公开(公告)号：US09670392B2

公开(公告)日：2017-06-06

申请号：US14766770

申请日：2014-02-10

Applicant: Dow Corning Corporation

Inventor： Kent Larson ,  Kristen Steinbrecher ,  James Tonge ,  Afrooz Zarisfi

IPC: B05D3/02 ,  C08G77/12 ,  C08G77/14 ,  C08G77/18 ,  C08G77/20 ,  C08K3/22 ,  C08L83/06 ,  C08L83/14 ,  C09J133/14 ,  C09J183/06 ,  C09J183/14

CPC classification number: C09J183/06 ,  B05D3/0272 ,  C08G77/12 ,  C08G77/14 ,  C08G77/18 ,  C08G77/20 ,  C08K3/22 ,  C08K2003/2265 ,  C08L83/06 ,  C08L83/14 ,  C09J133/14 ,  C09J183/14

Abstract: A stable thermal radical curable silicone composition is provided that comprises (I) a clustered functional polyorganopolysiloxane having one or more radical curable groups selected from an acrylate group and a methacrylate group; (II) a reactive resin and polymer; (III) a radical initiator; (IV) a moisture cure initiator; and (V) a crosslinker. The reactive resin and polymer includes (a) an organopolysiloxane polymer and (b) an alkoxy-functional organopolysiloxane resin. The alkoxy-functional organopolysiloxane resin comprises the reaction product of a reaction of (i) an alkenyl-functional siloxane resin, (ii) an alkoxysilane-functional organosiloxane, and (iii) an endcapper in the presence of (iv) hydrosilylation catalyst. The stable thermal radical curable silicone composition can be utilized for electronics applications.

公开(公告)号：US20150376481A1

公开(公告)日：2015-12-31

申请号：US14766770

申请日：2014-02-10

Applicant: DOW CORNING CORPORATION

Inventor： Kent Larson ,  Kristen Steinbrecher ,  James Tonge ,  Afrooz Zarisfi

IPC: C09J183/06 ,  C09J133/14 ,  B05D3/02 ,  C08K3/22

CPC classification number: C09J183/06 ,  B05D3/0272 ,  C08G77/12 ,  C08G77/14 ,  C08G77/18 ,  C08G77/20 ,  C08K3/22 ,  C08K2003/2265 ,  C08L83/06 ,  C08L83/14 ,  C09J133/14 ,  C09J183/14

Abstract: A stable thermal radical curable silicone composition is provided that comprises (I) a clustered functional polyorganopolysiloxane having one or more radical curable groups selected from an acrylate group and a methacrylate group; (II) a reactive resin and polymer; (III) a radical initiator; (IV) a moisture cure initiator; and (V) a crosslinker. The reactive resin and polymer includes (a) an organopolysiloxane polymer and (b) an alkoxy-functional organopolysiloxane resin. The alkoxy-functional organopolysiloxane resin comprises the reaction product of a reaction of (i) an alkenyl-functional siloxane resin, (ii) an alkoxysilane-functional organosiloxane, and (iii) an endcapper in the presence of (iv) hydrosilylation catalyst. The stable thermal radical curable silicone composition can be utilized for electronics applications.

Abstract translation: 提供了稳定的可热固化的硅氧烷组合物，其包含（I）具有一个或多个选自丙烯酸酯基和甲基丙烯酸酯基团的基团可固化基团的聚簇官能聚有机聚硅氧烷; （II）反应性树脂和聚合物; （III）自由基引发剂; （IV）水分固化引发剂; 和（V）交联剂。 反应性树脂和聚合物包括（a）有机聚硅氧烷聚合物和（b）烷氧基官能的有机聚硅氧烷树脂。 烷氧基官能的有机聚硅氧烷树脂包含在（iv）氢化硅烷化催化剂存在下，（i）链烯基官能的硅氧烷树脂，（ii）烷氧基硅烷官能的有机硅氧烷和（iii）端塞的反应的反应产物。 稳定的可热固化的硅氧烷组合物可用于电子应用。