-
公开(公告)号:US07381276B2
公开(公告)日:2008-06-03
申请号:US10064451
申请日:2002-07-16
CPC分类号: H01L21/68721 , H01L21/68728 , H01L21/68735
摘要: An apparatus for holding a semiconductor substrate comprises a plate having a pocket which holds the substrate, wherein the pocket comprises a lower surface and an inner edge. The inner edge comprises a plurality of members extending radially inward to reduce the area of contact between the inner edge and the substrate. The beveled edge is inclined so that there is an acute angle between the lower surface of the pocket and the beveled edge.
摘要翻译: 用于保持半导体衬底的装置包括具有保持衬底的口袋的板,其中袋包括下表面和内边缘。 内边缘包括径向向内延伸的多个构件,以减小内缘和衬底之间的接触面积。 倾斜的边缘倾斜,使得在凹槽的下表面和斜边之间存在锐角。