Electronic device with input-output component mounting structures
    1.
    发明授权
    Electronic device with input-output component mounting structures 有权
    具有输入输出部件安装结构的电子设备

    公开(公告)号:US09538052B2

    公开(公告)日:2017-01-03

    申请号:US13558853

    申请日:2012-07-26

    IPC分类号: H04N5/225

    CPC分类号: H04N5/2252 H04N5/2256

    摘要: An electronic device may have a housing such as a metal housing. Openings may be formed in the housing to accommodate a button, to form a camera window, to form a microphone port, and to form a camera flash window. An input-output component mounting member may be used to mount input-output components to the housing of the electronic device. The input-output component mounting member may have a recess that mates with a corresponding protrusion on the housing. Screws may attach the input-output component mounting member to the housing. The protrusion and recess in the input-output component mounting member may ensure that the input-output component mounting member is accurately aligned with respect to the housing. Input-output components such as a microphone, button switch, camera, and camera flash may be mounted to the electronic device with the input-output component mounting member.

    摘要翻译: 电子设备可以具有诸如金属外壳的壳体。 可以在壳体中形成开口以容纳按钮,以形成相机窗口,以形成麦克风端口,并形成相机闪光窗。 输入输出部件安装部件可以用于将输入输出部件安装到电子设备的壳体。 输入输出部件安装部件可以具有与壳体上的相应突起配合的凹部。 螺钉可以将输入 - 输出部件安装部件附接到壳体。 输入输出部件安装部件中的突起和凹部可以确保输入 - 输出部件安装部件相对于壳体精确对准。 诸如麦克风,按钮开关,相机和相机闪光灯之类的输入输出组件可以通过输入 - 输出部件安装部件安装到电子设备。

    Electronic Device With Input-Output Component Mounting Structures
    2.
    发明申请
    Electronic Device With Input-Output Component Mounting Structures 有权
    具有输入输出元件安装结构的电子设备

    公开(公告)号:US20140028902A1

    公开(公告)日:2014-01-30

    申请号:US13558853

    申请日:2012-07-26

    IPC分类号: H04N5/225

    CPC分类号: H04N5/2252 H04N5/2256

    摘要: An electronic device may have a housing such as a metal housing. Openings may be formed in the housing to accommodate a button, to form a camera window, to form a microphone port, and to form a camera flash window. An input-output component mounting member may be used to mount input-output components to the housing of the electronic device. The input-output component mounting member may have a recess that mates with a corresponding protrusion on the housing. Screws may attach the input-output component mounting member to the housing. The protrusion and recess in the input-output component mounting member may ensure that the input-output component mounting member is accurately aligned with respect to the housing. Input-output components such as a microphone, button switch, camera, and camera flash may be mounted to the electronic device with the input-output component mounting member.

    摘要翻译: 电子设备可以具有诸如金属外壳的壳体。 可以在壳体中形成开口以容纳按钮,以形成相机窗口,以形成麦克风端口,并形成相机闪光窗。 输入输出部件安装部件可以用于将输入输出部件安装到电子设备的壳体。 输入输出部件安装部件可以具有与壳体上的相应突起配合的凹部。 螺钉可以将输入 - 输出部件安装部件附接到壳体。 输入输出部件安装部件中的突起和凹部可以确保输入 - 输出部件安装部件相对于壳体精确对准。 诸如麦克风,按钮开关,相机和相机闪光灯之类的输入输出组件可以通过输入 - 输出部件安装部件安装到电子设备。

    Structures for shielding and mounting components in electronic devices
    3.
    发明授权
    Structures for shielding and mounting components in electronic devices 有权
    用于电子设备中屏蔽和安装组件的结构

    公开(公告)号:US09059514B2

    公开(公告)日:2015-06-16

    申请号:US13524997

    申请日:2012-06-15

    IPC分类号: H01Q1/24 H01Q1/42 H01Q1/38

    摘要: An electronic device may be provided with a conductive housing. An antenna window structure may be formed in an opening in the housing. The antenna window structure may have an antenna support structure that is attached to the conductive housing and that supports antenna structures. An antenna window cap may be mounted in the opening and attached to the antenna support structure with liquid adhesive. Alignment structures may be provided in the antenna support structure. An antenna support plate with mating alignment structures may be used in attaching the antenna structures to the antenna support structures. Metal shielding structures may be used to provide electromagnetic shielding. A shielding wall may be formed from a sheet metal structure supported by a plastic support structure. A flexible metal shielding foil layer may be welded to the shielding wall using a sacrificial plate.

