公开(公告)号：US09666440B2

公开(公告)日：2017-05-30

申请号：US14142690

申请日：2013-12-27

Applicant: EBARA CORPORATION

Inventor： Masayuki Nakanishi ,  Kenji Kodera ,  Nobuhiro Yanaka

IPC: H01L21/304 ,  B24B9/06 ,  B24B57/02 ,  B24B37/02 ,  B24B9/08 ,  H01L21/02

CPC classification number: H01L21/304 ,  B24B9/065 ,  B24B9/08 ,  B24B37/02 ,  B24B57/02 ,  H01L21/02057 ,  H01L21/02087

Abstract: A polishing apparatus 100 includes a holding stage 4 that holds a central portion of a back surface of a substrate W, a motor M1 that rotates the holding stage 4, a front surface nozzle 36 that feeds a rinse liquid to a front surface of the substrate W, a back surface nozzle 37 that feeds the rinse liquid to a back surface of the substrate W, a rinse liquid control section 110 that feeds the rinse liquid through the back surface nozzle 37 after a preset time elapses since the start of feeding of the rinse liquid through the front surface nozzle 36 and a polishing head assembly 1A that polishes a peripheral portion of the substrate installed on the holding stage 4 after the rinse liquid control section 110 feeds the rinse liquid to the substrate W.