公开(公告)号：US20160192506A1

公开(公告)日：2016-06-30

申请号：US14583555

申请日：2014-12-26

Applicant: Echostar Technologies LLC

Inventor： Andros THOMSON ,  YT HO

IPC: H05K3/34 ,  H05K1/18

CPC classification number: H05K3/3447 ,  H05K1/115 ,  H05K3/0047 ,  H05K2201/09845 ,  H05K2203/0207

Abstract: An approach for through-hole component soldering for a PCB, and a resulting PCB assembly, that eliminates protruding solder joints, is provided. The approach comprises back-drilling, from a bottom surface of a PCB, one or more through-holes, wherein each back-drilled through-hole is back-drilled to a depth partially through the PCB and at a diameter that is larger than the diameter of the through hole. Solder paste is applied to the PCB. The components are placed on the PCB, inserting each pin into a corresponding through-hole. The PCB is passed through a solder process, whereby, within each through-hole having a component pin inserted therein, the solder paste is wicked into the through-hole, and forms a solder joint with the respective pin. Each solder joint of a back-drilled through-hole is situated within the through-hole in a manner whereby the solder joint does not protrude beyond the bottom surface of the PCB.

Abstract translation: 提供了一种用于PCB的通孔部件焊接的方法，以及消除突出的焊点的所得PCB组件。 该方法包括从PCB的底表面回钻一个或多个通孔，其中每个后钻通孔被深深地深深地深深地深深地穿过PCB并且直径大于 通孔的直径。 焊膏应用于PCB。 将部件放置在PCB上，将每个插头插入相应的通孔中。 PCB通过焊接工艺，由此在其中插入有部件销的每个通孔内，焊膏被吸入通孔中，并与相应的销形成焊接接头。 背面钻孔的每个焊点都位于通孔内，焊接接头不会突出超过PCB底面。