公开(公告)号：US20050285240A1

公开(公告)日：2005-12-29

申请号：US11167169

申请日：2005-06-28

申请人： Eitaro Miyake ,  Yoshihiko Tojo ,  Osamu Usuda

发明人： Eitaro Miyake ,  Yoshihiko Tojo ,  Osamu Usuda

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L21/4842 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49537 ,  H01L23/49541 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device and manufacturing the semiconductor device are described. There is provided a method of manufacturing a semiconductor device including, disposing a lead frame inside an outer lead so as to couple between a coupling portion and a coupling acceptance portion, the lead frame including a chip mounting portion and the coupling acceptance portion, the outer lead including a frame portion with outer terminal portions and the coupling portion, disposing a semiconductor chip on the chip mounting portion, connecting between the outer terminal portions and the semiconductor chip with a plurality of wires or leads, sealing the outer terminal portion, the lead frame disposed the semiconductor chip on and the wires or the leads by a mold resin, cutting off the outer terminal portions from the outer lead, and uncoupling the coupling portion from the coupling acceptance portion.

摘要翻译： 描述半导体器件并制造半导体器件。 提供了一种制造半导体器件的方法，包括：将引线框架设置在外部引线内部以便耦合在耦合部分和耦合接受部分之间，引线框架包括芯片安装部分和耦合接合部分，外部 引线，其包括具有外部端子部分的框架部分和耦合部分，在芯片安装部分上设置半导体芯片，用多个导线或引线连接外部端子部分和半导体芯片之间，密封外部端子部分，引线 框架通过模制树脂将半导体芯片放置在导线或引线上，从外部引线切断外部端子部分，以及将耦合部分与联接接合部分分离。

公开(公告)号：US07332804B2

公开(公告)日：2008-02-19

申请号：US11167169

申请日：2005-06-28

申请人： Eitaro Miyake ,  Yoshihiko Tojo ,  Osamu Usuda

发明人： Eitaro Miyake ,  Yoshihiko Tojo ,  Osamu Usuda

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L21/4842 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49537 ,  H01L23/49541 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device and manufacturing the semiconductor device are described. There is provided a method of manufacturing a semiconductor device including, disposing a lead frame inside an outer lead so as to couple between a coupling portion and a coupling acceptance portion, the lead frame including a chip mounting portion and the coupling acceptance portion, the outer lead including a frame portion with outer terminal portions and the coupling portion, disposing a semiconductor chip on the chip mounting portion, connecting between the outer terminal portions and the semiconductor chip with a plurality of wires or leads, sealing the outer terminal portion, the lead frame disposed the semiconductor chip on and the wires or the leads by a mold resin, cutting off the outer terminal portions from the outer lead, and uncoupling the coupling portion from the coupling acceptance portion.

摘要翻译： 描述半导体器件并制造半导体器件。 提供了一种制造半导体器件的方法，包括：将引线框架设置在外部引线内部以便耦合在耦合部分和耦合接受部分之间，引线框架包括芯片安装部分和耦合接合部分，外部 引线，其包括具有外部端子部分的框架部分和耦合部分，在芯片安装部分上设置半导体芯片，用多个导线或引线连接外部端子部分和半导体芯片之间，密封外部端子部分，引线 框架通过模制树脂将半导体芯片放置在导线或引线上，从外部引线切断外部端子部分，以及将耦合部分与联接接合部分分离。