SOLDERING APPARATUS
    1.
    发明公开
    SOLDERING APPARATUS 审中-公开

    公开(公告)号:US20230143773A1

    公开(公告)日:2023-05-11

    申请号:US17983689

    申请日:2022-11-09

    申请人: ERSA GmbH

    IPC分类号: B23K1/00 B23K3/08

    摘要: Soldering apparatus, in particular a reflow soldering apparatus, for the continuous soldering of printed circuit boards along a transport direction, with an entry and an exit for feeding and removing the printed circuit boards, with a process channel including a preheating zone, a soldering zone and/or a cooling zone, and including a main body and at least one cover hood movable between a closed position and an open position, the cover hood enclosing a hood compartment above the process channel in which fan motors are provided. A central suction channel is provided in the hood compartment, in that the first suction elements connected to the suction channel in the hood compartment are provided for the suction of hood compartment air from the hood compartment, in that second suction elements connected to the suction channel in the hood compartment are provided for the suction of process gas from the process channel, and in that a switching device is provided and is configured to switch between an operating mode in which hood compartment air is suctioned via the first suction elements and a cooling mode in which process gas is suctioned via the second suction elements.

    Soldering apparatus
    2.
    发明授权

    公开(公告)号:US12115591B2

    公开(公告)日:2024-10-15

    申请号:US17983689

    申请日:2022-11-09

    申请人: ERSA GmbH

    摘要: Soldering apparatus, in particular a reflow soldering apparatus, for the continuous soldering of printed circuit boards along a transport direction, with an entry and an exit for feeding and removing the printed circuit boards, with a process channel including a preheating zone, a soldering zone and/or a cooling zone, and including a main body and at least one cover hood movable between a closed position and an open position, the cover hood enclosing a hood compartment above the process channel in which fan motors are provided. A central suction channel is provided in the hood compartment, in that the first suction elements connected to the suction channel in the hood compartment are provided for the suction of hood compartment air from the hood compartment, in that second suction elements connected to the suction channel in the hood compartment are provided for the suction of process gas from the process channel, and in that a switching device is provided and is configured to switch between an operating mode in which hood compartment air is suctioned via the first suction elements and a cooling mode in which process gas is suctioned via the second suction elements.

    SOLDERING SYSTEM
    3.
    发明公开
    SOLDERING SYSTEM 审中-公开

    公开(公告)号:US20230147525A1

    公开(公告)日:2023-05-11

    申请号:US17982621

    申请日:2022-11-08

    申请人: ERSA GmbH

    IPC分类号: B23K3/08 H05K3/34

    摘要: Soldering system, in particular a reflow soldering system, for continuous soldering of printed circuit boards along a transport direction, that includes a process channel having a preheating zone, at least one of a soldering zone and a cooling zone, including a main body, at least one covering hood that is pivotable about a hood axis between a closed position, in which the process channel is closed, and an open position, in which the covering hood is open and the process channel is accessible.

    SOLDERING APPARATUS
    4.
    发明公开
    SOLDERING APPARATUS 审中-公开

    公开(公告)号:US20230142133A1

    公开(公告)日:2023-05-11

    申请号:US17983608

    申请日:2022-11-09

    申请人: ERSA GmbH

    IPC分类号: B23K1/00

    CPC分类号: B23K1/0016 B23K2101/42

    摘要: A soldering apparatus, in particular a reflow soldering apparatus, for continuous soldering of printed circuit boards along a transport direction, having a process channel including a preheating zone, a soldering zone and a cooling zone, having fan units for circulating process gas in the process channel, wherein the fan units each comprise an electric fan motor and a fan wheel, and having at least one apparatus element, wherein the soldering apparatus can be operated in an operating mode in which the fan motors are controlled in such a way that they are operated at a constant or largely constant rotational speed, as a result of which process gas is conducted through the at least one apparatus element and is then drawn in again by the respective fan units. At least one and preferably a plurality of current measuring units are provided that, in the operating mode, measure the current strength consumed by the relevant fan motor over time, and in that at least one evaluation unit is provided and configured such that a control signal is generated by the at least one evaluation unit if the relevant measured current strength falls below or exceeds a threshold value.