公开(公告)号：US12040587B2

公开(公告)日：2024-07-16

申请号：US17265283

申请日：2019-12-17

Applicant: SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.

Inventor： Mitsuyoshi Miyata

IPC: H01S3/04 ,  H01S5/02208 ,  H01S5/02218 ,  H01S5/023 ,  H01S5/02345 ,  H01S5/0239 ,  H01S5/024 ,  H01S5/06 ,  H01S5/0687 ,  H01S5/00

CPC classification number: H01S5/02208 ,  H01S5/02218 ,  H01S5/023 ,  H01S5/02345 ,  H01S5/0239 ,  H01S5/02415 ,  H01S5/0612 ,  H01S5/0687 ,  H01S5/0014

Abstract: An optical semiconductor device includes a chassis that has an external wall, a feedthrough that penetrates the external wall of the chassis and has a projection portion projecting toward outside of the chassis from the external wall, a connection terminal that is electrically connected to a component mounted in the chassis and is on the projection portion of the feedthrough, a first temperature detector that is on an external face of the external wall of the chassis and detects a temperature of the chassis, and a flexible substrate of which an end is connected to the connection terminal and of which a portion spaced from the end is connected to the first temperature detector, wherein the first temperature detector is between the external wall and the flexible substrate.

公开(公告)号：US20230198221A1

公开(公告)日：2023-06-22

申请号：US18172120

申请日：2023-02-21

Applicant: Nuvoton Technology Corporation Japan

Inventor： Kazuhiko YAMANAKA

IPC: H01S5/02257 ,  H01S5/00 ,  H01S5/02218 ,  H01S5/023 ,  H01S5/024

CPC classification number: H01S5/02257 ,  H01S5/0064 ,  H01S5/0071 ,  H01S5/02218 ,  H01S5/023 ,  H01S5/02461 ,  H01S5/02469

Abstract: A semiconductor light-emitting device is provided which includes: a wiring substrate; a semiconductor light-emitting element disposed above an upper surface of the wiring substrate; and a cap unit which covers the semiconductor light-emitting element. The wiring substrate includes: a first substrate; a first metal layer and a second metal layer that are spaced apart from each other above the first substrate; and a spacer layer disposed above the first substrate. The cap unit includes a bonding surface which is bonded to the wiring substrate. The bonding surface intersects the first metal layer and the second metal layer in a top view of the wiring substrate, and the spacer layer is disposed between the bonding surface and the first substrate, at a position different from positions of the first metal layer and the second metal layer.

公开(公告)号：US20240297478A1

公开(公告)日：2024-09-05

申请号：US18415663

申请日：2024-01-18

Applicant: Qisda Corporation

Inventor： Wen-Chung Ho ,  Tsung-Hsun Wu ,  Cheng-Hsun Wu

IPC: H01S5/02255 ,  H01S5/02218

CPC classification number: H01S5/02255 ,  H01S5/02218

Abstract: An optical engine module including a plastic housing, a first light source, and a light path turning unit is disclosed. The plastic housing has a first light incident side and a light emerging side. The light emerging side is adjacent to the light incident side. The first light source is disposed on the first light incident side, and configured to emit a first beam. The light path turning unit is disposed in the plastic housing, and configured to turn and transmit the first beam to the light emerging side. A material of the light path turning unit includes metal.

公开(公告)号：US12044956B2

公开(公告)日：2024-07-23

申请号：US17268288

申请日：2019-07-26

Applicant: Sony Corporation

Inventor： Hisayoshi Motobayashi ,  Hidekazu Kawanishi ,  Yoshiro Takiguchi ,  Masahiro Murayama ,  Hiroyuki Miyahara ,  Hitoshi Domon

IPC: G03B21/20 ,  H01S5/02218 ,  H01S5/02255 ,  H01S5/02257 ,  H01S5/02315 ,  H01S5/02325 ,  H01S5/0239 ,  H01S5/024 ,  H01S5/323 ,  H01S5/40

CPC classification number: G03B21/2033 ,  G03B21/208 ,  H01S5/02218 ,  H01S5/02255 ,  H01S5/02257 ,  H01S5/02315 ,  H01S5/02325 ,  H01S5/0239 ,  H01S5/02469 ,  H01S5/32341 ,  H01S5/4031 ,  H01S5/4087

Abstract: A light-emitting device including: a package including a light-emitting element, a reflection member that reflects light outputted from the light-emitting element, and a sealed space that accommodates the light-emitting element and the reflection member; a base plate on which a plurality of the packages is mounted; and lenses opposed to the base plate with the plurality of packages interposed therebetween, the lenses being opposed to the respective packages.

公开(公告)号：US11728618B2

公开(公告)日：2023-08-15

申请号：US17456827

申请日：2021-11-29

Applicant: Cisco Technology, Inc.

Inventor： Frederick W. Warning, Jr.

IPC: H01S5/024 ,  H01S5/40 ,  H01S5/02325 ,  H01S5/02355 ,  H01S5/02218 ,  H01S5/02253

CPC classification number: H01S5/02469 ,  H01S5/02218 ,  H01S5/02325 ,  H01S5/02355 ,  H01S5/4025 ,  H01S5/02253

Abstract: An optoelectronic assembly and methods of fabrication thereof are provided. The assembly includes a sub-mount, one or more micro-devices attached to the sub-mount, and a lid attached to the sub-mount. The lid includes a dispense channel and a gel groove which allows for a thermal gel to be dispensed between the lid and the micro-device in a manner that mitigates the thermal gel dispersing and/or flowing onto components of the micro-devices.

