Photosensitive polymer and chemically amplified photoresist composition including the same
    1.
    发明授权
    Photosensitive polymer and chemically amplified photoresist composition including the same 失效
    光敏聚合物和包含其的化学放大光致抗蚀剂组合物

    公开(公告)号:US07297463B2

    公开(公告)日:2007-11-20

    申请号:US11142444

    申请日:2005-06-02

    IPC分类号: C08F212/08

    摘要: A photosensitive polymer for forming high-resolution fine circuit patterns with an exposure light source of a short wavelength, and a chemically amplified photoresist composition including the polymer, are disclosed. The photosensitive polymer is represented by the following Formula 1, wherein R1 is a hydrogen atom, R2 is a hydrogen atom, R3 is a chlorine atom, a bromine atom, hydroxy, cyano, t-butoxy, CH2NH2, CONH2, CH═NH, CH(OH)NH2 or C(OH)═NH group, R4 is a hydrogen atom or methyl group, each of 1-x-y-z, x, y and z is a degree of polymerization of each repeating unit constituting the photosensitive polymer, x, y and z are 0.01 to 0.8, respectively, and n is 1 or 2.

    摘要翻译: 公开了用于形成具有短波长的曝光光源的高分辨率精细电路图案的光敏聚合物和包含该聚合物的化学放大光致抗蚀剂组合物。 光敏聚合物由下式1表示,其中R 1是氢原子,R 2是氢原子,R 3是 氯原子,溴原子,羟基,氰基,叔丁氧基,CH 2 NH 2,CONH 2,CH-NH,CH (OH)NH 2或C(OH)-NH基,R 4是氢原子或甲基,1-xyz,x,y和z分别为 构成感光性聚合物的各重复单元的x,y,z的聚合度分别为0.01〜0.8,n为1或2。