公开(公告)号：US20240228854A1

公开(公告)日：2024-07-11

申请号：US18180609

申请日：2023-03-08

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Hsiang-Yen TSAO ,  Hui-Wen CHANG ,  Jyh-Long JENG

IPC: C09K5/14 ,  C08G59/02 ,  C08G69/40

CPC classification number: C09K5/14 ,  C08G59/02 ,  C08G69/40

Abstract: A polymer is formed by reacting (a) benzaldazine compound with (b1) diamine compound, (b2) dianhydride compound, (b3) epoxy resin, or a combination thereof, wherein (a) benzaldazine compound has a chemical structure of




in which R1 is —NH2, —OH, or




The polymer can be combined with inorganic powder to form a thermal interface material.

公开(公告)号：US20240043605A1

公开(公告)日：2024-02-08

申请号：US18266395

申请日：2022-01-20

Applicant: DAICEL CORPORATION

Inventor： Akihiro SHIBAMOTO ,  Takashi YOSHIMURA ,  Yukio ASAI

IPC: C08G59/02 ,  C08G59/32 ,  C08G65/22 ,  C08G77/14 ,  C08K5/34 ,  C08L83/04 ,  C09D171/02 ,  C09D183/12

CPC classification number: C08G59/02 ,  C08G59/3281 ,  C08G65/22 ,  C08G77/14 ,  C08K5/34 ,  C08L83/04 ,  C09D171/02 ,  C09D183/12

Abstract: Provided is a curable composition that can form a lens having excellent visibility, antiglare effects, and contrast-enhancing effects by suppressing thermal degradation of a tetraazaporphyrin compound. The curable composition according to the present disclosure includes silsesquioxane containing a cyclohexene oxide group, and a tetraazaporphyrin compound having an absorption peak in a wavelength region of from 570 to 605 nm, in which a content of the tetraazaporphyrin compound is from 1000 to 10000 ppm by weight of a content of the silsesquioxane.

公开(公告)号：US11692093B2

公开(公告)日：2023-07-04

申请号：US16648089

申请日：2018-09-18

Applicant: Konica Minolta, Inc.

Inventor： Takeshi Kojima

IPC: C08L33/12 ,  B33Y10/00 ,  B29C64/135 ,  B29C64/371 ,  C08G18/00 ,  C08G59/02 ,  C08K3/22 ,  C08K3/30 ,  C08K3/34 ,  C08K3/40 ,  C08K7/14 ,  C08K9/06 ,  C08L33/08 ,  C08L75/04 ,  C08L83/04 ,  B33Y70/10 ,  B29K33/00 ,  B29K75/00 ,  B29K83/00 ,  B29K305/00 ,  B29K307/04 ,  B29K309/02 ,  B29K309/08

CPC classification number: C08L33/12 ,  B29C64/135 ,  B29C64/371 ,  B33Y10/00 ,  B33Y70/10 ,  C08G18/00 ,  C08G59/02 ,  C08K3/22 ,  C08K3/30 ,  C08K3/346 ,  C08K3/40 ,  C08K7/14 ,  C08K9/06 ,  C08L33/08 ,  C08L75/04 ,  C08L83/04 ,  B29K2033/12 ,  B29K2075/00 ,  B29K2083/00 ,  B29K2205/00 ,  B29K2305/00 ,  B29K2307/04 ,  B29K2309/02 ,  B29K2309/08 ,  C08K2003/2272 ,  C08K2003/3063

Abstract: Provided is a resin composition from which a three-dimensional molding can be produced at an appropriate speed and with high dimensional accuracy, wherein the obtained three-dimensional molding has high strength. This resin composition is used in a method for producing a three-dimensional molding composed of a cured product of a liquid resin composition by selectively irradiating the liquid resin composition with active energy rays. The resin composition includes at least: a first polymerizable compound, in a liquid state at room temperature, having radical polymerizability; a second polymerizable compound, in a liquid state at room temperature, having no radical polymerizability; and a filler, wherein the surface of the filler is covered with the second polymerizable compound.

公开(公告)号：US20180355096A1

公开(公告)日：2018-12-13

申请号：US16000277

申请日：2018-06-05

Applicant: Hexion Inc.

