公开(公告)号：US20170175255A1

公开(公告)日：2017-06-22

申请号：US15118416

申请日：2015-02-13

Applicant: EVATEC ADVANCED TECHNOLOGIES AG

Inventor： Oliver RATTUNDE ,  Hans HIRSCHER

IPC: C23C14/54 ,  C23C14/34 ,  C23C14/04 ,  H01J37/34 ,  H01J37/20

CPC classification number: C23C14/542 ,  C23C14/046 ,  C23C14/34 ,  C23C14/3492 ,  H01J37/20 ,  H01J37/347

Abstract: A film is sputter-deposited on an essentially plane, extended surface of a substrate which has recesses therein, namely at least one of grooves, of holes, of bores, of vias, of trenches. So as to establish on one hand a homogeneous thickness distribution of the film along the addressed surface of the substrate and, on the other hand, a thick film deposition within the recesses, sputter deposition is performed first at a large distance between a sputter surface of a target and the addressed surface of the substrate and then at a reduced distance between the addressed surfaces.