公开(公告)号：US20230094483A1

公开(公告)日：2023-03-30

申请号：US17951429

申请日：2022-09-23

Applicant: ENTEGRIS, INC.

Inventor： Doruk YENER ,  Joseph SOUSA ,  Elango Balu ,  Laundy Oeur ,  Ajoy ZUTSHI

IPC: B24B53/017 ,  B24B37/16 ,  B24B37/14

Abstract: A chemical mechanical planarization (CMP) pad conditioner assembly includes a backing plate including at least one polymer and at least one additive. The at least one additive is present in an amount sufficient to result in a backing plate having at least one of a magnetic property, a color property, a structural property, or any combination thereof. The CMP pad conditioner assembly includes a plurality of segments including a ceramic substrate and a plurality of laser textured protrusions integral with the ceramic substrate. The plurality of laser textured protrusions is coated with a conformal diamond layer.