公开(公告)号：US20200171621A1

公开(公告)日：2020-06-04

申请号：US16692092

申请日：2019-11-22

申请人： EBARA CORPORATION

发明人： Takashi Yamazaki ,  Itsuki Kobata ,  Ryuichi Kosuge ,  Tadakazu Sone

IPC分类号： B24B57/02 ,  B24B37/34 ,  B24B37/005 ,  B24B37/10

摘要： A polishing apparatus capable of increasing an added value is disclosed. The polishing apparatus includes a polishing table configured to support a polishing pad, a top ring configured to press a substrate against the polishing pad, and a liquid supply mechanism configured to supply a liquid onto the polishing pad. The liquid supply mechanism includes a nozzle arm configured to be movable in a radial direction of the polishing table, and a liquid ejection nozzle attached to the nozzle arm. The liquid ejection nozzle is a fan-shaped nozzle having a liquid throttle surface having a tapered shape.

公开(公告)号：US11980998B2

公开(公告)日：2024-05-14

申请号：US16796903

申请日：2020-02-20

申请人： EBARA CORPORATION

发明人： Itsuki Kobata ,  Takashi Yamazaki ,  Ryuichi Kosuge ,  Tadakazu Sone

IPC分类号： B24B57/02 ,  B24B37/005 ,  B24B37/34 ,  B24B55/02 ,  B24D13/14 ,  B24D13/20

CPC分类号： B24B57/02 ,  B24B37/005 ,  B24B37/34 ,  B24B55/02 ,  B24D13/147 ,  B24D13/20

摘要： An operation control unit includes a storage device storing a program which includes commands of: obtaining a correlation between a supply position of the polishing liquid in the radial direction of the polishing pad using the liquid injection nozzle and an average polishing rate of the substrate and an distribution of the polishing rate within the substrate; determining a movable range of the liquid injection nozzle according to a predetermined range of an allowable average polishing rate and the correlation between the supply position of the polishing liquid and the average polishing rate; determining an optimal supply position of the polishing liquid from the correlation between the supply position of the polishing liquid and the distribution of the polishing rate within the substrate within the determined movable range of the liquid injection nozzle; and moving the liquid injection nozzle to the determined supply position to polish the substrate.

公开(公告)号：US11839948B2

公开(公告)日：2023-12-12

申请号：US16692092

申请日：2019-11-22

申请人： EBARA CORPORATION

发明人： Takashi Yamazaki ,  Itsuki Kobata ,  Ryuichi Kosuge ,  Tadakazu Sone

IPC分类号： B24B57/02 ,  B24B37/34 ,  B24B37/005 ,  B24B37/10

CPC分类号： B24B57/02 ,  B24B37/005 ,  B24B37/10 ,  B24B37/34

摘要： A polishing apparatus capable of increasing an added value is disclosed. The polishing apparatus includes a polishing table configured to support a polishing pad, a top ring configured to press a substrate against the polishing pad, and a liquid supply mechanism configured to supply a liquid onto the polishing pad. The liquid supply mechanism includes a nozzle arm configured to be movable in a radial direction of the polishing table, and a liquid ejection nozzle attached to the nozzle arm. The liquid ejection nozzle is a fan-shaped nozzle having a liquid throttle surface having a tapered shape.