Method For Forming Thermally Conductive Thermal Radical Cure Silicone Compositions
    3.
    发明申请
    Method For Forming Thermally Conductive Thermal Radical Cure Silicone Compositions 审中-公开
    形成导热热固化硅酮组合物的方法

    公开(公告)号:US20150376488A1

    公开(公告)日:2015-12-31

    申请号:US14766774

    申请日:2014-02-10

    Abstract: A method for forming a thermally conductive thermal radical cure silicone composition comprising (I) a clustered functional polyorganopolysiloxane; optionally (II) a silicone reactive diluent, (III) a filler comprising a thermally conductive filler, (III′) a filler treating agent, and (IV) a radical initiator is provided. In this method, the clustered functional polyorganosiloxane (I) and the optional silicone reactive diluent (II) are premade prior to their addition to respective components (III), (III′) and (IV).

    Abstract translation: 一种形成热导热固化硅氧烷组合物的方法,其包含(I)聚簇官能聚有机聚硅氧烷; 任选地(II)硅氧烷反应性稀释剂,(III)包含导热填料,(III')填料处理剂和(Ⅳ)自由基引发剂的填料。 在该方法中,聚簇官能聚有机硅氧烷(I)和任选的硅氧烷反应性稀释剂(II)在加入各组分(III),(III')和(IV)之前是预先形成的。

    Method of Fabricating an Electronic Device
    5.
    发明申请
    Method of Fabricating an Electronic Device 审中-公开
    制造电子设备的方法

    公开(公告)号:US20160197025A1

    公开(公告)日:2016-07-07

    申请号:US14652532

    申请日:2013-10-29

    Abstract: A silicone composition contains I) a shrink additive and II) a curable polyorganosiloxane composition. A method for fabricating an electronic device includes the steps of: 1) interposing the silicone composition between an IHS and a substrate, 2) curing the curable polyorganosiloxane composition to form a cured silicone product, and 3) removing the shrink additive during and/or after step 2), thereby compressing the IHS to the substrate. Compressing occurs as thickness of the cured silicone product decreases, as compared to thickness of the silicone composition interposed in step 1).

    Abstract translation: 有机硅组合物包含I)收缩添加剂和II)可固化聚有机硅氧烷组合物。 一种用于制造电子器件的方法包括以下步骤:1)将硅氧烷组合物插入IHS和衬底之间; 2)固化可固化的聚有机硅氧烷组合物以形成固化的硅氧烷产品,以及3)在和/或 在步骤2)之后,从而将IHS压缩至基底。 与步骤1)中插入的有机硅组合物的厚度相比,随着固化的硅氧烷产品的厚度减小而发生压缩。

    In situ method for forming thermally conductive thermal radical cure silicone composition
    10.
    发明授权
    In situ method for forming thermally conductive thermal radical cure silicone composition 有权
    用于形成导热热固化硅酮组合物的原位方法

    公开(公告)号:US09593275B2

    公开(公告)日:2017-03-14

    申请号:US14766789

    申请日:2014-02-10

    Abstract: An in situ method for forming a thermally conductive thermal radical cure silicone composition is provided. The in situ method comprises forming a thermally conductive clustered functional polymer comprising the reaction product of a reaction of a polyorganosiloxane having an average, per molecule, of at least 2 aliphatically unsaturated organic groups; a polyorganohydrogensiloxane having an average of 4 to 15 silicon atoms per molecule; and a reactive species having, per molecule, at least 1 aliphatically unsaturated organic group and 1 or more curable groups; in the presence of a filler treating agent, a filler comprising a thermally conductive filler, an isomer reducing agent, and a hydrosilylation catalyst. The method further comprises blending the thermally conductive clustered functional polymer with a radical initiator.

    Abstract translation: 提供了一种形成导热热固化硅氧烷组合物的原位方法。 原位方法包括形成导热聚簇官能聚合物,其包含每分子平均具有至少2个不饱和脂族有机基团的聚有机硅氧烷的反应的反应产物; 每分子平均具有4〜15个硅原子的聚有机氢硅氧烷; 和每分子具有至少1个脂族不饱和有机基团和1个或更多个可固化基团的反应性物质; 在填料处理剂的存在下,包含导热填料,异构体还原剂和氢化硅烷化催化剂的填料。 该方法还包括将导热的聚簇官能聚合物与自由基引发剂混合。

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