公开(公告)号：US20070107201A1

公开(公告)日：2007-05-17

申请号：US11268442

申请日：2005-11-07

Applicant: Eric Erike

Inventor： Eric Erike

IPC: B23P11/00

CPC classification number: B21C23/20 ,  B21K21/08 ,  B60R2021/26082 ,  B60R2021/2642 ,  Y10T29/49622 ,  Y10T29/49968

Abstract: A method of forming a dual chamber seamless tube (64) includes providing a slug of steel (56) and cold working a first end (70) of the slug (56) to form a first chamber (114) and cold working a second end (72) of the slug (56) to form a second chamber (116). The first and second chambers (114 and 116) are axially aligned and separated by a wall portion (126) of the tube (64).

Abstract translation: 一种形成双室无缝管（64）的方法包括：提供钢芯（56）并对其进行冷加工，以形成第一腔室（114）并冷却第二端 （56）的第二腔（72）以形成第二腔室（116）。 第一和第二腔室（114和116）由管子（64）的壁部分（126）轴向对齐并分开。

公开(公告)号：US20240179832A1

公开(公告)日：2024-05-30

申请号：US18435821

申请日：2024-02-07

Applicant: Phil Geng ,  Xiaoning Ye ,  Yipeng Zhong ,  Meng Wang ,  Hongfei Yan ,  Chuansheng Liu ,  Lejie Liu ,  Mohanraj Prabhugoud ,  Fernando Gonzalez Lenero ,  Dongwang Chen ,  Sanjoy Saha ,  Ralph Miele ,  Baris Bicen ,  David Shia ,  Jeffory Smalley ,  Eric Erike

Inventor： Phil Geng ,  Xiaoning Ye ,  Yipeng Zhong ,  Meng Wang ,  Hongfei Yan ,  Chuansheng Liu ,  Lejie Liu ,  Mohanraj Prabhugoud ,  Fernando Gonzalez Lenero ,  Dongwang Chen ,  Sanjoy Saha ,  Ralph Miele ,  Baris Bicen ,  David Shia ,  Jeffory Smalley ,  Eric Erike

IPC: H05K1/02

CPC classification number: H05K1/0263 ,  H05K2201/10189 ,  H05K2201/2009

Abstract: A multi-entry socket power delivery structure is attachable to a printed circuit board to provide improved delivery of one or more power supply signals to a socket. The power delivery structure provides an additional path for power supply signals to be delivered to a socket (in addition to the “power corridor” of the printed circuit board). The power delivery structure comprises one or more portions, with individual portions comprising a printed circuit board connection portion that attaches to the printed circuit board to receive a power supply signal generated by a voltage regulator, and a socket connection portion that attaches to the printed circuit board to deliver the power supply signal to the socket via the printed circuit board. The power delivery structure can be located in the recess of a reinforced backplate that provides structural integrity to a processor stack and associated thermal management solution loading mechanism.

公开(公告)号：US20050061404A1

公开(公告)日：2005-03-24

申请号：US10982517

申请日：2004-11-05

Applicant: Eric Erike

Inventor： Eric Erike

IPC: B60R21/26 ,  B60R21/264 ,  C21D8/10 ,  C21D9/08 ,  C22C38/04 ,  C22C38/18 ,  F17C1/00 ,  F17C1/16

CPC classification number: F17C1/00 ,  B60R21/264 ,  C21D8/10 ,  C21D9/08 ,  C22C38/04 ,  C22C38/18 ,  F17C1/16 ,  F17C2201/0104 ,  F17C2201/0119 ,  F17C2201/0138 ,  F17C2201/058 ,  F17C2203/0617 ,  F17C2203/0639 ,  F17C2203/0648 ,  F17C2205/0314 ,  F17C2209/221 ,  F17C2209/222 ,  F17C2209/23 ,  F17C2221/011 ,  F17C2221/014 ,  F17C2221/016 ,  F17C2221/017 ,  F17C2221/03 ,  F17C2221/033 ,  F17C2223/0123 ,  F17C2223/036 ,  F17C2225/0123 ,  F17C2225/036 ,  F17C2227/0332 ,  F17C2250/03 ,  F17C2260/011 ,  F17C2260/032 ,  F17C2260/053 ,  F17C2270/0772

Abstract: An apparatus includes a low-carbon steel member. The low-carbon steel member yields plastically more than about 5% before fracturing at temperatures down to about −40° C. when stress is applied to the low-carbon steel member sufficient to cause the low-carbon steel member to so yield.

Abstract translation: 一种装置包括低碳钢构件。 当低碳钢构件施加足以导致低碳钢构件屈服的应力时，低温钢构件在低于约-40℃的温度下压裂之前，塑性地大于约5％。