公开(公告)号：US20240178633A1

公开(公告)日：2024-05-30

申请号：US18505528

申请日：2023-11-09

申请人： EOL CO., LTD

发明人： Su Hyun Kim ,  Dai Hyoung Koo ,  Gi Hwan Myeong

IPC分类号： H01S5/024 ,  H01S5/02218 ,  H01S5/02253 ,  H01S5/40

CPC分类号： H01S5/02423 ,  H01S5/02218 ,  H01S5/02253 ,  H01S5/4012 ,  H01S5/4075

摘要： A laser diode package according to the present disclosure includes a packaging housing unit and a coolant housing unit, wherein the coolant housing unit is coupled to the packaging housing unit, includes a coolant inlet through which coolant is introduced and a coolant outlet through which the coolant is discharged, and has a coolant flow path therein, and laser light source units disposed on a base of the packaging housing unit and each including a laser diode configured to emit a laser beam, wherein the laser light source unit includes a cooler coupled to the base, including a coolant channel connected to the coolant flow path of the coolant housing unit, and having at least an upper surface made of a metal layer, and a submount bonding-coupled to the upper surface of the cooler and having an upper surface to which the laser diode is bonding-coupled.