摘要:
Disclosed herein is a thermoelectric module using a thermoelectric element capable of showing a spin Seebeck effect. The present invention provides a new thermoelectric module including: an upper substrate on which a plurality of upper metal electrodes are arranged; a lower substrate on which a plurality of lower metal electrodes are arranged; p-type semiconductor devices and n-type semiconductor devices that are disposed between the upper substrate and the lower substrate and are electrically bonded alternately to each other by the plurality of upper metal electrodes and the plurality of lower metal electrodes; and ferrite elements that are disposed between the p-type semiconductor devices and the n-type semiconductor devices, top ends and bottom ends of the ferrite elements being bonded to the upper metal electrodes and the lower metal electrodes.
摘要:
Disclosed is an asymmetric thermoelectric module, which includes a plurality of first-type thermoelectric semiconductor elements, a plurality of second-type thermoelectric semiconductor elements, a plurality of pairs of assistant layers having different melting points and disposed on the upper and lower surfaces of the first-type and second-type thermoelectric semiconductor elements, and a pair of substrates.
摘要:
Provided is a thermoelectric module applied to an energy storage device cooling system to increase the cooling efficiency. The thermoelectric module includes P-type thermoelectric elements and N-type thermoelectric elements disposed alternately, a metal electrode provided between each P-type thermoelectric element and each N-type thermoelectric element, a heat absorbing plate connected to a bottom side of the metal electrode located between the P-type thermoelectric element and the N-type thermoelectric element, and a heat emitting plate connected to a top side of the metal electrode located between the N-type thermoelectric element and the P-type thermoelectric element.
摘要:
Disclosed herein is a thermoelectric material having a plate type layered structure where each layer has a thickness of 30 nm or less, a method for preparing the same, and a thermoelectric module using the same.According to the present invention, as for a thermoelectric material having a nanometer-sized layered structure, crystallinity of each layer is excellent, electric conductivity of electron is improved, and phonon diffraction is induced at a grain interface between layers, and thus, a thermoelectric module having excellent thermoelectric properties can be provided.
摘要:
The present invention is related to a thermoelectric module and a method for manufacturing the same. The thermoelectric module includes a substrate, a bottom electrode and a thermoelectric semiconductor. The thermoelectric module further includes an insulating layer integrally formed on a whole exposed surface of the bottom electrode, a portion of exposed surface of the thermoelectric semiconductor and a portion of exposed surface of the substrate; a contact hole provided in the insulating layer to expose a portion of a top surface of the thermoelectric semiconductor; and a top electrode to electrically connect at least two thermoelectric semiconductors by being formed on a surface of at least two thermoelectric semiconductors exposed by the contact hole and a portion of a top surface of the insulating layer.
摘要:
Disclosed herein are a piezoelectric module and a sheet for a vehicle including the same. The sheet includes: a seat board part supporting a passenger's lower body; a backplate part formed to be extended in a direction perpendicular to one side of the seat board part and supporting the passenger's upper body; and a piezoelectric module formed in the seat board part and generating warm air or cold air using a flow of a current generated by vehicle vibration to thereby transfer the generated warm air or cold air to the passenger's body.
摘要:
Disclosed herein is a thermoelectric module. The thermoelectric module includes a first substrate, a second substrate, a diffusion prevention layer, and a thermoelectric device, wherein each of the first and second substrates is stacked with: a heat radiation layer performing heat generation reaction or heat adsorption reaction when power is applied to the thermoelectric module; an insulating layer formed on one surface of the heat radiation layer and formed in a first square wave pattern having a first protrusion part and a first groove part; and an electrode layer buried into the first groove part formed on a surface of the insulating layer.
摘要:
The present invention relates to a thermoelectric module, there is provided a thermoelectric module including a metal layer surface treated for securing roughness at one surface thereof and a top substrate and a bottom substrate made of an insulating film formed on the surface treated one surface.
摘要:
Disclosed herein is a thermoelectric material having a plate type layered structure where each layer has a thickness of 30 nm or less, a method for preparing the same, and a thermoelectric module using the same.According to the present invention, as for a thermoelectric material having a nanometer-sized layered structure, crystallinity of each layer is excellent, electric conductivity of electron is improved, and phonon diffraction is induced at a grain interface between layers, and thus, a thermoelectric module having excellent thermoelectric properties can be provided.
摘要:
The present invention provides a method for manufacturing a thermoelectric module and a thermoelectric module manufactured from the same. The method includes the steps of: forming each of first and second green laminates; forming first and second preliminary electrodes by printing a conductive paste on each of the first and second green laminates; disposing thermoelectric elements on any one of the first and second preliminary electrodes; stacking the first and second green laminates in such a manner that the thermoelectric elements are interposed between the first and second preliminary electrodes; and firing the stacked first and second green sheet laminates, thereby forming the first and second electrodes, and first and second ceramic substrates, and simultaneously bonding the first ceramic substrate to the first electrode, the first and second electrodes to the thermoelectric elements, and the second ceramic substrate to the second electrode.