公开(公告)号：US12107386B2

公开(公告)日：2024-10-01

申请号：US17104485

申请日：2020-11-25

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD

Inventor： Matthew Sauter ,  Bryan Lochman ,  Oscar Corripio ,  Bien Chann

IPC: H01S5/024 ,  H01S5/02218 ,  H01S5/0239 ,  H01S5/14

CPC classification number: H01S5/02423 ,  H01S5/02218 ,  H01S5/0239 ,  H01S5/02438 ,  H01S5/146

Abstract: In various embodiments, laser resonators include enclosed cooling manifolds defining protrusions each configured to conduct heat-exchange fluid to a beam emitter in the resonator. Installation of such cooling manifolds may be facilitated via use of a rigid installation tool functioning as a mechanical reference, prior to installation of the beam emitters and sealing of the beam emitters to the cooling manifold.

公开(公告)号：US20240120712A1

公开(公告)日：2024-04-11

申请号：US18265287

申请日：2021-10-15

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Kousuke TORII ,  Kyogo KANEKO

IPC: H01S5/20 ,  H01S5/02218 ,  H01S5/30 ,  H01S5/343 ,  H01S5/40

CPC classification number: H01S5/2031 ,  H01S5/02218 ,  H01S5/3095 ,  H01S5/34313 ,  H01S5/34353 ,  H01S5/4043 ,  H01S2301/18

Abstract: A semiconductor laser element includes a first emitter having a first active layer and a first guide layer, and a second emitter having a second active layer and a second guide layer. A thickness of the first emitter is different from a thickness of the second emitter so that an average value of an index DB1 and an index DB2 represented by equations (1) and (2) is 5% or less,


[Equation 1]



DB1=∫|F1(θ)−F01(θ)|dθ  (1)



[Equation 2]



DB2=∫|F2(θ)−F02(θ)|dθ  (2)

F1(θ) is a far field pattern when it is assumed that only the first emitter is present, and F2(θ) is a far field pattern when it is assumed that only the second emitter is present. F01(θ) is a far field pattern of one of two modes corresponding to a fundamental mode of the light emitted from the first and second emitters, and F02(θ) is a far field pattern of the other one.

公开(公告)号：US20240106188A1

公开(公告)日：2024-03-28

申请号：US18449784

申请日：2023-08-15

Applicant: NICHIA CORPORATION

Inventor： Tadaaki MIYATA

IPC: H01S5/02257 ,  B32B17/06 ,  H01S5/02218

CPC classification number: H01S5/02257 ,  B32B17/061 ,  H01S5/02218 ,  B32B2307/40 ,  B32B2310/021 ,  B32B2311/00 ,  B32B2315/08 ,  B32B2457/00

Abstract: A cap has a cavity for accommodating a light-emitting element and includes a front wall defining a front surface of the cavity and made of a material that transmits light emitted from the light-emitting element; a rear wall defining a rear surface of the cavity and located opposite to the front wall; and a main body defining an upper surface and a lateral surface of the cavity and joined with the front wall and the rear wall. A lower end surface of each of the front wall, the rear wall, and the main body defines a bonding surface of the cap, and the main body includes a plurality of portions layered between the rear wall and the front wall.

公开(公告)号：US11903125B2

公开(公告)日：2024-02-13

申请号：US17478030

申请日：2021-09-17

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Maiko Ariga ,  Yusuke Inaba ,  Kazuki Yamaoka ,  Atsushi Izawa ,  Kazuya Nagashima

IPC: H05K1/02 ,  H01S5/02218

CPC classification number: H05K1/028 ,  H01S5/02218 ,  H05K1/0274 ,  H05K2201/10121

Abstract: An optical module includes a box-shaped housing with an optical element mounted therein. Further, a wiring substrate is bonded to a part of a surface of a housing part of the housing, and an electric wiring, which is formed in the wiring substrate or on a surface of the wiring substrate, and an electric wiring, which is introduced into the housing part or onto a surface of the housing part, are electrically connected to each other.

公开(公告)号：US20230327396A1

公开(公告)日：2023-10-12

申请号：US18189290

申请日：2023-03-24

Applicant: NICHIA CORPORATION

Inventor： Tadaaki MIYATA

IPC: H01S5/024 ,  H01S5/02218 ,  H01S5/02315

CPC classification number: H01S5/02453 ,  H01S5/02218 ,  H01S5/02315 ,  H01S5/02476

Abstract: A light source device includes: a substrate having a support face; a lateral wall part disposed on the substrate and having an upper face and inner wall faces, the inner wall faces defining a space; a laser diode located in the space; a first submount having a mounting face bonded to an upper face of the laser diode, and an upper face located opposite the mounting face; a sealing member bonded to the upper face of the lateral wall part and the upper face of the first submount, thereby sealing the space; a heat dissipating block located above the first submount; and a heat conducting member located between the first submount and the heat dissipating block.