公开(公告)号：US5285690A

公开(公告)日：1994-02-15

申请号：US825620

申请日：1992-01-24

申请人： Edward F. Koen ,  Robert D. Vernon

发明人： Edward F. Koen ,  Robert D. Vernon

IPC分类号： G01L9/04 ,  G01L9/00 ,  G01L9/12 ,  G01L27/00 ,  H01L29/84 ,  G01L9/06

CPC分类号： G01L19/0084 ,  G01L19/147 ,  G01L27/007 ,  G01L9/0042 ,  Y10T29/49103

摘要： A pressure sensor sub-assembly (18) has a solid-state sensing element (22) mounted on a laminated ceramic substrate (20) and has the electrical signal contacts (22a) on the sensing element electrically connected to connector pins (24) on the substrate. A manufacturing process can fabricate a batch of sub-assemblies on a substrate structure that is sub-divided to form the separate sub-assemblies. The sensor sub-assemblies can be tested, and graded, before or after the sub-division step, and then each mounted in a housing.

摘要翻译： 压力传感器子组件（18）具有安装在层叠陶瓷衬底（20）上的固态感测元件（22），并且在感测元件上具有电连接到连接器销（24）上的电信号触点（22a） 底物。 制造过程可以在被分割以形成单独的子组件的衬底结构上制造一批子组件。 传感器子组件可以在分割步骤之前或之后进行测试和分级，然后每个安装在外壳中。

公开(公告)号：US5407501A

公开(公告)日：1995-04-18

申请号：US150838

申请日：1993-11-12

申请人： Edward F. Koen ,  Robert D. Vernon

发明人： Edward F. Koen ,  Robert D. Vernon

IPC分类号： G01L9/04 ,  G01L9/00 ,  G01L9/12 ,  G01L27/00 ,  H01L29/84 ,  G01L9/06 ,  B32B31/00

CPC分类号： G01L19/0084 ,  G01L19/147 ,  G01L27/007 ,  G01L9/0042 ,  Y10T29/49103

摘要： A pressure sensor sub-assembly (18) has a solid-state sensing element (22) mounted on a laminated ceramic substrate (20) and has the electrical signal contacts (22a) on the sensing element electrically connected to connector pins (24) on the substrate. A manufacturing process can fabricate a batch of sub-assemblies on a substrate structure that is sub-divided to form the separate sub-assemblies. The sensor sub-assemblies can be tested, and graded, before or after the sub-division step, and then each mounted in a housing.

摘要翻译： 压力传感器子组件（18）具有安装在层叠陶瓷衬底（20）上的固态感测元件（22），并且在感测元件上具有电连接到连接器销（24）上的电信号触点（22a） 底物。 制造过程可以在被分割以形成单独的子组件的衬底结构上制造一批子组件。 传感器子组件可以在分割步骤之前或之后进行测试和分级，然后每个安装在外壳中。

公开(公告)号：US5616863A

公开(公告)日：1997-04-01

申请号：US569402

申请日：1995-12-06

申请人： Edward F. Koen

发明人： Edward F. Koen

IPC分类号： G01P1/02 ,  G01P15/08 ,  H01L21/58 ,  H01L23/02 ,  H01L29/84

CPC分类号： G01P1/023 ,  G01P15/08 ,  G01P15/0802 ,  H01L2224/48091 ,  H01L2224/48247

摘要： Micro-machined accelerometer chips have a sensitive axis perpendicular to the principle surface of the device. In an application where the desired sensing direction is in the plane of a supporting printed circuit board, the accelerometer cannot be mounted directly on the printed circuit board and instead is mounted on a wall perpendicular to the printed circuit board. This requirement to wall-mount the sensor is eliminated by using an accelerometer chip packaged with a signal conditioning circuit in a multi layer ceramic chip carrier. Electrical connections are contained within the layers of the ceramic and terminate at a side surface of the chip carrier. Thus the accelerometer chip sits perpendicular to the printed circuit board and the ceramic chip carrier is attached directly thereto.

摘要翻译： 微加工的加速度计芯片具有垂直于装置主要表面的敏感轴。 在所需感测方向位于支撑印刷电路板的平面中的应用中，加速度计不能直接安装在印刷电路板上，而是安装在垂直于印刷电路板的壁上。 通过在多层陶瓷芯片载体中使用与信号调理电路封装的加速度计芯片来消除对壁挂式传感器的要求。 电连接包含在陶瓷层内并终止于芯片载体的侧表面。 因此，加速度计芯片垂直于印刷电路板，并且陶瓷芯片载体直接附接到其上。

