种测量电子设备的跌落冲击的方法包括：基于来自电子设备的跌落检测传感器的信号检测跌落，响应于检测到跌落接收来自压电传感器的输出，并且基于来自 压电传感器在电子设备的存储器中。
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8.发明申请公开(公告)号：US20070235504A1
公开(公告)日：2007-10-11
申请号：US11400233
申请日：2006-04-10
申请人： Denis Lahaie , Beverley Christian
发明人： Denis Lahaie , Beverley Christian
CPC分类号： B23K31/12 , B23K2101/40 , G01N13/02 , H05K3/34 , H05K2203/162
摘要： The described embodiments relate generally to methods and apparatus for use in determining solderability of an electrical component. One particular aspect relates to apparatus comprising a vacuum chamber, a load sensor, a platform and a control module. The load sensor has a contact portion disposed within the vacuum chamber and the platform is disposed in relation to the contact portion and has a component mounting surface and a mounting member for mounting an electrical component to the component mounting surface. The control module causes relative movement between the plafform and the load sensor so that a contact surface of the electrical component is brought into close proximity with the contact portion. When the contact portion has solder thereon and the solder is brought into contact with the contact surface, the load sensor measures force arising from wetting of the solder to the contact surface. The force generated under contact changes over time, depending on the degree of solderability of the electrical component. Thus, measurement of the wetting forces over time provides an indication of the solderability of the electrical component.
摘要翻译： 所描述的实施例一般涉及用于确定电气部件的可焊性的方法和装置。 一个具体方面涉及包括真空室，负载传感器，平台和控制模块的设备。 负载传感器具有设置在真空室内的接触部分，并且平台相对于接触部分设置，并且具有部件安装表面和用于将电气部件安装到部件安装表面的安装部件。 控制模块导致平板纸和负载传感器之间的相对移动，使得电气部件的接触表面与接触部分紧密接近。 当接触部分在其上具有焊料并且焊料与接触表面接触时，负载传感器测量由焊料湿润到接触表面的力。 接触时产生的力随时间而变化，这取决于电气部件的可焊性程度。 因此，随着时间的推移，润湿力的测量提供了电气部件的可焊性的指示。
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