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1.发明申请公开(公告)号：US20170263409A1
公开(公告)日：2017-09-14
申请号：US15458785
申请日：2017-03-14
Applicant: Elwha LLC
Inventor： Andrew T. Koch , Andrew R. Lingley , Max N. Mankin , Tony S. Pan
Abstract: The present disclosure relates to methods of fabricating electronic devices or components thereof. The electronic devices can be vacuum electronic devices. The methods can include disposing a first material on or in a substrate. The methods can further include removing a portion of the first material to form one or more structure protruding from the substrate. The methods can further include disposing a second material onto the one or more structure of the first material, and then removing a portion of the second material to form one or more sidewall structures. A second portion of the one or more structures of the first material can also be removed to form a fabricated structure including the substrate and one or more sidewall structures protruding therefrom.
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2.发明授权公开(公告)号：US10483073B2
公开(公告)日：2019-11-19
申请号：US15458785
申请日：2017-03-14
Applicant: Elwha LLC
Inventor： Andrew T. Koch , Andrew R. Lingley , Max N. Mankin , Tony S. Pan
Abstract: The present disclosure relates to methods of fabricating electronic devices or components thereof. The electronic devices can be vacuum electronic devices. The methods can include disposing a first material on or in a substrate. The methods can further include removing a portion of the first material to form one or more structure protruding from the substrate. The methods can further include disposing a second material onto the one or more structure of the first material, and then removing a portion of the second material to form one or more sidewall structures. A second portion of the one or more structures of the first material can also be removed to form a fabricated structure including the substrate and one or more sidewall structures protruding therefrom.
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