公开(公告)号：US09532441B2

公开(公告)日：2016-12-27

申请号：US14619521

申请日：2015-02-11

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Jyung Chan Lee ,  Eun Gu Lee ,  Sil Gu Mun ,  Sang Soo Lee

IPC: H05K1/02 ,  H05K3/36 ,  H01P5/02

CPC classification number: H05K1/0219 ,  H01P5/028 ,  H05K1/025 ,  H05K2201/0919 ,  H05K2201/09727 ,  H05K2201/09845 ,  H05K2201/10242 ,  Y10T29/49126

Abstract: A board assembly for transmitting a high-speed signal and a method of manufacturing the same. The board assembly may include a submount board, a base board, and a contact member for a signal line. The submount board may include at least one first high-speed signal line formed on the surface thereof. The base board may include the submount board on one part of the upper surface thereof, and at least second high-speed signal line on the other part of the upper surface thereof, wherein the second high-speed signal lines corresponds to the first high-speed signal lines, respectively. The contact member for the signal line may be installed on the side of the submount board, and have an upper portion contacting the first high-speed signal line and a lower portion contacting the second high-speed signal line such that the first high-speed signal line contacts the second high-speed signal line.

Abstract translation: 用于发送高速信号的电路板组件及其制造方法。 板组件可以包括副安装板，基板和用于信号线的接触构件。 副安装板可以包括形成在其表面上的至少一个第一高速信号线。 基板可以在其上表面的一部分上包括副安装板，并且在其上表面的另一部分上包括至少第二高速信号线，其中第二高速信号线对应于第一高速信号线， 速度信号线。 用于信号线的接触构件可以安装在副安装板的侧面上，并且具有接触第一高速信号线的上部和接触第二高速信号线的下部，使得第一高速信号线 信号线接触第二条高速信号线。

公开(公告)号：US09720192B2

公开(公告)日：2017-08-01

申请号：US14619539

申请日：2015-02-11

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Jyung Chan Lee ,  Eun Gu Lee ,  Sil Gu Mun ,  Sang Soo Lee

IPC: H04B10/00 ,  G02B6/42

CPC classification number: G02B6/4279

Abstract: An interface for transmitting a high-speed signal and an optical module including the same. The interface may include a main substrate and a sub-substrate. The main substrate may have at least one high-speed signal line formed on the upper surface of the main substrate. The sub-substrate may have a first conductive line formed on the lower surface thereof so as to adjust high-speed signal transmission characteristics of the high-speed signal line, wherein the first conductive line may be coupled to the upper surface of the main substrate and partially overlap with the high-speed signal line.