公开(公告)号：US20120206870A1

公开(公告)日：2012-08-16

申请号：US13452253

申请日：2012-04-20

申请人： Douglas WEBER ,  Naoto MATSUYUKI ,  David A. PAKULA ,  Evans HANKEY

发明人： Douglas WEBER ,  Naoto MATSUYUKI ,  David A. PAKULA ,  Evans HANKEY

IPC分类号： H05K7/00 ,  C23C4/10

CPC分类号： H05K5/0247 ,  H01Q1/243

摘要： Electronic devices and other apparatuses adapted to receive electromagnetic wave communications are disclosed. An outer housing encloses various device components, including at least an internal antenna located fully therewithin and adapted to receive/send communications from/to an outside source via RF or other electromagnetic waves. A ceramic coating can be a thermal spray coating that covers at least a portion of the outer surface proximate to the internal antenna, and can be “RF transparent”—adapted to allow communications to/from the internal antenna via electromagnetic waves. The outer housing can be plastic, metal or a combination thereof. For metal or other non-RF transparent housings, an RF-transparent insert can be fitted into a window in the housing to permit communications to the internal antenna. The ceramic coating covers some or all of the metal, plastic and/or insert that comprise the outer housing and surface for a final aesthetic finish to the device.

摘要翻译： 公开了适于接收电磁波通信的电子设备和其它设备。 外壳包围各种设备部件，包括至少一个位于其中的内部天线，并且适于经由RF或其它电磁波接收/发送与外部源的通信。 陶瓷涂层可以是覆盖靠近内部天线的外表面的至少一部分的热喷涂，并且可以是“RF透明的”，以允许通过电磁波与内部天线进行通信。 外壳可以是塑料，金属或其组合。 对于金属或其他非RF透明外壳，RF透明插入件可以安装在外壳中的窗口中，以允许与内部天线的通信。 陶瓷涂层覆盖了包括外壳和表面的部分或全部金属，塑料和/或插入物，以便对装置进行最终的美观。

公开(公告)号：US20100103612A1

公开(公告)日：2010-04-29

申请号：US12343335

申请日：2008-12-23

申请人： Douglas WEBER ,  Naoto MATSUYUKI ,  David A. PAKULA ,  Evans HANKEY

发明人： Douglas WEBER ,  Naoto MATSUYUKI ,  David A. PAKULA ,  Evans HANKEY

IPC分类号： H01Q1/38 ,  G06F1/16

CPC分类号： H05K5/0247 ,  H01Q1/243

摘要： Electronic devices and other apparatuses adapted to receive electromagnetic wave communications are disclosed. An outer housing encloses various device components, including at least an internal antenna located fully therewithin and adapted to receive/send communications from/to an outside source via RF or other electromagnetic waves. A ceramic coating can be a thermal spray coating that covers at least a portion of the outer surface proximate to the internal antenna, and can be “RF transparent”—adapted to allow communications to/from the internal antenna via electromagnetic waves. The outer housing can be plastic, metal or a combination thereof. For metal or other non-RF transparent housings, an RF-transparent insert can be fitted into a window in the housing to permit communications to the internal antenna. The ceramic coating covers some or all of the metal, plastic and/or insert that comprise the outer housing and surface for a final aesthetic finish to the device.

摘要翻译： 公开了适于接收电磁波通信的电子设备和其它设备。 外壳包围各种设备部件，包括至少一个位于其中的内部天线，并且适于经由RF或其它电磁波接收/发送与外部源的通信。 陶瓷涂层可以是覆盖靠近内部天线的外表面的至少一部分的热喷涂，并且可以是“RF透明的”，以允许通过电磁波与内部天线进行通信。 外壳可以是塑料，金属或其组合。 对于金属或其他非RF透明外壳，RF透明插入件可以安装在外壳中的窗口中，以允许与内部天线的通信。 陶瓷涂层覆盖了包括外壳和表面的部分或全部金属，塑料和/或插入物，以便对装置进行最终的美观。

公开(公告)号：US20100149735A1

公开(公告)日：2010-06-17

申请号：US12710261

申请日：2010-02-22

申请人： Stephen Paul ZADESKY ,  Evans HANKEY ,  Jonathan P. IVE ,  Rico ZORKENDORFER

发明人： Stephen Paul ZADESKY ,  Evans HANKEY ,  Jonathan P. IVE ,  Rico ZORKENDORFER

IPC分类号： H05K7/00 ,  B29C45/16

CPC分类号： B29C45/162 ,  B29C45/062 ,  Y10T428/1352

摘要： A method for forming an enclosure for enclosing internal electronic components of an electronic device is provided, which comprises: performing a first injection molding process, the first injection molding process forming at least a first wall of the enclosure; allowing the at least a first wall of the enclosure to solidify; thereafter performing a second injection molding process, the second injection molding process forming at least a second wall of the enclosure, the at least a second wall of the enclosure fusing with the at least a first wall of the enclosure during the second injection molding process, the at least second wall of the enclosure forming at least one different side of the enclosure than the at least first wall of the enclosure; and allowing the at least a second wall of the enclosure to solidify, the at least a second wall of the enclosure being integrally formed with the at least a first wall of the enclosure to thereby form a single-piece multi-walled enclosure.

