SELEGILINE-CONTAINING ADHESIVE PREPARATION
    2.
    发明申请
    SELEGILINE-CONTAINING ADHESIVE PREPARATION 审中-公开
    含SEIGILINE的粘合剂制剂

    公开(公告)号:US20110223235A1

    公开(公告)日:2011-09-15

    申请号:US13045591

    申请日:2011-03-11

    IPC分类号: A61K9/70 A61K31/135 A61P25/16

    摘要: The present invention provides an adhesive preparation, which includes a backing and a pressure-sensitive adhesive layer formed on at least one side of the backing, the pressure-sensitive adhesive layer containing (−)-(R)—N,α-dimethyl-N-2-propynylphenethylamine and/or a pharmaceutically acceptable salt thereof, a pressure-sensitive adhesive and one or two or more stabilizers selected from the group consisting of 2-mercaptobenzimidazole, sodium sulfite, butylhydroxyanisole and butylhydroxytoluene.

    摘要翻译: 本发明提供一种粘合剂制剂,其包括背衬和形成在背衬的至少一侧上的压敏粘合剂层,该压敏粘合剂层含有( - ) - (R)-N,α-二甲基 - N-2-丙炔基苯乙胺和/或其药学上可接受的盐,压敏粘合剂和选自2-巯基苯并咪唑,亚硫酸钠,丁基羟基苯甲醚和丁基羟基甲苯中的一种或两种或更多种稳定剂。