公开(公告)号：US20230114941A1

公开(公告)日：2023-04-13

申请号：US17950809

申请日：2022-09-22

Applicant: ENTEGRIS, INC.

Inventor： Doruk Yener ,  Joseph Rivers ,  Elango Balu ,  Fadi Abdallah Coder

IPC: B24B53/017

Abstract: A CMP pad conditioner assembly includes a backing plate including a first face including a plurality of first mounting locations and a second face including a plurality of second mounting locations. A plurality of segments is secured to the first face. The segments include a substrate having a first surface and a second surface opposite the first surface. A plurality of protrusions is integral with the substrate protruding away from the first surface. The protrusions are coated with a conformal diamond layer. A plurality of second segments is secured to the second face, the second segments including a substrate having a first surface and a second surface opposite the first surface. Each of the second segments includes a plurality of protrusions integral with the substrate protruding away from the first surface. The protrusions are coated with a conformal diamond layer.

公开(公告)号：US20230094483A1

公开(公告)日：2023-03-30

申请号：US17951429

申请日：2022-09-23

Applicant: ENTEGRIS, INC.

Inventor： Doruk YENER ,  Joseph SOUSA ,  Elango Balu ,  Laundy Oeur ,  Ajoy ZUTSHI

IPC: B24B53/017 ,  B24B37/16 ,  B24B37/14

Abstract: A chemical mechanical planarization (CMP) pad conditioner assembly includes a backing plate including at least one polymer and at least one additive. The at least one additive is present in an amount sufficient to result in a backing plate having at least one of a magnetic property, a color property, a structural property, or any combination thereof. The CMP pad conditioner assembly includes a plurality of segments including a ceramic substrate and a plurality of laser textured protrusions integral with the ceramic substrate. The plurality of laser textured protrusions is coated with a conformal diamond layer.