公开(公告)号：US12002704B2

公开(公告)日：2024-06-04

申请号：US16168301

申请日：2018-10-23

Applicant: EBARA CORPORATION

Inventor： Makoto Kashiwagi ,  Manao Hoshina

IPC: H01L21/687 ,  B24B37/10 ,  B24B41/06 ,  G03F7/00 ,  H01L21/677

CPC classification number: H01L21/68764 ,  B24B37/105 ,  B24B41/067 ,  G03F7/707 ,  G03F7/70758 ,  H01L21/67706 ,  H01L21/68728 ,  H01L21/68792

Abstract: A substrate holding apparatus which can enhance the efficiency of processing of a substrate, such as a wafer, is disclosed. The substrate holding apparatus for holding a substrate and rotating the substrate, includes: rollers capable of contacting a periphery of the substrate; a roller rotating mechanism configured to rotate the rollers; and eccentric shafts coupling the rollers and the roller rotating mechanism, the eccentric shafts having first shaft portions and second shaft portions, the second shaft portions being eccentric relative to the first shaft portions, the first shaft portions being secured to the roller rotating mechanism, and the rollers being secured to the second shaft portions, respectively.

公开(公告)号：US11701750B2

公开(公告)日：2023-07-18

申请号：US17099571

申请日：2020-11-16

Applicant: EBARA CORPORATION

Inventor： Yu Ishii ,  Hirotaka Satori ,  Makoto Kashiwagi ,  Manato Furusawa

IPC: B24B37/32 ,  H01L21/683

CPC classification number: B24B37/32 ,  H01L21/6838

Abstract: Provided is a top ring that ensures uniformly pressing a substrate against a polishing pad. A top ring 302 for holding a substrate WF includes a base member 301 coupled to a top ring shaft 18, an elastic film 320 that is mounted to the base member 301 and forms a pressurization chamber 322 for pressurizing the substrate WF between the base member 301 and the elastic film 320, a substrate suction member 330 that includes a porous member 334 including a substrate suction surface 334a for suctioning the substrate WF and a pressure reducing portion 334b communicating with a pressure reducing unit 31. The substrate suction member 330 is held to the elastic film 320.

公开(公告)号：US11180853B2

公开(公告)日：2021-11-23

申请号：US16559251

申请日：2019-09-03

Applicant: Ebara Corporation

Inventor： Yu Ishii ,  Fong-Jie Du ,  Makoto Kashiwagi

IPC: H01L21/68 ,  C23C16/458 ,  C23C16/52 ,  B24B21/00 ,  B24B9/06 ,  B24B37/30 ,  B24B37/005

Abstract: There is disclosed a substrate processing apparatus which can align a center of a substrate, such as a wafer, with a central axis of a substrate stage with high accuracy. The substrate processing apparatus includes: an eccentricity detector configured to obtain an amount of eccentricity and an eccentricity direction of a center of the substrate, when held on a centering stage, from a central axis of the centering stage; and an aligner configured to perform a centering operation of moving and rotating the centering stage until the center of the substrate on the centering stage is located on a central axis of a processing stage. The aligner is configured to calculate a distance by which the centering stage is to be moved and an angle through which the centering stage is to be rotated, based on an initial relative position of the central axis of the centering stage with respect to the central axis of the processing stage, the amount of eccentricity, and the eccentricity direction.

公开(公告)号：US10926376B2

公开(公告)日：2021-02-23

申请号：US16003779

申请日：2018-06-08

Applicant: Ebara Corporation

Inventor： Masayuki Nakanishi ,  Yu Ishii ,  Kenya Ito ,  Keisuke Uchiyama ,  Makoto Kashiwagi

IPC: B24B55/12 ,  B24B21/00 ,  B24B41/06 ,  B24B47/12 ,  B24D11/02 ,  B24B21/08 ,  B24B7/22

Abstract: A method and an apparatus which can efficiently polish an entirety of a back surface, including an outermost area thereof, of a substrate while the back surface of the substrate faces downward are disclosed. The method includes rotating a substrate by rotating a plurality of rollers about their respective own axes while the rollers contact a periphery of the substrate with a back surface of the substrate facing downward; and polishing an entirety of the back surface of the substrate by moving a polishing tool relative to the substrate while supplying a liquid onto the back surface of the substrate and while placing the polishing tool in contact with the back surface of the substrate, the polishing tool being located at a lower side of the substrate.

公开(公告)号：US20200316747A1

公开(公告)日：2020-10-08

申请号：US16825799

申请日：2020-03-20

Applicant: EBARA CORPORATION

Inventor： Kenichi Kobayashi ,  Asagi Matsugu ,  Makoto Kashiwagi ,  Manao Hoshina

IPC: B24B37/32 ,  B24B37/005

Abstract: An elastic member that includes a plurality of pressure chambers is manufactured without using a mold having a complicated shape. According to one embodiment, a laminated membrane used in a substrate holder of a substrate processing apparatus is provided. Such a laminated membrane includes a first sheet material and a second sheet material disposed on the first sheet material. A part of the first sheet material is secured to a part of the second sheet material.

