公开(公告)号：US20170240784A1

公开(公告)日：2017-08-24

申请号：US15505493

申请日：2015-08-20

Applicant: Dow Global Technologies LLC

Inventor： Yi Jin ,  Kim L. Walton ,  Gary R. Marchand ,  Salim Yalvac ,  Allan Walter Mclennaghan ,  Burcak Conley ,  Dean Lee ,  Rongjuan Cong ,  Colin LI Pi Shan

IPC: C09J153/00 ,  C09J7/02

CPC classification number: C09J153/00 ,  C08L23/06 ,  C08L23/14 ,  C08L23/142 ,  C08L53/00 ,  C08L91/06 ,  C08L2201/00 ,  C09J7/35 ,  C09J123/142 ,  C09J123/20 ,  C09J2453/00

Abstract: A hot melt adhesive (HMA) composition includes (A) from 1-60 wt % of a block composite compatibilizer comprising (i) a hard polymer that includes propylene, (ii) a soft polymer that includes ethylene, and (iii) a block copolymer having a soft block and a hard block, the hard block of the block copolymer having the same composition as the hard polymer of the block composite compatibilizer and the soft block of the block copolymer having the same composition as the soft polymer of the block composite compatibilizer; (B) from 1-70 wt % of a tackifier; (C) from 1-40 wt % of at least one selected from the group of a wax and an oil; and (D) Optionally, from greater than zero to 97 wt % of a polymer component that includes an ethylene-based polymer and/or a propylene-based polymer.