公开(公告)号：US20230233118A1

公开(公告)日：2023-07-27

申请号：US18127540

申请日：2023-03-28

Applicant: DexCom, Inc.

Inventor： Ohseung KWON ,  Xianyan Wang ,  Timothy Stowe

IPC: A61B5/1473 ,  A61B5/00 ,  A61B5/145

CPC classification number: A61B5/1473 ,  A61B5/14735 ,  A61B5/6833 ,  A61B5/1451 ,  A61B5/14532 ,  A61B2562/125

Abstract: In some aspects, an apparatus for a biosensor includes a sensor wire and a rigid member. The rigid member may be coupled to the sensor wire and include a contact surface. The contact surface may be sized to enable a suction head of a robotic placement device to create a vacuum seal on the contact surface for lifting the sensor wire and rigid member.