    摘要翻译: 电子设备可以设置有导电外壳。 天线窗口结构可以形成在壳体中的开口中。 天线窗口结构可以具有附接到导电壳体并且支撑天线结构的天线支撑结构。 天线窗口帽可以安装在开口中并且用液体粘合剂附接到天线支撑结构。 对准结构可以设置在天线支撑结构中。 具有匹配对准结构的天线支撑板可以用于将天线结构附接到天线支撑结构。 金属屏蔽结构可用于提供电磁屏蔽。 屏蔽壁可以由由塑料支撑结构支撑的金属板结构形成。 可以使用牺牲板将柔性金属屏蔽箔层焊接到屏蔽壁。

    Methods for assembling electronic devices using embedded light guide structures
    7.
    发明授权
    Methods for assembling electronic devices using embedded light guide structures 有权
    使用嵌入式导光结构组装电子设备的方法

    公开(公告)号:US08944659B2

    公开(公告)日:2015-02-03

    申请号:US13401692

    申请日:2012-02-21

    IPC分类号: F21V8/00

    摘要: Electronic devices may include assemblies of structures such as electronic device assemblies connected using light-cured liquid adhesive such as ultraviolet-light-cured adhesive. Light guide structures may be mounted in the assemblies. During manufacture of an electronic device, ultraviolet light may be injected into a light guide structure to cure the light-cured liquid adhesive. A light guide structure may include portions that prevent escape of ultraviolet light and portions that allow ultraviolet light to escape into the light-cured liquid adhesive. Light guide structures may include masked portions, rigid support members, and one or more openings. Openings in a light guide structure may allow the light-cured liquid adhesive to be injected into an assembly through the openings. An adhesive applicator may be used to apply the adhesive to portions of the assembly. An external light source may be used to inject light that cures the adhesive into the light guide structures.

    摘要翻译: 电子设备可以包括诸如使用诸如紫外光固化粘合剂的光固化液体粘合剂连接的电子设备组件的结构的组件。 导光结构可以安装在组件中。 在制造电子装置时,可以将紫外光注入导光结构中以固化光固化液体粘合剂。 光导结构可以包括防止紫外线逸出的部分和允许紫外线逸出到光固化液体粘合剂中的部分。 导光结构可以包括掩模部分,刚性支撑构件和一个或多个开口。 在导光结构中的开口可允许光固化的液体粘合剂通过开口注入到组件中。 可以使用粘合剂施加器将粘合剂施加到组件的部分。 外部光源可以用于将固化粘合剂的光注入光导结构中。

    VIBRATION IN PORTABLE DEVICES
    8.
    发明申请
    VIBRATION IN PORTABLE DEVICES 有权
    便携式设备中的振动

    公开(公告)号:US20120286943A1

    公开(公告)日:2012-11-15

    申请号:US13106491

    申请日:2011-05-12

    IPC分类号: G08B6/00

    CPC分类号: G08B6/00

    摘要: One embodiment may take the form of a method of reducing noise from vibration of a device on a hard surface. The method includes activating a haptic device to indicate an alert and sensing an audible level during activation of the haptic device. Additionally, the method includes determining if the audible level exceeds a threshold and initiating mitigation routines to reduce the audible level to a level below the threshold if the threshold is exceeded.

    摘要翻译: 一个实施例可以采取减少来自硬表面上的装置的振动的噪声的方法的形式。 该方法包括在触觉装置的激活期间激活触觉装置以指示警报并感测听觉水平。 另外,该方法包括:如果超过阈值,则确定可听水平是否超过阈值,并启动缓解程序以将可听水平降低到低于阈值的水平。

    Electromagnetic interference shields with piezos
    9.
    发明授权
    Electromagnetic interference shields with piezos 有权
    带电压的电磁干扰屏蔽

    公开(公告)号:US08126170B2

    公开(公告)日:2012-02-28

    申请号:US12236452

    申请日:2008-09-23

    IPC分类号: H04R25/00

    摘要: Methods and apparatus for improving the acoustical performance associated with a speaker, such as a piezoelectric speaker, are disclosed. According to one aspect, an apparatus includes a substrate, a can mounted on the substrate, and a piezoelectric speaker arrangement. The piezoelectric speaker arrangement is at least partially mounted on the can. In one embodiment, the substrate is a printed circuit board (PCB) and the can is an electromagnetic interference (EMI) shielding can.

    摘要翻译: 公开了用于提高与诸如压电扬声器的扬声器相关联的声学性能的方法和装置。 根据一个方面,一种装置包括基板,安装在基板上的壳体和压电扬声器装置。 压电扬声器装置至少部分地安装在罐上。 在一个实施例中,衬底是印刷电路板(PCB),并且罐是电磁干扰(EMI)屏蔽罐。