摘要翻译： 提供一种用于形成用于封闭电子设备的内部电子部件的外壳的方法，其包括：执行第一注射成型工艺，所述第一注射成型工艺形成所述外壳的至少第一壁; 允许外壳的至少第一壁固化; 然后执行第二注射成型工艺，所述第二注射成型工艺形成所述外壳的至少第二壁，所述外壳的所述至少第二壁在所述第二注射成型过程期间与所述外壳的所述至少第一壁熔合， 所述外壳的所述至少第二壁形成所述外壳的至少一个不同于所述外壳的至少第一壁的不同侧面; 并且允许所述外壳的所述至少第二壁固化，所述外壳的所述至少第二壁与所述外壳的所述至少第一壁一体地形成，从而形成单件式多壁外壳。

公开(公告)号：US20120228320A1

公开(公告)日：2012-09-13

申请号：US13416855

申请日：2012-03-09

申请人： Jody AKANA ,  Bartley K. ANDRE ,  Jeremy BATAILLOU ,  Daniel J. COSTER ,  Daniele DE IULIIS ,  Evans HANKEY ,  Julian HOENIG ,  Richard P. HOWARTH ,  Jonathan P. IVE ,  Duncan Robert KERR ,  Shin NISHIBORI ,  Matthew Dean ROHRBACH ,  Peter RUSSELL-CLARKE ,  Christopher J. STRINGER ,  Eugene Antony WHANG ,  Rico ZORKENDORFER

发明人： Jody AKANA ,  Bartley K. ANDRE ,  Jeremy BATAILLOU ,  Daniel J. COSTER ,  Daniele DE IULIIS ,  Evans HANKEY ,  Julian HOENIG ,  Richard P. HOWARTH ,  Jonathan P. IVE ,  Duncan Robert KERR ,  Shin NISHIBORI ,  Matthew Dean ROHRBACH ,  Peter RUSSELL-CLARKE ,  Christopher J. STRINGER ,  Eugene Antony WHANG ,  Rico ZORKENDORFER

IPC分类号： B65D51/04 ,  B31B1/62

CPC分类号： B65D5/6667

摘要： A packaging system is configured to package a product to form a packaged product assembly. The packaging system includes a lid including a major panel, side panels, and a tab extending from one of the side panels. The packaging system also includes a box hingedly coupled to the lid that includes side walls and a bottom wall with a slot defined therein. The product may be retained by the lid against the major panel by first and second end flaps. As the lid and box are folded toward one another, the product may be loaded into the box and the tab and an adhesive member coupled thereto may extend through the slot in the bottom wall of the box. The adhesive member may then be adhered to a back surface of the box to retain the product in the packaging system. Related methods are also provided.

摘要翻译： 包装系统被配置为包装产品以形成包装的产品组件。 包装系统包括盖子，其包括主面板，侧面板和从一个侧板延伸的突出部。 包装系统还包括铰接地连接到盖的盒，其包括侧壁和底壁，其中限定有狭槽。 产品可以被盖子通过第一和第二端部翼片抵靠主面板保持。 当盖和箱彼此折叠时，产品可以被装载到箱中，并且接头和与其连接的粘合构件可以延伸穿过箱的底壁中的狭槽。 然后可以将粘合剂部件粘附到箱的后表面以将产品保持在包装系统中。 还提供了相关方法。

公开(公告)号：US20110278312A1

公开(公告)日：2011-11-17

申请号：US13190312

申请日：2011-07-25

申请人： Stephen Paul ZADESKY ,  Evans HANKEY ,  Jonathan P. IVE ,  Rico ZORKENDORFER

发明人： Stephen Paul ZADESKY ,  Evans HANKEY ,  Jonathan P. IVE ,  Rico ZORKENDORFER

IPC分类号： B65D6/00 ,  B29C45/00

CPC分类号： B29C45/162 ,  B29C45/062 ,  Y10T428/1352

摘要： A method for forming an enclosure for enclosing internal electronic components of an electronic device is provided, which comprises: performing a first injection molding process, the first injection molding process forming at least a first wall of the enclosure; allowing the at least a first wall of the enclosure to solidify; thereafter performing a second injection molding process, the second injection molding process forming at least a second wall of the enclosure, the at least a second wall of the enclosure fusing with the at least a first wall of the enclosure during the second injection molding process, the at least second wall of the enclosure forming at least one different side of the enclosure than the at least first wall of the enclosure; and allowing the at least a second wall of the enclosure to solidify, the at least a second wall of the enclosure being integrally formed with the at least a first wall of the enclosure to thereby form a single-piece multi-walled enclosure.

摘要翻译： 提供一种用于形成用于封闭电子设备的内部电子部件的外壳的方法，其包括：执行第一注射成型工艺，所述第一注射成型工艺形成所述外壳的至少第一壁; 允许外壳的至少第一壁固化; 然后执行第二注射成型工艺，所述第二注射成型工艺形成所述外壳的至少第二壁，所述外壳的所述至少第二壁在所述第二注射成型过程期间与所述外壳的所述至少第一壁熔合， 所述外壳的所述至少第二壁形成所述外壳的至少一个不同于所述外壳的至少第一壁的不同侧面; 并且允许所述外壳的所述至少第二壁固化，所述外壳的所述至少第二壁与所述外壳的所述至少第一壁一体地形成，从而形成单件式多壁外壳。