Inventor： Larry Steven Corley ,  Wilbur Paul Ubrich ,  Jennifer W. Chung ,  Amitabh Bansal ,  Terrry Loy

IPC: C08G59/17 ,  C08G59/02 ,  C08J5/04 ,  F03D1/06 ,  B29C70/42 ,  B29C70/54

CPC classification number: C08G59/1466 ,  B29C70/42 ,  B29C70/54 ,  B29K2063/00 ,  B29K2105/0809 ,  B29L2031/085 ,  C08G59/02 ,  C08J5/04 ,  F03D1/0675 ,  F05B2230/20 ,  F05B2240/2211 ,  F05B2280/4003

Abstract: Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including a liquid epoxy resin component including a liquid epoxy resin and an acrylate monomer, a curing agent component including a compound having an imidazole group and, optionally, a co-curing agent for the compound having an imidazole group comprising a phenolic monomer compound, a branched chain carboxylic acid, and combinations thereof, and a non-aromatic polyol compound. The composition may be used to form composites, such as used in commercial wind turbine blade manufacturing.

公开(公告)号：US20180350631A1

公开(公告)日：2018-12-06

申请号：US15899878

申请日：2018-02-20

Applicant: Henkel IP & Holding GmbH

Inventor： Hong Jiang

IPC: H01L21/56 ,  C08L63/00 ,  C08K5/09

CPC classification number: H01L21/563 ,  C08G59/02 ,  C08G59/18 ,  C08G59/20 ,  C08G59/24 ,  C08G59/4014 ,  C08G59/42 ,  C08G59/50 ,  C08G59/5033 ,  C08K3/013 ,  C08K5/09 ,  C08L63/00 ,  C08L2203/16 ,  C08L2203/20 ,  C09D163/00 ,  H01L21/48 ,  H01L23/293

Abstract: This invention relates to thermosetting resin compositions useful for fluxing underfill applications, particularly in the form of a preapplied film.

公开(公告)号：US10074803B2

公开(公告)日：2018-09-11

申请号：US15495360

申请日：2017-04-24

Applicant: NIKON CORPORATION

Inventor： Shohei Koizumi ,  Takashi Sugizaki ,  Kenji Miyamoto ,  Yusuke Kawakami

IPC: C08F2/46 ,  C08G61/04 ,  H01L51/00 ,  H01L51/05 ,  H01L51/10 ,  C08G59/24 ,  C08G59/32 ,  C08G59/66 ,  C08G59/40 ,  C09D5/24 ,  C09D163/00 ,  B32B27/16

CPC classification number: H01L51/0035 ,  B32B27/16 ,  B32B2307/202 ,  B32B2307/206 ,  C07D303/27 ,  C08G18/6237 ,  C08G18/68 ,  C08G59/02 ,  C08G59/245 ,  C08G59/32 ,  C08G59/3218 ,  C08G59/3245 ,  C08G59/4064 ,  C08G59/66 ,  C08G59/68 ,  C08L63/00 ,  C09D5/24 ,  C09D163/00 ,  C09D175/14 ,  G03F7/038 ,  H01L21/02118 ,  H01L21/311 ,  H01L51/0021 ,  H01L51/0023 ,  H01L51/0038 ,  H01L51/0043 ,  H01L51/0097 ,  H01L51/052 ,  H01L51/0545 ,  H01L51/055 ,  H01L51/105 ,  Y10T428/31511 ,  C08L25/18

Abstract: Laminate, method of manufacturing laminate, transistor, and method of manufacturing transistor using a composition having the following (a) to (c): (a) a first organic compound represented by Formula (1) below (R represents a hydrogen atom or a glycidyl group. A plurality of Rs may be identical to or different from each other, but each of at least two Rs is a glycidyl group), (b) a second organic compound represented by Formula (2) below, and (c) a photocationic polymerization initiator

公开(公告)号：US09834639B2

公开(公告)日：2017-12-05

申请号：US14232702

申请日：2012-08-24

Applicant: Urs Burckhardt ,  Steffen Kelch ,  Ulrich Wolf

Inventor： Urs Burckhardt ,  Steffen Kelch ,  Ulrich Wolf

IPC: C09J175/04 ,  C09J163/00 ,  C09J183/00 ,  C08G18/00 ,  C08G18/10 ,  C08G18/83 ,  C08G59/02 ,  C08G59/40 ,  C09D175/04 ,  C09D163/00 ,  C09D183/00 ,  C09K3/10 ,  C09D201/10 ,  C09J201/10 ,  C09D201/02 ,  C09J201/02 ,  C09J183/04 ,  C08L83/06 ,  C08G59/36 ,  C08L75/04 ,  C08L63/00 ,  C08L75/00 ,  C08L83/00

