公开(公告)号：US20200071640A1

公开(公告)日：2020-03-05

申请号：US16555183

申请日：2019-08-29

Applicant: ENF TECHNOLOGY CO., LTD.

Inventor： Du Won LEE ,  Sang Dae LEE ,  Myung Ho LEE ,  Myung Geun SONG

IPC: C11D7/50 ,  C11D11/00 ,  H01L21/027 ,  G03F7/42

Abstract: A thinner composition is capable of reducing the amount of photoresist used in a reducing resist consumption (RRC) coating process, an edge bead removed (EBR) process or the like, and removing unnecessary photoresist on an edge portion or a backside portion of the wafer. The thinner composition includes C1-C10 alkyl C1-C10 alkoxy propionate, propylene glycol C1-C10 alkyl ether, and propylene glycol C1-C10 alkyl ether acetate.