Method of forming a pattern
    1.
    发明授权
    Method of forming a pattern 有权
    形成图案的方法

    公开(公告)号:US09048192B2

    公开(公告)日:2015-06-02

    申请号:US13493146

    申请日:2012-06-11

    摘要: A method of forming a pattern includes forming a mask pattern on a substrate; etching the substrate by deep reactive ion etching (DRIE) and by using the mask pattern as an etch mask; partially removing the mask pattern to expose a portion of an upper surface of the substrate; and etching the exposed portion of the upper surface of the substrate. In the method, when a pattern is formed by DRIE, an upper portion of the pattern does not protrude or scarcely protrudes, and scallops of a sidewall of the pattern are smooth, and thus a conformal material layer may be easily formed on a surface of the pattern.

    摘要翻译: 形成图案的方法包括在基板上形成掩模图案; 通过深反应离子蚀刻(DRIE)蚀刻衬底并通过使用掩模图案作为蚀刻掩模; 部分地去除所述掩模图案以暴露所述基板的上表面的一部分; 并蚀刻衬底的上表面的暴露部分。 在该方法中,当由DRIE形成图案时,图案的上部不突出或几乎不突出,并且图案的侧壁的扇形光滑,因此可以容易地在保护层的表面上形成共形材料层 模式。

    METHOD OF FORMING A PATTERN
    2.
    发明申请
    METHOD OF FORMING A PATTERN 审中-公开
    形成图案的方法

    公开(公告)号:US20150262839A1

    公开(公告)日:2015-09-17

    申请号:US14723652

    申请日:2015-05-28

    IPC分类号: H01L21/3213 H01L21/3065

    摘要: A method of forming a pattern includes forming a mask pattern on a substrate; etching the substrate by deep reactive ion etching (DRIE) and by using the mask pattern as an etch mask; partially removing the mask pattern to expose a portion of an upper surface of the substrate; and etching the exposed portion of the upper surface of the substrate. In the method, when a pattern is formed by DRIE, an upper portion of the pattern does not protrude or scarcely protrudes, and scallops of a sidewall of the pattern are smooth, and thus a conformal material layer may be easily formed on a surface of the pattern.

    摘要翻译: 形成图案的方法包括在基板上形成掩模图案; 通过深反应离子蚀刻(DRIE)蚀刻衬底并通过使用掩模图案作为蚀刻掩模; 部分地去除所述掩模图案以暴露所述基板的上表面的一部分; 并蚀刻衬底的上表面的暴露部分。 在该方法中,当由DRIE形成图案时,图案的上部不突出或几乎不突出,并且图案的侧壁的扇形光滑,因此可以容易地在保护层的表面上形成保形材料层 模式。

    METHOD OF FORMING A PATTERN
    4.
    发明申请
    METHOD OF FORMING A PATTERN 有权
    形成图案的方法

    公开(公告)号:US20120322268A1

    公开(公告)日:2012-12-20

    申请号:US13493146

    申请日:2012-06-11

    IPC分类号: H01L21/302

    摘要: A method of forming a pattern includes forming a mask pattern on a substrate; etching the substrate by deep reactive ion etching (DRIE) and by using the mask pattern as an etch mask; partially removing the mask pattern to expose a portion of an upper surface of the substrate; and etching the exposed portion of the upper surface of the substrate. In the method, when a pattern is formed by DRIE, an upper portion of the pattern does not protrude or scarcely protrudes, and scallops of a sidewall of the pattern are smooth, and thus a conformal material layer may be easily formed on a surface of the pattern.

    摘要翻译: 形成图案的方法包括在基板上形成掩模图案; 通过深反应离子蚀刻(DRIE)蚀刻衬底并通过使用掩模图案作为蚀刻掩模; 部分地去除所述掩模图案以暴露所述基板的上表面的一部分; 并蚀刻衬底的上表面的暴露部分。 在该方法中,当由DRIE形成图案时,图案的上部不突出或几乎不突出,并且图案的侧壁的扇形光滑,因此可以容易地在保护层的表面上形成共形材料层 模式。