CPC classification number: C08G59/02 ,  C08G18/10 ,  C08G18/831 ,  C08G59/36 ,  C08L63/00 ,  C08L75/00 ,  C08L75/04 ,  C08L83/00 ,  C08L83/06 ,  C09D163/00 ,  C09D175/04 ,  C09D201/025 ,  C09D201/10 ,  C09J163/00 ,  C09J175/04 ,  C09J183/04 ,  C09J201/025 ,  C09J201/10 ,  C08G18/307

Abstract: The present invention relates to a curing agent for moisture-curing compositions which includes at least one aqueous emulsion of at least one epoxy resin. Curing agents according to the invention are especially used for the accelerated curing of moisture-curing compositions which are based on polyurethane polymers that have isocyanate groups or of silane-functional polymers.

公开(公告)号：US09765172B2

公开(公告)日：2017-09-19

申请号：US14894158

申请日：2014-05-26

Applicant: BASF SE

Inventor： Laurence Pottie ,  Juergen Demeter ,  Marie-Claire Hermant

IPC: C08G2/08 ,  C08G65/00 ,  C08G59/02 ,  C08G2/10 ,  C08G2/06 ,  C08G2/18 ,  C08G2/22 ,  C08G4/00 ,  C08L59/04

CPC classification number: C08G2/08 ,  C08G2/06 ,  C08G2/10 ,  C08G2/18 ,  C08G2/22 ,  C08G4/00 ,  C08G59/02 ,  C08G65/00 ,  C08L59/04

Abstract: The patent application relates to a process for preparing polyoxymethylene by polymerization of a reaction mixture (RG) which comprises at least one formaldehyde source and at least one initiator mixture (IG), wherein the initiator mixture (IG) comprises at least one polymerization initiator and at least one solvent of the general formula (I) R1—O—[—R3—O—]m—R2  (I), where m is 1, 2, 3 or 4; R1 and R2 are each, independently of one another, C3-C6-alkyl; R3 is C1-C5-alkylene.

公开(公告)号：US20170218113A1

公开(公告)日：2017-08-03

申请号：US15012868

申请日：2016-02-02

Applicant: SWANCOR INDUSTRIAL CO., LTD.

Inventor： Kok-Sheng TAN ,  Chen-Han CHIEN ,  Yu-Tsan TSENG

IPC: C08G59/50 ,  C08G59/68 ,  C08J5/24 ,  C08G59/02

CPC classification number: C08G59/5033 ,  C08G59/02 ,  C08G59/50 ,  C08G59/621 ,  C08G59/68 ,  C08J5/24 ,  C08J2363/00 ,  C08J2363/02

Abstract: A thermoplastic epoxy matrix formulation, based on 100 parts by weight of the thermoplastic epoxy matrix formulation, includes 0.1 to 95 parts by weight of a difunctional epoxy resin and 0.1 to 80 parts by weight of a latent hardener, wherein the latent hardener is an amine compound containing two reactive hydrogens.

公开(公告)号：US09701822B2

公开(公告)日：2017-07-11

申请号：US14375662

申请日：2013-02-05

Applicant: KANEKA CORPORATION

Inventor： Shuji Taketani ,  Yoshio Furukawa

IPC: C08F220/14 ,  C08L9/10 ,  C08L51/04 ,  C08G59/02 ,  C08L63/00 ,  C08F279/02 ,  C08F2/26 ,  C08G59/32 ,  C08G59/50

CPC classification number: C08L9/10 ,  C08F2/26 ,  C08F279/02 ,  C08G59/02 ,  C08G59/3218 ,  C08G59/3227 ,  C08G59/504 ,  C08L51/04 ,  C08L63/00 ,  C08F212/08 ,  C08F220/44 ,  C08F220/18 ,  C08F220/32 ,  C08F2220/325 ,  C08L81/06 ,  C08F218/08 ,  C08F220/14

Abstract: Provided are a toughness modifier for a curable resin which has good dispersibility in a curable resin containing a thermoplastic resin as well as in a cured product formed from a curable resin composition, and also has an excellent toughness-improving effect; and a curable resin composition containing the toughness modifier. The toughness modifier for a curable resin (D) is obtained by emulsion-polymerizing 5 to 50% by mass of a vinyl monomer (B) in the presence of 50 to 95% by mass of a rubber polymer (A) latex (calculated as the rubber polymer component) using 0.5 to 15 parts by mass of a nonionic reactive surfactant (C) (relative to 100 parts by mass of a total of (A) and (B)).