公开(公告)号：US5503016A

公开(公告)日：1996-04-02

申请号：US189948

申请日：1994-02-01

申请人： Edward F. Koen

发明人： Edward F. Koen

IPC分类号： G01P1/02 ,  G01P15/08 ,  H01L21/58 ,  H01L23/02 ,  H01L29/84

CPC分类号： G01P1/023 ,  G01P15/08 ,  G01P15/0802 ,  H01L2224/48091 ,  H01L2224/48247

摘要： Micro-machined accelerometer chips have a sensitive axis perpendicular to the principle surface of the device. In an application where the desired sensing direction is in the plane of a supporting printed circuit board, the accelerometer cannot be mounted directly on the printed circuit board and instead is mounted on a wall perpendicular to the printed circuit board. This requirement to wall-mount the sensor is eliminated by using an accelerometer chip packaged with a signal conditioning circuit in a multi layer ceramic chip carrier. Electrical connections are contained within the layers of the ceramic and terminate at a side surface of the chip carrier. Thus the accelerometer chip sits perpendicular to the printed circuit board and the ceramic chip carrier is attached directly thereto.

摘要翻译： 微加工的加速度计芯片具有垂直于装置主要表面的敏感轴。 在所需感测方向位于支撑印刷电路板的平面中的应用中，加速度计不能直接安装在印刷电路板上，而是安装在垂直于印刷电路板的壁上。 通过在多层陶瓷芯片载体中使用与信号调理电路封装的加速度计芯片来消除对壁挂式传感器的要求。 电连接包含在陶瓷层内并终止于芯片载体的侧表面。 因此，加速度计芯片垂直于印刷电路板，并且陶瓷芯片载体直接附接到其上。

公开(公告)号：US5461922A

公开(公告)日：1995-10-31

申请号：US98182

申请日：1993-07-27

申请人： Edward F. Koen

发明人： Edward F. Koen

IPC分类号： G01L9/00

CPC分类号： G01L19/143 ,  G01L19/003 ,  G01L19/0038 ,  G01L19/0645

摘要： A pressure transducer is provided for measuring pressure within a measurand environment, the transducer comprising a header which includes a substantially nondeformable molded housing formed from a first thermoplastic material defining a cavity and first and second openings into the cavity and a resilient diaphragm formed from the first thermoplastic material molded to the housing and spanning the first opening; a pressure sensing device disposed within the housing; and a pressure transfer medium disposed within the cavity so as to couple the diaphragm to the pressure sensing device.

摘要翻译： 提供用于测量被测量环境内的压力的压力传感器，换能器包括集管，该集管包括基本上不可变形的模制壳体，其由限定空腔的第一热塑性材料形成，并且第一和第二开口进入空腔，弹性膜由第一 模制到壳体并跨越第一开口的热塑性材料; 设置在所述壳体内的压力感测装置; 以及设置在所述腔内的压力传递介质，以将所述隔膜耦合到所述压力感测装置。

公开(公告)号：US4993265A

公开(公告)日：1991-02-19

申请号：US362113

申请日：1989-06-05

申请人： Edward F. Koen ,  Richard Tasker

发明人： Edward F. Koen ,  Richard Tasker

IPC分类号： G01L9/00 ,  G01L19/06

CPC分类号： G01L19/003 ,  G01L19/0084 ,  G01L19/0627 ,  G01L19/0645 ,  G01L19/147 ,  Y10T29/49004 ,  Y10T29/49172

摘要： A solid state measurand sensor is described in which the pressure sensor element is protected from the measurand by a combination of a pressure transfer medium and a thin covering membrane. A method is described for forming the diaphragm in situ. The diaphragm material is selected from a group of materials which includes fluorosilicone, so as to substantially avoid entrapment of air or formation of voids in the pressure transfer medium such as would degrade the performance of the sensor. The pressure transfer medium is gel-like material such as dimethyl silicone and equivalents. Alternatively, the gel may be fluorosilicone and the diaphragm may be dimethyl silicone. The membrane material is chosen to be substantially impermeable to the ambients or process media being measured and also flexible, is to be poured and cured in place on the assembly during fabrication.

摘要翻译： 描述了一种固态测量传感器，其中通过压力传递介质和薄覆盖膜的组合来保护压力传感器元件免受被测量。 描述了用于在原位形成隔膜的方法。 隔膜材料选自包含氟硅氧烷的一组材料，以便基本上避免空气夹带或在压力传递介质中形成空隙，例如会降低传感器的性能。 压力转移介质是诸如二甲基硅氧烷和等同物的凝胶状材料。 或者，凝胶可以是氟硅氧烷，并且隔膜可以是二甲基硅氧烷。 膜材料被选择为对被测量的环境或加工介质基本上不可渗透，并且也是柔性的，在制造期间将其倾倒并固化在组件上的适当位置。