摘要:
A removable component for use with an earphone is disclosed. As an example, the removable component can be an ear tip. According to one aspect, an improved ear tip can be provided for use with a headphone. The ear tip is suitable for in-ear operation and can have a cosmetic deformable outer member. The deformable outer member can enable the ear tip to readily conform to a user's ear. The ear tip can also include an inner member to structurally support the outer member and to facilitate attachment to a headphone. Methods for forming such ear tips are also disclosed.
摘要:
A removable component for use with an earphone is disclosed. As an example, the removable component can be an ear tip. According to one aspect, an improved ear tip can be provided for use with a headphone. The ear tip is suitable for in-ear operation and can have a cosmetic deformable outer member. The deformable outer member can enable the ear tip to readily conform to a user's ear. The ear tip can also include an inner member to structurally support the outer member and to facilitate attachment to a headphone. Methods for forming such ear tips are also disclosed.
摘要:
A removable component for use with an earphone is disclosed. As an example, the removable component can be an ear tip. According to one aspect, an improved ear tip can be provided for use with a headphone. The ear tip is suitable for in-ear operation and can have a cosmetic deformable outer member. The deformable outer member can enable the ear tip to readily conform to a user's ear. The ear tip can also include an inner member to structurally support the outer member and to facilitate attachment to a headphone. Methods for forming such ear tips are also disclosed.
摘要:
A removable component for use with an earphone is disclosed. As an example, the removable component can be an ear tip. According to one aspect, an improved ear tip can be provided for use with a headphone. The ear tip is suitable for in-ear operation and can have a cosmetic deformable outer member. The deformable outer member can enable the ear tip to readily conform to a user's ear. The ear tip can also include an inner member to structurally support the outer member and to facilitate attachment to a headphone. Methods for forming such ear tips are also disclosed.
摘要:
Methods, apparatus and systems which provide buttons oriented at angles relative to each other as a part of a multiple function switch are described. In one embodiment, the multiple function switch is part of an inline controller that is suitable for use to control features or functions of a portable electronic device. A multiple function switch may be incorporated in a cable associated with an earpiece arranged to be interfaced with a portable electronic device.
摘要:
Methods, apparatus and systems which provide buttons oriented at angles relative to each other as a part of a multiple function switch are disclosed. In one embodiment, the multiple function switch is part of an inline controller that is suitable for use to control features or functions of a portable electronic device.
摘要:
An array of domes is constructed from a single sheet of conductive material. For example, several domes can be stamped at a preset distribution within a sheet of metal. The domes can be placed at any suitable position along the surface of the material, including for example at positions defined by the locations of contact pads on a circuit board. The conductive material can be electrically coupled to the circuit board at any suitable location, including for example along an edge of the piece of material. In some embodiments, the sheet of material can extend around the side walls of the circuit board. The sheet of material can be electrically coupled to the bottom of the circuit board, for example by soldering. This approach may provide a water resistant dome switch, whereby water can be prevented from leaking between the dome and the circuit board.
摘要:
An array of domes is constructed from a single sheet of conductive material. For example, several domes can be stamped at a preset distribution within a sheet of metal. The domes can be placed at any suitable position along the surface of the material, including for example at positions defined by the locations of contact pads on a circuit board. The conductive material can be electrically coupled to the circuit board at any suitable location, including for example along an edge of the piece of material. In some embodiments, the sheet of material can extend around the side walls of the circuit board, for example bent around the periphery of the circuit board. The sheet of material can be electrically coupled to the bottom of the circuit board, for example by soldering. This approach may provide a water resistant dome switch, whereby water can be prevented from leaking between the dome and the circuit board.
摘要:
An array of domes is constructed from a single sheet of conductive material. For example, several domes can be stamped at a preset distribution within a sheet of metal. The domes can be placed at any suitable position along the surface of the material, including for example at positions defined by the locations of contact pads on a circuit board. The conductive material can be electrically coupled to the circuit board at any suitable location, including for example along an edge of the piece of material. In some embodiments, the sheet of material can extend around the side walls of the circuit board. The sheet of material can be electrically coupled to the bottom of the circuit board, for example by soldering. This approach may provide a water resistant dome switch, whereby water can be prevented from leaking between the dome and the circuit board.
摘要:
An array of domes is constructed from a single sheet of constructed material. For example, several domes can be stamped at a preset distribution within a sheet of metal. The domes can be placed at any suitable position along the surface of the material, including for example at positions defined by the locations of contact pads on a circuit board. The conductive material can be electrically coupled to the circuit board at any suitable location, including for example along an edge of the piece of material. In some embodiments, the sheet of material can extend around the side walls of the circuit board, for example bent around the periphery of the circuit board. The sheet of material can be electrically coupled to the bottom of the circuit board, for example by soldering. This approach may provide a water resistant dome switch, whereby water can be prevented from leaking between the dome and the circuit board.