公开(公告)号：US20080219204A1

公开(公告)日：2008-09-11

申请号：US12041082

申请日：2008-03-03

申请人： Do-Young LEE ,  Soeng-Hun Kim ,  Hye-Jeong Kim

发明人： Do-Young LEE ,  Soeng-Hun Kim ,  Hye-Jeong Kim

IPC分类号： H04B3/36

CPC分类号： H04L1/1822 ,  H04L1/1812 ,  H04L1/1848

摘要： A method for requesting packet retransmission in a wireless communication system is provided. The method includes checking, by a receiving-side Automatic Retransmission reQuest (ARQ) layer, sequence numbers of received packets to determine whether there is any missing packet, and starting a first timer in association with the missing packet; stopping the first timer upon receiving an Hybrid ARQ (HARQ) reception failure indicator corresponding to the missing packet, provided from a receiving-side HARQ layer; and stopping generation of a status report message corresponding to the missing packet, and waiting for an ARQ packet corresponding to the missing packet, retransmitted from a transmitting-side ARQ layer.

摘要翻译： 提供了一种在无线通信系统中请求分组重传的方法。 该方法包括：通过接收侧自动重传请求（ARQ）层检查接收到的分组的序列号，以确定是否存在任何丢失的分组，以及与丢失分组相关联地启动第一定时器; 在从接收侧HARQ层提供的接收到与丢失分组对应的混合ARQ（HARQ）接收失败指示符时停止第一定时器; 并停止生成与丢失的分组相对应的状态报告消息，并且等待从发送方ARQ层重传的丢失分组对应的ARQ分组。

公开(公告)号：US20080195781A1

公开(公告)日：2008-08-14

申请号：US12031284

申请日：2008-02-14

申请人： Hye-Jeong KIM ,  Do-Young LEE ,  Hyun-Gu LEE ,  Byoung-Jae BAE ,  Young-Taek KIM

发明人： Hye-Jeong KIM ,  Do-Young LEE ,  Hyun-Gu LEE ,  Byoung-Jae BAE ,  Young-Taek KIM

IPC分类号： G06F13/42 ,  G06F13/14 ,  G06F13/36

CPC分类号： G06F13/387 ,  H04L69/22 ,  H04W80/04 ,  H04W88/02

摘要： Provided is a method and an apparatus for processing data at a high speed by a UE for data communication. In the method, received data is divided into a header and payload information, which are then stored in different memories. In the method, header processing and payload data processing can be performed in parallel, and two memory devices can perform parallel processing without sharing a bus.

摘要翻译： 提供了一种用于数据通信的UE高速处理数据的方法和装置。 在该方法中，接收到的数据被分成头部和有效载荷信息，然后存储在不同的存储器中。 在该方法中，可以并行执行报头处理和有效负载数据处理，并且两个存储器件可以在不共享总线的情况下执行并行处理。

公开(公告)号：US20120135552A1

公开(公告)日：2012-05-31

申请号：US13364884

申请日：2012-02-02

申请人： Byoung-Ho LIM ,  Hyun-Kyu LEE ,  Do-Sung KIM ,  Byung-Koo KANG ,  Do-Young LEE ,  Eui-Tae KIM ,  Sang-Wook PARK

发明人： Byoung-Ho LIM ,  Hyun-Kyu LEE ,  Do-Sung KIM ,  Byung-Koo KANG ,  Do-Young LEE ,  Eui-Tae KIM ,  Sang-Wook PARK

IPC分类号： H01L33/00

CPC分类号： G02F1/134363 ,  G02F1/136227 ,  G02F2201/40

摘要： An array substrate for an in-plane switching mode liquid crystal display device includes a substrate, a gate line along a first direction on the substrate, a data line along a second direction and crossing the gate line to define a pixel region, a common line on the substrate, a thin film transistor connected to the gate and data lines, a pixel electrode in the pixel region and connected to the thin film transistor, the pixel electrode including horizontal parts along the first direction, and a common electrode in the pixel region and connected to the common line, the common electrode including horizontal portions along the first direction, wherein the pixel electrode and the common electrode are formed on a same layer.

摘要翻译： 面内切换模式液晶显示装置的阵列基板包括基板，沿着基板的第一方向的栅极线，沿着第二方向的数据线，与栅极线交叉以限定像素区域，公共线 在基板上，连接到栅极和数据线的薄膜晶体管，像素区域中的像素电极并连接到薄膜晶体管，像素电极包括沿着第一方向的水平部分，以及像素区域中的公共电极 并且连接到公共线，所述公共电极包括沿着所述第一方向的水平部分，其中所述像素电极和所述公共电极形成在同一层上。

公开(公告)号：US20110172129A1

公开(公告)日：2011-07-14

申请号：US12985083

申请日：2011-01-05

申请人： Byoung-Su LEE ,  Do-Young LEE

发明人： Byoung-Su LEE ,  Do-Young LEE

IPC分类号： C40B60/12

CPC分类号： H01L27/14603 ,  G01N21/6454 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/1464

摘要： A biochip having an image sensor with a back side illumination photodiode structure includes: a biochip layer; and an image sensor layer attached to one surface of the biochip layer and configured to sense light with biochemical reaction information, which is emitted from the biochip layer, wherein the image sensor layer includes a plurality of light sensing parts which receive the light directed toward a back side of a wafer.

摘要翻译： 具有背面照明光电二极管结构的图像传感器的生物芯片包括：生物芯片层; 以及图像传感器层，其附接到所述生物芯片层的一个表面并且被配置为用从所述生物芯片层发射的生化反应信息感测光，其中所述图像传感器层包括多个光敏部分，所述多个光感测部件接收朝向 晶片背面。