公开(公告)号：US11965070B2

公开(公告)日：2024-04-23

申请号：US17453102

申请日：2021-11-01

Applicant: East China University of Science and Technology

Inventor： Qixin Zhuang ,  Zhe Zhang ,  Xiaoyun Liu ,  Jian Xu ,  Wentao Wang ,  Zeyang Wu ,  Xiaohan Wu ,  Lihui Li

IPC: C08J5/18 ,  C01B33/148 ,  C08K3/36 ,  C08K7/18 ,  C08K7/26 ,  C08K9/04 ,  C08L79/04

CPC classification number: C08J5/18 ,  C01B33/148 ,  C08K7/26 ,  C08L79/04 ,  C01P2004/34 ,  C01P2006/16 ,  C08J2339/00 ,  C08J2379/04 ,  C08K3/36 ,  C08K7/18 ,  C08K9/04

Abstract: The disclosure relates to the field of electronic materials, and in particular to a composite film of fluorinated polybenzoxazole (6FPBO) and triple-shelled mesoporous silica hollow spheres, and to its preparation and use. The composite film comprises fluorinated polybenzoxazole as a matrix and amino-functionalized triple-shelled mesoporous silica hollow spheres which are dispersed in the fluorinated polybenzoxazole matrix. A mass ratio of (amino-functionalized triple-shelled mesoporous silica hollow spheres)/(fluorinated polybenzoxazole) is 1/100 to 5/100. The composite film has excellent thermal stability and a lower dielectric constant.