Transferred thin film transistor and method for manufacturing the same
    1.
    发明授权
    Transferred thin film transistor and method for manufacturing the same 有权
    转移薄膜晶体管及其制造方法

    公开(公告)号:US08653631B2

    公开(公告)日:2014-02-18

    申请号:US13775280

    申请日:2013-02-25

    CPC classification number: H01L27/1266 H01L27/1214 H01L27/1218 H01L29/78603

    Abstract: Provided are a transferred thin film transistor and a method of manufacturing the same. The method includes: forming a source region and a drain region that extend in a first direction in a first substrate and a channel region between the source region and the drain region; forming trenches that extend in a second direction in the first substrate to define an active layer between the trenches, the second direction intersecting the first direction; separating the active layer between the trenches from the first substrate by performing an anisotropic etching process on the first substrate inside the trenches; attaching the active layer on a second substrate; and forming a gate electrode in the first direction on the channel region of the active layer.

    Abstract translation: 提供了一种转移的薄膜晶体管及其制造方法。 该方法包括:形成在第一衬底中沿第一方向延伸的源极区域和漏极区域以及源极区域和漏极区域之间的沟道区域; 形成在所述第一衬底中沿第二方向延伸的沟槽,以在所述沟槽之间限定有源层,所述第二方向与所述第一方向相交; 通过在所述沟槽内的所述第一衬底上进行各向异性蚀刻工艺,从所述第一衬底分离所述沟槽之间的有源层; 将活性层附着在第二基底上; 以及在有源层的沟道区上沿第一方向形成栅电极。

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