公开(公告)号：US11701750B2

公开(公告)日：2023-07-18

申请号：US17099571

申请日：2020-11-16

Applicant: EBARA CORPORATION

Inventor： Yu Ishii ,  Hirotaka Satori ,  Makoto Kashiwagi ,  Manato Furusawa

IPC: B24B37/32 ,  H01L21/683

CPC classification number: B24B37/32 ,  H01L21/6838

Abstract: Provided is a top ring that ensures uniformly pressing a substrate against a polishing pad. A top ring 302 for holding a substrate WF includes a base member 301 coupled to a top ring shaft 18, an elastic film 320 that is mounted to the base member 301 and forms a pressurization chamber 322 for pressurizing the substrate WF between the base member 301 and the elastic film 320, a substrate suction member 330 that includes a porous member 334 including a substrate suction surface 334a for suctioning the substrate WF and a pressure reducing portion 334b communicating with a pressure reducing unit 31. The substrate suction member 330 is held to the elastic film 320.

公开(公告)号：US20230249313A9

公开(公告)日：2023-08-10

申请号：US17099571

申请日：2020-11-16

Applicant: EBARA CORPORATION

Inventor： Yu Ishii ,  Hirotaka Satori ,  Makoto Kashiwagi ,  Manato Furusawa

IPC: B24B37/32 ,  H01L21/683

CPC classification number: B24B37/32 ,  H01L21/6838

Abstract: Provided is a top ring that ensures uniformly pressing a substrate against a polishing pad. A top ring 302 for holding a substrate WF includes a base member 301 coupled to a top ring shaft 18, an elastic film 320 that is mounted to the base member 301 and forms a pressurization chamber 322 for pressurizing the substrate WF between the base member 301 and the elastic film 320, a substrate suction member 330 that includes a porous member 334 including a substrate suction surface 334a for suctioning the substrate WF and a pressure reducing portion 334b communicating with a pressure reducing unit 31. The substrate suction member 330 is held to the elastic film 320.

公开(公告)号：US20210170543A1

公开(公告)日：2021-06-10

申请号：US17099571

申请日：2020-11-16

Applicant: EBARA CORPORATION

Inventor： Yu Ishii ,  Hirotaka Satori ,  Makoto Kashiwagi ,  Manato Furusawa

IPC: B24B37/32 ,  H01L21/683

Abstract: Provided is a top ring that ensures uniformly pressing a substrate against a polishing pad. A top ring 302 for holding a substrate WF includes a base member 301 coupled to a top ring shaft 18, an elastic film 320 that is mounted to the base member 301 and forms a pressurization chamber 322 for pressurizing the substrate WF between the base member 301 and the elastic film 320, a substrate suction member 330 that includes a porous member 334 including a substrate suction surface 334a for suctioning the substrate WF and a pressure reducing portion 334b communicating with a pressure reducing unit 31. The substrate suction member 330 is held to the elastic film 320.