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1.发明授权Isocyanate resin compositions and hot melt and pressure sensitive adhesives based thereon 失效异氰酸酯树脂组合物和基于其的热熔和压敏粘合剂
公开(公告)号：US5633317A
公开(公告)日：1997-05-27
申请号：US301934
申请日：1994-09-07
CPC分类号： C09J175/00 , C08G18/10 , C08G18/6225 , C08G18/728 , C08L51/003 , C08G2170/20 , C08G2170/40
摘要： A resin composition containing graft copolymer having at least one isocyanate group and 10,000 to 20,000 number-average molecular weight or high-molecular-weight polymer having at least one isocyanate group and 10,000 to 200,000 number-average molecular weight, and low-molecular-weight polymer having or not having an isocyanate group and 500 to 8,000 number-average molecular weight. This resin composition has tackiness at ordinary temperature, and long pot life. It can be used for reactive hot melt type adhesives (which can omit hot press process), reactive hot melt type pressure-sensitive adhesives, or coating material.
摘要翻译： 一种树脂组合物，含有具有至少一个异氰酸酯基和10,000至20,000数均分子量的接枝共聚物或具有至少一个异氰酸酯基和10,000至200,000数均分子量的数均分子量的高分子量聚合物和低分子量 具有或不具有异氰酸酯基的聚合物和数均分子量为500-8,000。 该树脂组合物在常温下具有粘性，使用寿命长。 它可用于反应性热熔型粘合剂（可以省略热压工艺），反应性热熔型压敏粘合剂或涂料。
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2.发明授权Isocyanate resin compositions and hot melt and pressure sensitive adhesives based thereon 失效异氰酸酯树脂组合物和基于其的热熔和压敏粘合剂
公开(公告)号：US5418288A
公开(公告)日：1995-05-23
申请号：US22870
申请日：1993-01-15
CPC分类号： C09J175/00 , C08G18/10 , C08G18/6225 , C08G18/728 , C08L51/003 , C08G2170/20 , C08G2170/40
摘要： There is disclosed a resin composition containing graft copolymer having at least one isocyanate group and 10,000 to 20,000 of number-average molecular weight or high-molecular-weight polymer having at least one isocyanate group and 10,000 to 200,000 of number-average molecular weight, and low-molecular-weight polymer having or not having an isocyanate group and 500 to 8,000 of number-average molecular weight is disclosed. This resin composition has tackiness at ordinary temperature, and long pot life. It can be used to reactive hot melt type adhesives (which can omit hot press process), reactive hot melt type pressure-sensitive adhesives, or coating material.
摘要翻译： 公开了含有至少一种异氰酸酯基和数均分子量为10,000〜20,000，具有至少一个异氰酸酯基和数均分子量为10,000〜200,000的高分子量聚合物的接枝共聚物的树脂组合物，以及 公开了具有或不具有异氰酸酯基的低分子量聚合物和数均分子量为500-8,000的低分子量聚合物。 该树脂组合物在常温下具有粘性，使用寿命长。 它可用于反应性热熔型粘合剂（可以省略热压工艺），反应性热熔型压敏粘合剂或涂料。
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3.发明授权Oiled-face adherable, hot-melt adhesive composition and a non-slip processing method of metal scaffolding board 失效油性粘合剂，热熔粘合剂组合物和金属螯合板的非滑动加工方法
公开(公告)号：US5095059A
公开(公告)日：1992-03-10
申请号：US675611
申请日：1991-03-27
申请人： Tadashi Kitamura , Kiyoto Doi , Eiichi Kawasaki , Kenichi Yashiro
发明人： Tadashi Kitamura , Kiyoto Doi , Eiichi Kawasaki , Kenichi Yashiro
IPC分类号： C09J151/00 , C09J157/06 , C09J201/02
CPC分类号： C09J157/06 , C09J151/003 , C09J201/02
摘要： The invention provides oiled-face adherable, hot-melt adhesive composition which has constitutive components consisting of thermoplastic resin such as ethylene-acrylate ester resin, tacky resin such as rosin ester derivative and waxes such as paraffin wax and/or plasticizer such as naphthene oil, and also contains modified resin components obtained by introducing into the molecular chains of these components a phosphoric acid group or, if desired, a carboxyl or its anhydride group, for example, by grafting 2-hydroxy-3-(meth)acryloxypropyl phosphate.By providing the composition, adhesion and seal of metals with difficulty adhesive plastics are improved and a non-slip processing method of face-oiled metal scaffolding boards can be accomplished.
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