Abstract:
The inventive concept relates to a thermal conductivity measuring device. The thermal conductivity measuring device may include a first structure which is connected to one side end of a sample and receives heat from a heat source; a second structure connected to the other side end of the sample; a first stage connected to the first structure while supporting the first structure; a second stage connected to the second structure while supporting the second structure; a connection unit connected between the first stage and the second stage; and a measuring unit measuring temperatures of the first and second structures and the first and second stages. Since the thermal conductivity measuring of the inventive concept correct a temperature change of a stage due to heat transmission emitted from the stage considering a measurement environment, reliability of measurement may be improved.
Abstract:
The inventive concept relates to a thermal conductivity measuring device and a method of measuring the thermal conductivity. The thermal conductivity measuring device may include a first structure which is connected to one side end of a sample and receives heat from a heat source; a second structure connected to the other side end of the sample; a first stage connected to the first structure while supporting the first structure; a second stage connected to the second structure while supporting the second structure; a connection unit connected between the first stage and the second stage; and a measuring unit measuring temperatures of the first and second structures and the first and second stages. Since the thermal conductivity measuring of the inventive concept correct a temperature change of a stage due to heat transmission emitted from the stage considering a measurement environment, reliability of measurement may be improved.
Abstract:
Provided are a thermoelectric device and a method of manufacturing the same. The thermoelectric device includes a substrate, a first electrode having a first comb shape connected to one side of the substrate and open to the other side of the substrate, a second electrode having a second comb shape connected to the other side of the substrate and open to the one side of the substrate and inserted into the first electrode, and first and second thermoelectric medium layers disposed between the first electrode and the second electrode and alternately disposed in a direction apart from the substrate.
Abstract:
Wireless power transfer devices are provided. The wireless power transfer device may include a plurality of stacked resonance structures, and adhesive layers between the resonance structures. Each of the resonance structures includes a base board including a base coil, interposer boards including interposer coils and stacked on the base board, and conductive pillars penetrating the base board and the interposer board. The conductive pillars connect the interposer boards to each other.