公开(公告)号：US20200306924A1

公开(公告)日：2020-10-01

申请号：US16821281

申请日：2020-03-17

Applicant: EBARA CORPORATION

Inventor： Kenichi Kobayashi ,  Makoto Kashiwagi

IPC: B24B37/32

Abstract: To reduce a risk generated at a time of collision of a substrate with a retainer. According to one embodiment, a head for holding a polygonal substrate as a polishing object of a polishing apparatus is provided. The head includes a substrate holding surface configured to hold a substrate and a retainer positioned outside the substrate holding surface. The retainer has an end region. The end region is arranged adjacent to a corner portion of the substrate held onto the head. The end region has an end surface on a side of the substrate holding surface. The end surface is configured to increase in distance from the substrate holding surface with approaching an end portion in a longitudinal direction of the retainer.

公开(公告)号：US11865665B2

公开(公告)日：2024-01-09

申请号：US16163070

申请日：2018-10-17

Applicant: EBARA CORPORATION

Inventor： Kenichi Kobayashi ,  Masayuki Nakanishi ,  Makoto Kashiwagi ,  Manao Hoshina

IPC: H01L21/02 ,  H01L21/67 ,  B24B37/005 ,  H01L21/687 ,  B24B21/00 ,  B24B37/04 ,  B24B21/10 ,  B24B37/30 ,  B24B41/06 ,  B24B7/22 ,  B24B37/10

CPC classification number: B24B37/042 ,  B24B7/228 ,  B24B21/004 ,  B24B21/008 ,  B24B21/10 ,  B24B37/005 ,  B24B37/105 ,  B24B37/30 ,  B24B41/067 ,  H01L21/0209 ,  H01L21/67034 ,  H01L21/67051 ,  H01L21/68728 ,  H01L21/68742 ,  H01L21/68764

Abstract: A polishing apparatus which can efficiently polish an entirety of a back surface of a substrate, with the back surface facing downward, is disclosed. The polishing apparatus includes: a substrate holder configured to rotate the substrate; a polishing head configured to polish the back surface of the substrate; a tape advancing device; and a translational rotating mechanism configured to cause the polishing head to make a translational rotating motion. The substrate holder includes a plurality of rollers which are rotatable about their own axes. The plurality of rollers have substrate-holding surfaces capable of contacting a periphery of the substrate. The polishing head is disposed below the substrate-holding surfaces. The polishing head includes a polishing blade configured to press the polishing tape against the back surface of the substrate, and a pressing mechanism configured to push the polishing blade upward.

公开(公告)号：US11804398B2

公开(公告)日：2023-10-31

申请号：US17405351

申请日：2021-08-18

Applicant: EBARA CORPORATION

Inventor： Makoto Kashiwagi ,  Mao Izawa

IPC: B25B11/00 ,  H01L21/683 ,  B24B1/00

CPC classification number: H01L21/6838 ,  B24B1/00

Abstract: A workpiece supporting apparatus capable of preventing a surface of a workpiece from drying out while maintaining a suction force when supporting the workpiece with a Bernoulli chuck is disclosed. The workpiece supporting apparatus includes a Bernoulli chuck configured to generate a suction force by emitting a gas; and a liquid ejection member surrounding the Bernoulli chuck and configured to discharge a liquid around the Bernoulli chuck.

公开(公告)号：US11305399B2

公开(公告)日：2022-04-19

申请号：US16530175

申请日：2019-08-02

Applicant: EBARA CORPORATION

Inventor： Kenichi Kobayashi ,  Asagi Matsugu ,  Makoto Kashiwagi ,  Manao Hoshina

IPC: B24B37/34 ,  B25B11/02 ,  B23P19/10 ,  B24B37/32

Abstract: Provided is a jig for assisting the dismounting and mounting of a top ring.
One embodiment provides a jig for mounting/dismounting at least a part of the top ring for holding a substrate. The jig comprises a movable plate for supporting at least a part of the top ring, which is in a dismounted state, a plurality of posts for positioning the jig at a predetermined position relative to the top ring, the plurality of posts being configured to be engaged with the top ring, and a drive mechanism for moving the movable plate in a direction toward and away from the top ring.

公开(公告)号：US20200094371A1

公开(公告)日：2020-03-26

申请号：US16575844

申请日：2019-09-19

Applicant: EBARA CORPORATION

Inventor： Kenichi Akazawa ,  Makoto Kashiwagi ,  Yu Ishii ,  Atsushi Yoshida ,  Kenichi Kobayashi ,  Tetsuji Togawa ,  Hozumi Yasuda

IPC: B24B37/10 ,  B24B41/06 ,  B24B49/16

Abstract: Disclosed is a polishing head for a polishing apparatus for polishing a quadrangular substrate using a polishing pad attached to a polishing table, comprising a head body portion, a plurality of elastic bags disposed in a surface of the head body portion, which is to face the polishing table, and a substrate holding plate for holding the substrate, the substrate holding plate being pressed by the elastic bags in a direction away from the head body portion, the head body portion being provided with channels for bags, which are in communication with the respective elastic bags, the polishing head further including at least two support plates disposed between the elastic bags on one hand and the substrate holding plate on the other, the elastic bags being configured to press the substrate holding plate through the support plates.