VARIED IMPURITY PROFILE REGION FORMATION FOR VARYING BREAKDOWN VOLTAGE OF DEVICES
    1.
    发明申请
    VARIED IMPURITY PROFILE REGION FORMATION FOR VARYING BREAKDOWN VOLTAGE OF DEVICES 失效
    变化的设备的破坏电压的变化区域形成

    公开(公告)号:US20060270203A1

    公开(公告)日:2006-11-30

    申请号:US10908884

    申请日:2005-05-31

    IPC分类号: H01L21/425

    摘要: Methods are disclosed for forming a varied impurity profile for a collector using scattered ions while simultaneously forming a subcollector. In one embodiment, the invention includes: providing a substrate; forming a mask layer on the substrate including a first opening having a first dimension; and substantially simultaneously forming through the first opening a first impurity region at a first depth in the substrate (subcollector) and a second impurity region at a second depth different than the first depth in the substrate. The breakdown voltage of a device can be controlled by the size of the first dimension, i.e., the distance of first opening to an active region of the device. Numerous different sized openings can be used to provide devices with different breakdown voltages using a single mask and single implant. A semiconductor device is also disclosed.

    摘要翻译: 公开了用于使用散射离子形成收集器的不同杂质分布的同时形成子集电极的方法。 在一个实施例中,本发明包括:提供衬底; 在所述基板上形成掩模层,所述掩模层包括具有第一尺寸的第一开口; 并且基本上同时地通过第一开口形成在衬底(子集电极)中的第一深度处的第一杂质区域和与衬底中的第一深度不同的第二深度的第二杂质区域。 装置的击穿电压可以通过第一尺寸的尺寸,即第一开口到装置的有源区域的距离来控制。 可以使用许多不同尺寸的开口来使用单个掩模和单个植入物来提供具有不同击穿电压的装置。 还公开了一种半导体器件。

    VARIED IMPURITY PROFILE REGION FORMATION FOR VARYING BREAKDOWN VOLTAGE OF DEVICES
    2.
    发明申请
    VARIED IMPURITY PROFILE REGION FORMATION FOR VARYING BREAKDOWN VOLTAGE OF DEVICES 有权
    变化的设备的破坏电压的变化区域形成

    公开(公告)号:US20070275534A1

    公开(公告)日:2007-11-29

    申请号:US11839106

    申请日:2007-08-15

    IPC分类号: H01L21/331

    摘要: Methods are disclosed for forming a varied impurity profile for a collector using scattered ions while simultaneously forming a subcollector. In one embodiment, the invention includes: providing a substrate; forming a mask layer on the substrate including a first opening having a first dimension; and substantially simultaneously forming through the first opening a first impurity region at a first depth in the substrate (subcollector) and a second impurity region at a second depth different than the first depth in the substrate. The breakdown voltage of a device can be controlled by the size of the first dimension, i.e., the distance of first opening to an active region of the device. Numerous different sized openings can be used to provide devices with different breakdown voltages using a single mask and single implant. A semiconductor device is also disclosed.

    摘要翻译: 公开了用于使用散射离子形成收集器的不同杂质分布的同时形成子集电极的方法。 在一个实施例中,本发明包括:提供衬底; 在所述基板上形成掩模层,所述掩模层包括具有第一尺寸的第一开口; 并且基本上同时地通过第一开口形成在衬底(子集电极)中的第一深度处的第一杂质区域和与衬底中的第一深度不同的第二深度的第二杂质区域。 装置的击穿电压可以通过第一尺寸的尺寸,即第一开口到装置的有源区域的距离来控制。 可以使用许多不同尺寸的开口来使用单个掩模和单个植入物来提供具有不同击穿电压的装置。 还公开了一种半导体器件。